类别是'category.片上系统(SoC)' (7695)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 供应商器件包装 | Core | 厂商 | 操作温度 | 包装 | 系列 | 类型 | 应用 | 电压 - 供电 | 频率 | 工作频率 | 工作电源电压 | 界面 | 内存大小 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序存储器类型 | 程序内存大小 | 连接方式 | 输出功率 | 建筑学 | 数据总线宽度 | 工作温度范围 | 议定书 | 功率 - 输出 | 无线电频率系列/标准 | 收发器数量 | 敏感度 | 数据率(最大) | ADC通道数量 | 主要属性 | 串行接口 | 接收电流 | 传输电流 | 调制 | 核数量 | [医]GPIO | 闪光大小 | 控制器系列 | ADC Resolution | 设备核心 | ||||||||||||||||||||||||||||
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![]() | MPFS250TLS-FCVG784I | Microchip Technology | 数据表 | 2313 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-784 | 784-FCBGA (23x23) | RV64GC, RV64IMAC | 微芯片技术 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 254000 LE | 372 I/O | - 40 C | + 100 C | 1 | Tray | 活跃 | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095TS-FCSG325I | Microchip Technology | 数据表 | 2740 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-325 | 325-LFBGA (11x14.5) | RV64GC, RV64IMAC | 微芯片技术 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 93000 LE | 276 I/O | - 40 C | + 100 C | 1 | Bulk | 活跃 | -40°C ~ 100°C | Tray | - | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095T-1FCVG484I | Microchip Technology | 数据表 | 2375 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | 微芯片技术 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 93000 LE | 276 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | -40°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095TL-FCSG536E | Microchip Technology | 数据表 | 2659 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-536 | 536-LFBGA | RV64GC, RV64IMAC | 微芯片技术 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 93000 LE | 276 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | 0°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU42DR-1FFVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-1156 | 1156-FCBGA (35x35) | ARM Cortex A53, ARM Cortex R5F | AMD 赛灵思 | SMD/SMT | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 489300 LE | 396 I/O | - 40 C | + 100 C | 6.8 Mb | 27960 LAB | 1 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 850 mV | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 8 Transceiver | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | 6 Core | - | |||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU49DR-1FSVF1760E5149 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-1760 | ARM Cortex A53, ARM Cortex R5F | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 930300 LE | 674 I/O | 0 C | + 100 C | 13 Mb | 53160 LAB | 1 | SMD/SMT | 850 mV | 16 Transceiver | 6 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250T-1FCVG484I | Microchip Technology | 数据表 | 2215 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCVG-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | 微芯片技术 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 254000 LE | 372 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250TL-FCVG784I | Microchip Technology | 数据表 | 2648 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-784 | 784-FCBGA (23x23) | RV64GC, RV64IMAC | 微芯片技术 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 254000 LE | 372 I/O | - 40 C | + 100 C | 1 | Tray | 活跃 | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095TL-FCVG784E | Microchip Technology | 数据表 | 2944 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-784 | 784-BGA | RV64GC, RV64IMAC | 微芯片技术 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 1 | + 100 C | 0 C | 276 I/O | 93000 LE | - | 4 x 32 kB | 16 kB, 4 x 32 kB | Tray | 活跃 | 0°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250TL-FCSG536E | Microchip Technology | 数据表 | 2050 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-536 | 536-LFBGA | RV64GC, RV64IMAC | 微芯片技术 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 254000 LE | 372 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | 0°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095T-1FCVG784I | Microchip Technology | 数据表 | 2730 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-784 | 784-BGA | RV64GC, RV64IMAC | 微芯片技术 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 93000 LE | 276 I/O | 0 C | + 100 C | 1 | Tray | 活跃 | -40°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250T-1FCVG484E | Atmel (Microchip Technology) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FCVG-484 | RV64GC, RV64IMAC | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 254000 LE | 372 I/O | 0 C | + 100 C | 1 | This product may require additional documentation to export from the United States. | Tray | 1 V | - | 5 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU9CG-2FFVC900I4998 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-900 | ARM Cortex A53, ARM Cortex R5F | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 256 kB | 599550 LE | 220 I/O | - 40 C | + 100 C | 8.8 Mb | 34260 LAB | 1 | SMD/SMT | 850 mV | 24 Transceiver | 4 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS095TS-FCVG784I | Microchip Technology | 数据表 | 2331 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-784 | 784-BGA | RV64GC, RV64IMAC | 微芯片技术 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 93000 LE | 276 I/O | - 40 C | + 100 C | 1 | Tray | 活跃 | -40°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250TL-FCSG536I | Microchip Technology | 数据表 | 2836 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-536 | 536-LFBGA | RV64GC, RV64IMAC | 微芯片技术 | This product may require additional documentation to export from the United States. | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 4 x 32 kB | - | 254000 LE | 372 I/O | - 40 C | + 100 C | 1 | Tray | 活跃 | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250T-1FCSG536E | Atmel (Microchip Technology) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FCSG-536 | RV64GC, RV64IMAC | SMD/SMT | 667 MHz, 667 MHz | 16 kB, 4 x 32 kB | 1 | + 100 C | 0 C | 372 I/O | 254000 LE | - | 4 x 32 kB | This product may require additional documentation to export from the United States. | Tray | 1 V | - | 5 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-2LLEVSVA2197 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD 赛灵思 | 0 C | + 110 C | 1 | 770 | Tray | 活跃 | Details | 0°C ~ 100°C (TJ) | Versal™ AI Core | 700 mV | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-2MLIVSVD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD 赛灵思 | - 40 C | + 110 C | 1 | 692 | Tray | 活跃 | Details | -40°C ~ 100°C (TJ) | Versal™ AI Core | 800 mV | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU5EG-L1SFVC784I4765 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FCBGA-784 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 5.1 Mbit | 14640 LAB | 1 | Zynq UltraScale+ | This product may require additional documentation to export from the United States. | SMD/SMT | 600 MHz, 667 MHz, 1.5 GHz | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | - | 256200 LE | 252 I/O | - 40 C | + 100 C | 3.5 Mbit | XCZU5EG | 720 mV/850 mV | - | 4 Transceiver | 7 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8CLED01D01-56LTXQ | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | QFN-56 | 56-QFN (8x8) | M8C | Infineon Technologies | 24 MHz | 1 kB | 10 I/O | - 40 C | + 105 C | 有 | 260 | PowerPSoC | 0.006751 oz | Tray | Obsolete | Details | SMD/SMT | -40°C ~ 105°C | Tray | CY8CLED01D01 | 智能LED驱动器 | 4.75V ~ 5.25V | 4.75 V to 5.25 V | DALI, DMX512, I²C, IrDA, SPI, UART/USART | 1K x 8 | M8C | FLASH (16KB) | 16 kB | 8 bit | CY8CLED | 在ADC中 | |||||||||||||||||||||||||||||||||||||||||||
![]() | CYBL10462-56LQXI | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | QFN-56 | 56-QFN (7x7) | ARM Cortex M0 | Infineon Technologies | Details | 1 Mbps | 1.9 V | 16.4 mA | 15.6 mA | - 40 C | + 85 C | 有 | SMD/SMT | 260 | 0.006751 oz | Tray | Obsolete | 5.5 V | -40°C ~ 105°C | Tray | CYBL10462 | Bluetooth | 1.8V ~ 5.5V | 2.4GHz | 2.4 GHz | I2C/I2S/SPI/UART | 128kB Flash, 8kB ROM, 16kB SRAM | 128 kB | 3 dBm | 32 Bit | Bluetooth v4.1 | 3dBm | Bluetooth | - 89 dBm | 1Mbps | I²C, I²S, SPI, UART | 16.4mA ~ 21.5mA | 12.5mA ~ 20mA | GFSK | 36 | ARM Cortex M0 | |||||||||||||||||||||||||||||||||
![]() | CYW54591RKUBGT | Infineon Technologies | 数据表 | 5249 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | WLBGA-194 | 194-WLBGA (5.16x7.7) | ARM Cortex M4, ARM Cortex R4 | Infineon Technologies | - | - 40 C | + 85 C | SMD/SMT | 5000 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 活跃 | 1.26 V | Details | 867 Mbps | 1.14 V | - | -20°C ~ 70°C (TA) | MouseReel | - | Bluetooth, Wi-Fi | 3V ~ 4.8V | 2.4GHz, 5GHz | 2.4 GHz, 5 GHz | 896kB RAM, 896kB ROM | - | 13 dBm | 802.11a/b/g/-c, Bluetooth v5.0 | 21dBm | Bluetooth, WiFi | - 98.5 dBm | 433.3Mbps | I²S, PCM, UART, USB | - | - | 16QAM, 64QAM, 256QAM, BPSK, CCK, DSSS, GFSK, OFDM | |||||||||||||||||||||||||||||||||||||||
![]() | CYW20835PB1KML1G | Infineon Technologies | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 60-VFQFN Exposed Pad | 60-QFN (7x7) | ARM Cortex M4 | Infineon Technologies | + 70 C | 2600 | Tray | Discontinued at Digi-Key | 3.63 V | Details | 6 Mbps | 1.7 V | 8 mA | 18 mA | 0 C | 0°C ~ 70°C | Tray | AIROC™ Bluetooth | Bluetooth | 1.62V ~ 3.63V | 2.4GHz | 2.4 GHz | 384kB RAM, 2MB ROM | 2 MB | 12 dBm | Bluetooth v5.2 | 12dBm | Bluetooth | - 94.5 dBm | 2Mbps | ADC, I²C, PWM, SPI, UART | 8mA | 18mA | GFSK | 24 | |||||||||||||||||||||||||||||||||||||||
![]() | PIC32CX1025SG41100T-I/E5X | Microchip Technology | 数据表 | 662 In Stock |
- | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 微芯片技术 | 81 I/O | 3.63 V | 1.71 V | Details | - 40 C | + 85 C | CAN, Ethernet, USB | SMD/SMT | 90 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 活跃 | EV06X38A | 120 MHz | PIC32CX | Reel | - | 1.71 V to 3.63 V | Flash | 1 MB | - 40 C to + 85 C | 32 Channel | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PIC32CX1025SG41100T-E/E5X | Microchip Technology | 数据表 | 1014 In Stock |
- | 最小起订量: 1 最小包装量: 1 | TQFP-100 | 微芯片技术 | 81 I/O | 3.63 V | 1.71 V | Details | - 40 C | + 125 C | CAN, Ethernet, USB | SMD/SMT | 90 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 活跃 | EV06X38A | 120 MHz | PIC32CX | Reel | - | 1.71 V to 3.63 V | Flash | 1 MB | - 40 C to + 125 C | 32 Channel |
MPFS250TLS-FCVG784I
Microchip Technology
分类:Embedded - System On Chip (SoC)
3,133.620197
MPFS095TS-FCSG325I
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,827.512528
MPFS095T-1FCVG484I
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,538.391651
MPFS095TL-FCSG536E
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,259.271031
XCZU42DR-1FFVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU49DR-1FSVF1760E5149
Xilinx
分类:Embedded - System On Chip (SoC)
MPFS250T-1FCVG484I
Microchip Technology
分类:Embedded - System On Chip (SoC)
3,131.838241
MPFS250TL-FCVG784I
Microchip Technology
分类:Embedded - System On Chip (SoC)
3,560.208118
MPFS095TL-FCVG784E
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,569.945858
MPFS250TL-FCSG536E
Microchip Technology
分类:Embedded - System On Chip (SoC)
2,756.406618
MPFS095T-1FCVG784I
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,569.945858
MPFS250T-1FCVG484E
Atmel (Microchip Technology)
分类:Embedded - System On Chip (SoC)
XCZU9CG-2FFVC900I4998
Xilinx
分类:Embedded - System On Chip (SoC)
MPFS095TS-FCVG784I
Microchip Technology
分类:Embedded - System On Chip (SoC)
1,700.893756
MPFS250TL-FCSG536I
Microchip Technology
分类:Embedded - System On Chip (SoC)
2,658.564281
MPFS250T-1FCSG536E
Atmel (Microchip Technology)
分类:Embedded - System On Chip (SoC)
XCVC1902-2LLEVSVA2197
Xilinx
分类:Embedded - System On Chip (SoC)
XCVC1902-2MLIVSVD1760
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU5EG-L1SFVC784I4765
Xilinx
分类:Embedded - System On Chip (SoC)
CY8CLED01D01-56LTXQ
Infineon Technologies
分类:Embedded - System On Chip (SoC)
CYBL10462-56LQXI
Infineon Technologies
分类:Embedded - System On Chip (SoC)
CYW54591RKUBGT
Infineon Technologies
分类:Embedded - System On Chip (SoC)
CYW20835PB1KML1G
Infineon Technologies
分类:Embedded - System On Chip (SoC)
PIC32CX1025SG41100T-I/E5X
Microchip Technology
分类:Embedded - System On Chip (SoC)
19.880109
PIC32CX1025SG41100T-E/E5X
Microchip Technology
分类:Embedded - System On Chip (SoC)
28.690817
