类别是'category.片上系统(SoC)' (7695)

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设备核心

MPFS250TLS-FCVG784I
MPFS250TLS-FCVG784I
Microchip Technology 数据表

2313 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-784

784-FCBGA (23x23)

RV64GC, RV64IMAC

微芯片技术

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

- 40 C

+ 100 C

1

Tray

活跃

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

MPFS095TS-FCSG325I
MPFS095TS-FCSG325I
Microchip Technology 数据表

2740 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-325

325-LFBGA (11x14.5)

RV64GC, RV64IMAC

微芯片技术

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

- 40 C

+ 100 C

1

Bulk

活跃

-40°C ~ 100°C

Tray

-

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128KB

MPFS095T-1FCVG484I
MPFS095T-1FCVG484I
Microchip Technology 数据表

2375 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-484

484-FCBGA (19x19)

RV64GC, RV64IMAC

微芯片技术

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

0 C

+ 100 C

1

Tray

活跃

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

MPFS095TL-FCSG536E
MPFS095TL-FCSG536E
Microchip Technology 数据表

2659 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-536

536-LFBGA

RV64GC, RV64IMAC

微芯片技术

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

0 C

+ 100 C

1

Tray

活跃

0°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

XCZU42DR-1FFVE1156I
XCZU42DR-1FFVE1156I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-1156

1156-FCBGA (35x35)

ARM Cortex A53, ARM Cortex R5F

AMD 赛灵思

SMD/SMT

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

256 kB

489300 LE

396 I/O

- 40 C

+ 100 C

6.8 Mb

27960 LAB

1

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

850 mV

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

8 Transceiver

Zynq®UltraScale+™ FPGA, 489K+ Logic Cells

6 Core

-

XCZU49DR-1FSVF1760E5149
XCZU49DR-1FSVF1760E5149
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-1760

ARM Cortex A53, ARM Cortex R5F

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

256 kB

930300 LE

674 I/O

0 C

+ 100 C

13 Mb

53160 LAB

1

SMD/SMT

850 mV

16 Transceiver

6 Core

MPFS250T-1FCVG484I
MPFS250T-1FCVG484I
Microchip Technology 数据表

2215 In Stock

-

最小起订量: 1

最小包装量: 1

FCVG-484

484-FCBGA (19x19)

RV64GC, RV64IMAC

微芯片技术

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

0 C

+ 100 C

1

Tray

活跃

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

MPFS250TL-FCVG784I
MPFS250TL-FCVG784I
Microchip Technology 数据表

2648 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-784

784-FCBGA (23x23)

RV64GC, RV64IMAC

微芯片技术

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

- 40 C

+ 100 C

1

Tray

活跃

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

MPFS095TL-FCVG784E
MPFS095TL-FCVG784E
Microchip Technology 数据表

2944 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-784

784-BGA

RV64GC, RV64IMAC

微芯片技术

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

1

+ 100 C

0 C

276 I/O

93000 LE

-

4 x 32 kB

16 kB, 4 x 32 kB

Tray

活跃

0°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

MPFS250TL-FCSG536E
MPFS250TL-FCSG536E
Microchip Technology 数据表

2050 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-536

536-LFBGA

RV64GC, RV64IMAC

微芯片技术

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

0 C

+ 100 C

1

Tray

活跃

0°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

MPFS095T-1FCVG784I
MPFS095T-1FCVG784I
Microchip Technology 数据表

2730 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-784

784-BGA

RV64GC, RV64IMAC

微芯片技术

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

0 C

+ 100 C

1

Tray

活跃

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

MPFS250T-1FCVG484E
MPFS250T-1FCVG484E
Atmel (Microchip Technology) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FCVG-484

RV64GC, RV64IMAC

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

0 C

+ 100 C

1

This product may require additional documentation to export from the United States.

Tray

1 V

-

5 Core

XCZU9CG-2FFVC900I4998
XCZU9CG-2FFVC900I4998
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FBGA-900

ARM Cortex A53, ARM Cortex R5F

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

256 kB

599550 LE

220 I/O

- 40 C

+ 100 C

8.8 Mb

34260 LAB

1

SMD/SMT

850 mV

24 Transceiver

4 Core

MPFS095TS-FCVG784I
MPFS095TS-FCVG784I
Microchip Technology 数据表

2331 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-784

784-BGA

RV64GC, RV64IMAC

微芯片技术

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

93000 LE

276 I/O

- 40 C

+ 100 C

1

Tray

活跃

-40°C ~ 100°C

Tray

PolarFire®

1 V

-

857.6kB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 93K Logic Modules

5 Core

128kB

MPFS250TL-FCSG536I
MPFS250TL-FCSG536I
Microchip Technology 数据表

2836 In Stock

-

最小起订量: 1

最小包装量: 1

BGA-536

536-LFBGA

RV64GC, RV64IMAC

微芯片技术

This product may require additional documentation to export from the United States.

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

4 x 32 kB

-

254000 LE

372 I/O

- 40 C

+ 100 C

1

Tray

活跃

-40°C ~ 100°C

Tray

PolarFire™

1 V

-

2.2MB

RISC-V

DMA, PCI, PWM

-

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

5 Core

128kB

MPFS250T-1FCSG536E
MPFS250T-1FCSG536E
Atmel (Microchip Technology) 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FCSG-536

RV64GC, RV64IMAC

SMD/SMT

667 MHz, 667 MHz

16 kB, 4 x 32 kB

1

+ 100 C

0 C

372 I/O

254000 LE

-

4 x 32 kB

This product may require additional documentation to export from the United States.

Tray

1 V

-

5 Core

XCVC1902-2LLEVSVA2197
XCVC1902-2LLEVSVA2197
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD 赛灵思

0 C

+ 110 C

1

770

Tray

活跃

Details

0°C ~ 100°C (TJ)

Versal™ AI Core

700 mV

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XCVC1902-2MLIVSVD1760
XCVC1902-2MLIVSVD1760
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD 赛灵思

- 40 C

+ 110 C

1

692

Tray

活跃

Details

-40°C ~ 100°C (TJ)

Versal™ AI Core

800 mV

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XCZU5EG-L1SFVC784I4765
XCZU5EG-L1SFVC784I4765
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

FCBGA-784

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

5.1 Mbit

14640 LAB

1

Zynq UltraScale+

This product may require additional documentation to export from the United States.

SMD/SMT

600 MHz, 667 MHz, 1.5 GHz

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

-

256200 LE

252 I/O

- 40 C

+ 100 C

3.5 Mbit

XCZU5EG

720 mV/850 mV

-

4 Transceiver

7 Core

CY8CLED01D01-56LTXQ
CY8CLED01D01-56LTXQ
Infineon Technologies 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

QFN-56

56-QFN (8x8)

M8C

Infineon Technologies

24 MHz

1 kB

10 I/O

- 40 C

+ 105 C

260

PowerPSoC

0.006751 oz

Tray

Obsolete

Details

SMD/SMT

-40°C ~ 105°C

Tray

CY8CLED01D01

智能LED驱动器

4.75V ~ 5.25V

4.75 V to 5.25 V

DALI, DMX512, I²C, IrDA, SPI, UART/USART

1K x 8

M8C

FLASH (16KB)

16 kB

8 bit

CY8CLED

在ADC中

CYBL10462-56LQXI
CYBL10462-56LQXI
Infineon Technologies 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

QFN-56

56-QFN (7x7)

ARM Cortex M0

Infineon Technologies

Details

1 Mbps

1.9 V

16.4 mA

15.6 mA

- 40 C

+ 85 C

SMD/SMT

260

0.006751 oz

Tray

Obsolete

5.5 V

-40°C ~ 105°C

Tray

CYBL10462

Bluetooth

1.8V ~ 5.5V

2.4GHz

2.4 GHz

I2C/I2S/SPI/UART

128kB Flash, 8kB ROM, 16kB SRAM

128 kB

3 dBm

32 Bit

Bluetooth v4.1

3dBm

Bluetooth

- 89 dBm

1Mbps

I²C, I²S, SPI, UART

16.4mA ~ 21.5mA

12.5mA ~ 20mA

GFSK

36

ARM Cortex M0

CYW54591RKUBGT
CYW54591RKUBGT
Infineon Technologies 数据表

5249 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

WLBGA-194

194-WLBGA (5.16x7.7)

ARM Cortex M4, ARM Cortex R4

Infineon Technologies

-

- 40 C

+ 85 C

SMD/SMT

5000

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

1.26 V

Details

867 Mbps

1.14 V

-

-20°C ~ 70°C (TA)

MouseReel

-

Bluetooth, Wi-Fi

3V ~ 4.8V

2.4GHz, 5GHz

2.4 GHz, 5 GHz

896kB RAM, 896kB ROM

-

13 dBm

802.11a/b/g/-c, Bluetooth v5.0

21dBm

Bluetooth, WiFi

- 98.5 dBm

433.3Mbps

I²S, PCM, UART, USB

-

-

16QAM, 64QAM, 256QAM, BPSK, CCK, DSSS, GFSK, OFDM

CYW20835PB1KML1G
CYW20835PB1KML1G
Infineon Technologies 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

60-VFQFN Exposed Pad

60-QFN (7x7)

ARM Cortex M4

Infineon Technologies

+ 70 C

2600

Tray

Discontinued at Digi-Key

3.63 V

Details

6 Mbps

1.7 V

8 mA

18 mA

0 C

0°C ~ 70°C

Tray

AIROC™ Bluetooth

Bluetooth

1.62V ~ 3.63V

2.4GHz

2.4 GHz

384kB RAM, 2MB ROM

2 MB

12 dBm

Bluetooth v5.2

12dBm

Bluetooth

- 94.5 dBm

2Mbps

ADC, I²C, PWM, SPI, UART

8mA

18mA

GFSK

24

PIC32CX1025SG41100T-I/E5X
PIC32CX1025SG41100T-I/E5X
Microchip Technology 数据表

662 In Stock

-

最小起订量: 1

最小包装量: 1

TQFP-100

微芯片技术

81 I/O

3.63 V

1.71 V

Details

- 40 C

+ 85 C

CAN, Ethernet, USB

SMD/SMT

90

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

EV06X38A

120 MHz

PIC32CX

Reel

-

1.71 V to 3.63 V

Flash

1 MB

- 40 C to + 85 C

32 Channel

PIC32CX1025SG41100T-E/E5X
PIC32CX1025SG41100T-E/E5X
Microchip Technology 数据表

1014 In Stock

-

最小起订量: 1

最小包装量: 1

TQFP-100

微芯片技术

81 I/O

3.63 V

1.71 V

Details

- 40 C

+ 125 C

CAN, Ethernet, USB

SMD/SMT

90

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

EV06X38A

120 MHz

PIC32CX

Reel

-

1.71 V to 3.63 V

Flash

1 MB

- 40 C to + 125 C

32 Channel