3 In Stock

-

表面贴装

表面贴装

84-LCC (J-Lead)

84

74

0°C~85°C TJ

Tray

1995

XC3000

e0

Obsolete

3 (168 Hours)

84

Tin/Lead (Sn85Pb15)

4.75V~5.25V

QUAD

J BEND

5V

1.27mm

XC3042

84

74

5V

5V

3.8kB

现场可编程门阵列

28848

30784

3000

144

100

480

7 ns

144

144

2000

5.08mm

29.3116mm

29.3116mm

无

Non-RoHS Compliant

含铅

950 In Stock

-

8 Weeks

表面贴装

表面贴装

121-VFBGA

121

100

0°C~85°C TJ

Tray

2015

MachXO3

e1

活跃

3 (168 Hours)

121

EAR99

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.14V~1.26V

BOTTOM

BALL

未说明

1.2V

0.5mm

未说明

11.5kB

现场可编程门阵列

4320

94208

540

540

1mm

6mm

6mm

ROHS3 Compliant

N/A

-

表面贴装

484-BBGA

484-FBGA (23x23)

376

0°C~85°C TJ

Tray

APEX-20KC®

Obsolete

3 (168 Hours)

1.71V~1.89V

EP20K200

8320

106496

526000

832

7 In Stock

-

表面贴装

表面贴装

680-LBGA Exposed Pad

512

0°C~85°C TJ

Tray

1999

Virtex®-E

e0

no

Obsolete

3 (168 Hours)

680

3A991.D

Tin/Lead (Sn63Pb37)

1.71V~1.89V

BOTTOM

BALL

225

1.8V

1mm

30

XCV1000E

680

512

1.8V

48kB

416MHz

512

现场可编程门阵列

27648

393216

1569178

6144

8

0.4 ns

331776

1.9mm

40mm

40mm

无

Non-RoHS Compliant

含铅

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

FPBGA-676

676

676-FBGA (27x27)

微芯片技术

1.2 V

Tray

M2GL090

活跃

This product may require additional documentation to export from the United States.

Details

86184 LE

425 I/O

1.2 V

0 C

+ 85 C

SMD/SMT

有

40

IGLOO2

1.2000 V

1.14 V

1.26 V

0 to 85 °C

Tray

M2GL090T

85 °C

0 °C

1.14V ~ 2.625V

1.2 V

323.3 kB

86316

2648064

1

4 Transceiver

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

YES

896

896-FBGA (31x31)

400.011771 mg

896

586 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

870 MHz

微芯片技术

有

27

Actel

0.014110 oz

1.575 V

8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000

Tray

AX2000

活跃

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.5 V

30

85 °C

无

AX2000-2FG896I

870 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.26

This product may require additional documentation to export from the United States.

N

-40°C ~ 85°C (TA)

Tray

AX2000

e0

锡铅

85 °C

-40 °C

2000000 SYSTEM GATES AVAILABLE

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

unknown

870 MHz

S-PBGA-B896

684

不合格

1.5 V

1.5,1.5/3.3,2.5/3.3 V

INDUSTRIAL

1.575 V

1.425 V

36 kB

740 ps

740 ps

684

21504 CLBS, 2000000 GATES

2.44 mm

现场可编程门阵列

21504

294912

2000000

870 MHz

32256

21504

2

21504

0.74 ns

21504

32256

2000000

1.73 mm

31 mm

31 mm

无

N/A

-

表面贴装

VFPBGA-256

YES

256-FPBGA (14x14)

256

- 40 C

+ 100 C

SMD/SMT

微芯片技术

有

119

IGLOO2

1.2 V

Tray

活跃

M2GL010

14 X 14 MM, 0.80 MM PITCH, VFBGA-256

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

1.2 V

20

无

M2GL010TS-1VF256I

LFBGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

12084 LE

138 I/O

1.2 V

-40°C ~ 100°C (TJ)

Tray

M2GL010TS

8542.39.00.01

1.14V ~ 2.625V

BOTTOM

BALL

240

0.8 mm

compliant

S-PBGA-B256

1.2 V

1.56 mm

现场可编程门阵列

12084

933888

2 Transceiver

14 mm

14 mm

N/A

-

表面贴装

TQFP-100

YES

100-TQFP (14x14)

100

81 I/O

2.25 V

0 C

+ 70 C

SMD/SMT

278 MHz

有

微芯片技术

90

Actel

0.023175 oz

2.75 V

Tray

A54SX08

活跃

LFQFP, QFP100,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP100,.63SQ,20

2.5 V

40

70 °C

有

A54SX08A-1TQG100

278 MHz

LFQFP

SQUARE

活跃

MICROSEMI CORP

5.24

Details

0°C ~ 70°C (TA)

Tray

A54SX08A

e3

Matte Tin (Sn)

8000 TYPICAL GATES AVAILABLE

8542.39.00.01

CMOS

2.25V ~ 5.25V

QUAD

鸥翼

260

0.5 mm

compliant

S-PQFP-G100

127

不合格

2.5 V

2.5,3.3/5 V

COMMERCIAL

127

768 CLBS, 12000 GATES

1.6 mm

现场可编程门阵列

12000

768

1.1 ns

768

768

12000

1.4 mm

14 mm

14 mm

N/A

-

表面贴装

FBGA

YES

676-FBGA (27x27)

676

This product may require additional documentation to export from the United States.

Details

444 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

272 MHz

微芯片技术

有

40

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

1.575 V

Tray

M1A3PE1500

活跃

BGA, BGA676,26X26,40

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

-40 °C

1.5 V

40

85 °C

有

M1A3PE1500-1FGG676I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40 to 85 °C

Tray

M1A3PE1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

444

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

444

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

1

38400

38400

1500000

1.73 mm

27 mm

27 mm

2759 In Stock

-

8 Weeks

表面贴装

780-BGA

YES

374

0°C~85°C TJ

Tray

Cyclone® IV E

e1

活跃

3 (168 Hours)

780

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.15V~1.25V

BOTTOM

BALL

245

1.2V

1mm

40

EP4CE55

S-PBGA-B780

377

不合格

1.21.2/3.32.5V

472.5MHz

377

现场可编程门阵列

55856

2396160

3491

2.4mm

29mm

29mm

符合RoHS标准

1000 In Stock

-

表面贴装

表面贴装

560-LBGA Exposed Pad, Metal

404

-40°C~100°C TJ

Tray

2010

Virtex®

e0

Obsolete

3 (168 Hours)

560

EAR99

Tin/Lead (Sn63Pb37)

8542.39.00.01

2.375V~2.625V

BOTTOM

BALL

225

2.5V

1.27mm

not_compliant

30

XCV1000

560

S-PBGA-B560

404

不合格

1.2/3.62.5V

16kB

250MHz

404

现场可编程门阵列

27648

131072

1124022

6144

0.8 ns

1.7mm

42.5mm

42.5mm

Non-RoHS Compliant

含铅

3000 In Stock

-

8 Weeks

表面贴装

1152-BBGA, FCBGA Exposed Pad

YES

544

-40°C~100°C TJ

Tray

Arria V GX

e1

活跃

3 (168 Hours)

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.07V~1.13V

BOTTOM

BALL

未说明

1.1V

1mm

未说明

5AGXBB7

S-PBGA-B1152

544

不合格

1.11.2/3.32.5V

622MHz

544

现场可编程门阵列

504000

27695104

23780

2.7mm

35mm

35mm

符合RoHS标准

806 In Stock

-

10 Weeks

Copper, Silver, Tin

表面贴装

表面贴装

676-BBGA, FCBGA

676

312

-40°C~100°C TJ

Tray

2012

Kintex® UltraScale™

e1

活跃

4 (72 Hours)

676

Tin/Silver/Copper (Sn/Ag/Cu)

0.922V~0.979V

BOTTOM

BALL

未说明

0.95V

未说明

312

不合格

950mV

0.95V

2.6MB

现场可编程门阵列

530250

21606000

30300

1

484800

27mm

27mm

ROHS3 Compliant

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

N

7000 LE

119 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

AFS600

活跃

0°C ~ 85°C (TJ)

Tray

AFS600

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

13.5 kB

110592

600000

1.47059 GHz

2

13824

1.2 mm

17 mm

17 mm

无

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

484

484-FPBGA (23x23)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

N

7000 LE

172 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

1470.59 MHz

有

60

Fusion

0.014110 oz

1.575 V

Tray

AFS600

活跃

0°C ~ 85°C (TJ)

Tray

AFS600

70 °C

0 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

13.5 kB

110592

600000

1.47059 GHz

2

13824

1.73 mm

23 mm

23 mm

无

N/A

-

表面贴装

FBGA

YES

484-FPBGA (23x23)

484

This product may require additional documentation to export from the United States.

Details

280 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

310 MHz

微芯片技术

有

60

ProASIC3

0.014110 oz

1.575 V

Tray

M1A3PE1500

活跃

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

-40 °C

1.5 V

40

85 °C

有

M1A3PE1500-2FGG484I

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

-40°C ~ 100°C (TJ)

Tray

M1A3PE1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

280

不合格

1.5 V

1.5/3.3 V

INDUSTRIAL

280

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

2

38400

38400

1500000

1.73 mm

23 mm

23 mm

N/A

-

表面贴装

FBGA

YES

144-FPBGA (13x13)

144

97 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

有

微芯片技术

160

ProASIC3

0.014110 oz

1.5000 V

1.575 V

Tray

M1A3P250

活跃

13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

1.5 V

30

85 °C

无

M1A3P250-2FG144

350 MHz

LBGA

SQUARE

活跃

MICROSEMI CORP

5.24

N

0 to 70 °C

Tray

M1A3P250

e0

Tin/Lead/Silver (Sn/Pb/Ag)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

225

1 mm

compliant

S-PBGA-B144

不合格

1.5 V

COMMERCIAL

6144 CLBS, 250000 GATES

1.55 mm

现场可编程门阵列

36864

250000

2

6144

250000

1.05 mm

13 mm

13 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

FBGA

256

256-FPBGA (17x17)

400.011771 mg

微芯片技术

This product may require additional documentation to export from the United States.

N

7000 LE

119 I/O

1.425 V

- 40 C

+ 85 C

SMD/SMT

1282.05 MHz

有

90

Fusion

0.014110 oz

1.575 V

Tray

AFS600

活跃

-40°C ~ 100°C (TJ)

Tray

AFS600

85 °C

-40 °C

1.425V ~ 1.575V

1.5 V

1.575 V

1.425 V

13.5 kB

110592

600000

1.28205 GHz

1

13824

1.2 mm

17 mm

17 mm

无

N/A

-

表面贴装

FBGA

YES

676-FBGA (27x27)

676

This product may require additional documentation to export from the United States.

Details

444 I/O

1.425 V

0 C

+ 70 C

SMD/SMT

310 MHz

微芯片技术

有

40

ProASIC3

0.014110 oz

1.5000 V

1.425 V

1.575 V

Tray

M1A3PE1500

活跃

1.575 V

27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676

网格排列

3

PLASTIC/EPOXY

BGA676,26X26,40

1.5 V

40

70 °C

有

M1A3PE1500-2FGG676

350 MHz

BGA

SQUARE

活跃

MICROSEMI CORP

5.3

0 to 70 °C

Tray

M1A3PE1500

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

1.425V ~ 1.575V

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

444

不合格

1.5 V

1.5/3.3 V

COMMERCIAL

444

38400 CLBS, 1500000 GATES

2.44 mm

现场可编程门阵列

276480

1500000

2

38400

38400

1500000

1.73 mm

27 mm

27 mm

N/A

-

Production (Last Updated: 2 months ago)

表面贴装

表面贴装

256-LBGA

256

256-FPBGA (17x17)

微芯片技术

AFS600

活跃

This product may require additional documentation to export from the United States.

Details

7000 LE

有

90

Fusion

119

Tray

-55°C ~ 100°C (TJ)

Tray

AFS600

100 °C

-55 °C

1.425V ~ 1.575V

13.5 kB

110592

600000

N/A

-

表面贴装

FCBGA-325

YES

325-FCBGA (11x11)

325

SMD/SMT

微芯片技术

有

176

IGLOO2

1.2 V

Tray

M2GL090

活跃

, BGA325,21X21,20

3

PLASTIC

BGA325,21X21,20

1.2 V

有

M2GL090-FCSG325I

活跃

MICROSEMI CORP

5.3

This product may require additional documentation to export from the United States.

Details

86184 LE

180 I/O

1.2 V

- 40 C

+ 100 C

-40°C ~ 100°C (TJ)

Tray

M2GL090

8542.39.00.01

CMOS

1.14V ~ 2.625V

compliant

180

不合格

1.2 V

1.2 V

180

现场可编程门阵列

86184

2648064

86316

N/A

-

表面贴装

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

M2GL050

微芯片技术

活跃

11 X 11 MM, 0.50 MM PITCH, FBGA-325

网格排列

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

20

1.14 V

85 °C

无

M2GL050TS-1FCS325

BGA

SQUARE

活跃

MICROSEMI CORP

1.26 V

5.27

This product may require additional documentation to export from the United States.

N

有

176

IGLOO2

200

Tray

0°C ~ 85°C (TJ)

Tray

M2GL050TS

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

compliant

S-PBGA-B325

200

不合格

1.2 V

OTHER

200

现场可编程门阵列

56340

1869824

56340

N/A

-

表面贴装

FPBGA-484

YES

484-FPBGA (23x23)

484

267 I/O

1.2 V

- 40 C

+ 100 C

SMD/SMT

微芯片技术

有

60

IGLOO2

1.2 V

Tray

M2GL025

活跃

BGA, BGA484,22X22,40

网格排列

3

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

20

无

M2GL025T-FG484I

BGA

SQUARE

活跃

MICROSEMI CORP

5.27

This product may require additional documentation to export from the United States.

N

27696 LE

-40°C ~ 100°C (TJ)

Tray

M2GL025T

8542.39.00.01

CMOS

1.14V ~ 2.625V

BOTTOM

BALL

240

1 mm

compliant

S-PBGA-B484

267

不合格

1.2 V

1.2 V

267

2.44 mm

现场可编程门阵列

27696

1130496

STD

4 Transceiver

27696

23 mm

23 mm

N/A

-

表面贴装

PLCC-84

YES

84-PLCC (29.31x29.31)

84

Actel

16

有

120 MHz

SMD/SMT

+ 125 C

- 40 C

微芯片技术

4.75 V

69 I/O

Details

5.25 V

Tray

A40MX04

活跃

QCCJ,

CHIP CARRIER

3

PLASTIC/EPOXY

-40 °C

5 V

40

125 °C

有

A40MX04-PLG84A

116 MHz

QCCJ

SQUARE

活跃

MICROSEMI CORP

5.59

0.239083 oz

-40°C ~ 125°C (TA)

Tube

A40MX04

e3

Matte Tin (Sn)

CAN ALSO BE OPERATED AT 5.0V SUPPLY

8542.39.00.01

CMOS

3V ~ 3.6V, 4.5V ~ 5.5V

QUAD

J BEND

245

1.27 mm

compliant

S-PQCC-J84

不合格

5 V

AUTOMOTIVE

547 CLBS, 6000 GATES

4.572 mm

现场可编程门阵列

6000

STD

2.2 ns

547

6000

3.68 mm

29.31 mm

29.31 mm

N/A

-

表面贴装

324-BGA

YES

246

0°C~85°C TJ

Tray

APEX-20KE®

e1

Obsolete

3 (168 Hours)

324

3A991

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

1.71V~1.89V

BOTTOM

BALL

260

1.8V

1mm

compliant

40

EP20K100

S-PBGA-B324

238

不合格

1.81.8/3.3V

160MHz

2.2 ns

238

可加载 PLD

4160

53248

263000

416

MACROCELL

4

3.5mm

19mm

19mm

符合RoHS标准