类别是'category.电信接口IC' (8324)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | 端子表面处理 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 模拟 IC - 其他类型 | 操作模式 | 电源电流-最大值 | 数据率 | 座位高度-最大 | 供应电流-最大值(Isup) | 通信IC类型 | 过滤器 | 标准 | 运输载体类型 | ISDN接入速率 | 参考点 | 长度 | 宽度 | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | MRFIC0001 | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | -30 °C | PLASTIC/EPOXY | TSSOP | TSSOP20,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 无 | Obsolete | MOTOROLA SEMICONDUCTOR PRODUCTS | TSSOP, TSSOP20,.25 | 85 °C | e0 | Tin/Lead (Sn/Pb) | DUAL | 鸥翼 | 0.635 mm | unknown | R-PDSO-G20 | 不合格 | 3/5 V | OTHER | 12 mA | |||||||||||||||||||||||||||
![]() | TISP61CAP3P | Power Innovations International, Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 8 | DIP | PLASTIC/EPOXY | DIP, | POWER INNOVATIONS LTD | Transferred | IN-LINE | RECTANGULAR | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T8 | 不合格 | 5.08 mm | 浪涌保护电路 | 7.62 mm | |||||||||||||||||||||||||||||||
![]() | TISP61CAP3P | Bourns Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 8 | RECTANGULAR | IN-LINE | DIP, | DIP | BOURNS INC | Obsolete | 无 | PLASTIC/EPOXY | DIP | 8542.39.00.01 | DUAL | THROUGH-HOLE | 未说明 | 1 | not_compliant | 未说明 | 8 | R-PDIP-T8 | 不合格 | 浪涌保护电路 | |||||||||||||||||||||||||||||
![]() | TSOT0410G14 | Avago Technologies | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 600 | BGA | SQUARE | 网格排列 | 2.5 V | 活跃 | AVAGO TECHNOLOGIES INC | BGA, | 85 °C | -40 °C | PLASTIC/EPOXY | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 | 1.27 mm | unknown | 30 | S-PBGA-B600 | 不合格 | INDUSTRIAL | 3.05 mm | ATM/SONET/SDH SUPPORT CIRCUIT | 45 mm | 45 mm | ||||||||||||||||||||||
![]() | TK5530H-138-PP | Temic Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | FX-500-LAC-GNJ-A3-E7 | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | CERAMIC, METAL-SEALED COFIRED | SOJ | SOJ8(UNSPEC) | RECTANGULAR | 小概要 | 3.3 V | 有 | Obsolete | MICROCHIP TECHNOLOGY INC | PACKAGE-6 | 70 °C | 8542.39.00.01 | DUAL | J BEND | 1 | 2.54 mm | compliant | R-CDSO-J6 | 3.6 V | 3 V | 锁相环频率合成器 | 4.69 mm | 40 mA | 13.97 mm | 8.89 mm | ||||||||||||||||||||||||
![]() | FX-500-LAC-GNJ-A3-E7 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 6 | 70 °C | PLASTIC/EPOXY | SOJ | RECTANGULAR | 小概要 | 3.3 V | 有 | Transferred | MICROSEMI CORP | PACKAGE-6 | 1 | e4 | 镍金 | 8542.39.00.01 | DUAL | J BEND | 260 | 1 | 2.54 mm | compliant | 30 | R-PDSO-J6 | COMMERCIAL | 4.69 mm | ATM/SONET/SDH SUPPORT CIRCUIT | 13.97 mm | 8.89 mm | ||||||||||||||||||||||
![]() | PEF2091F | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | PLASTIC/EPOXY | QFP | QFP64,.47SQ,20 | SQUARE | FLATPACK | 5 V | 无 | Obsolete | INFINEON TECHNOLOGIES AG | 85 °C | -40 °C | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | not_compliant | S-PQFP-G64 | 不合格 | INDUSTRIAL | 144 Mbps | CCITT I.430 | BASIC | U | ||||||||||||||||||||||||
![]() | CS61544-ID | Crystal Semiconductor Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 28 | CERAMIC, GLASS-SEALED | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | CRYSTAL SEMICONDUCTOR CORP | 85 °C | -40 °C | e0 | 锡铅 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-GDIP-T28 | 不合格 | INDUSTRIAL | 0.145 mA | pcm收发器 | T-1(DS1) | |||||||||||||||||||||||||
![]() | SC14408B80VDX | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 80 | FLATPACK | 无 | Obsolete | NATIONAL SEMICONDUCTOR CORP | QFP, QFP80,.68SQ | PLASTIC/EPOXY | QFP | QFP80,.68SQ | SQUARE | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 0.635 mm | unknown | S-PQFP-G80 | 不合格 | |||||||||||||||||||||||||||||||
![]() | LAN9311I-NZW-TR | SMSC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 128 | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 3.3 V | Transferred | STANDARD MICROSYSTEMS CORP | TFQFP, | 85 °C | -40 °C | PLASTIC/EPOXY | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.4 mm | unknown | S-PQFP-G128 | INDUSTRIAL | 1.2 mm | LAN 交换电路 | 14 mm | 14 mm | |||||||||||||||||||||||||||
![]() | GD16557 | Giga | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S19205CBIAB | Applied Micro Circuits Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PEB2260N2V3.0 | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RF6555 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | QCCN, | UNSPECIFIED | QCCN | SQUARE | CHIP CARRIER | Transferred | RF MICRO DEVICES INC | 8542.39.00.01 | QUAD | 无铅 | 1 | unknown | S-XQCC-N20 | 电信电路 | |||||||||||||||||||||||||||||||||||
![]() | R8071AG | Conexant Systems Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 68 | CERAMIC | 70 °C | PGA, PGA68,11X11 | 康讯系统 | Transferred | 无 | PGA | PGA68,11X11 | SQUARE | 网格排列 | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | compliant | S-XPGA-P68 | 不合格 | COMMERCIAL | ||||||||||||||||||||||||||||
![]() | PX1012AI-EL1/G | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 81 | BGA | LFBGA, | SOT-643-1 | 85 °C | -40 °C | PLASTIC/EPOXY | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | 1.2 V | 有 | Obsolete | NXP SEMICONDUCTORS | e1 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 81 | S-PBGA-B81 | 不合格 | INDUSTRIAL | 1.6 mm | 电路接口 | 9 mm | 9 mm | ||||||||||||||||||||
![]() | TH72015 | Melexis Microelectronic Integrated Systems | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 10 | -40 °C | UNSPECIFIED | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 3 V | Obsolete | MELEXIS N V | QFN | HVSON, | 125 °C | 8542.39.00.01 | DUAL | 无铅 | 1 | 0.5 mm | compliant | 10 | S-XDSO-N10 | 不合格 | AUTOMOTIVE | 1 mm | 电信电路 | 3 mm | 3 mm | ||||||||||||||||||||||||
![]() | ATA8403C-6AQY | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP8,.19 | SQUARE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3 V | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | LEAD FREE, TSSOP-8 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 0.65 mm | compliant | S-PDSO-G8 | 不合格 | INDUSTRIAL | 0.011 mA | 1.05 mm | 电信电路 | 3 mm | 3 mm | |||||||||||||||||||||||
![]() | MXL86282C-ABE-R | MaxLinear Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SY8805DFC | Silergy Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | WM9712LSEFT/V | Cirrus Logic | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 3.3 V | Obsolete | CIRRUS LOGIC INC | TFQFP, | 85 °C | -25 °C | PLASTIC/EPOXY | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.5 mm | compliant | S-PQFP-G48 | OTHER | SYNCHRONOUS | 1.2 mm | PCM 编解码器 | YES | 7 mm | 7 mm | |||||||||||||||||||||||||
![]() | AWT6321RM28P9 | ANADIGICS Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 14 | BCC | HQCCN, | 3 | 85 °C | -20 °C | UNSPECIFIED | HQCCN | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG | 3.4 V | 有 | Transferred | ANADIGICS INC | 8542.39.00.01 | BOTTOM | 无铅 | 1 | 0.73 mm | unknown | 14 | R-XBCC-N14 | 不合格 | OTHER | 1.1 mm | 射频和基带电路 | 5 mm | 3 mm | ||||||||||||||||||||||
![]() | AWT6321RM28P9 | Coherent Thermal Solutions | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 14 | 3 | 85 °C | -20 °C | UNSPECIFIED | HQCCN | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG | 3.4 V | 有 | Transferred | II-VI INC | 3 X 5 MM, 1 MM HEIGHT, ROHS COMPLIANT, SMT-14 | 8542.39.00.01 | BOTTOM | 无铅 | 1 | 0.73 mm | unknown | R-XBCC-N14 | 不合格 | OTHER | 1.1 mm | 射频和基带电路 | 5 mm | 3 mm | ||||||||||||||||||||||||
![]() | L7582HAE | Alcatel-Lucent | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 |
MRFIC0001
Freescale Semiconductor
分类:Interface - Telecom
TISP61CAP3P
Power Innovations International, Inc.
分类:Interface - Telecom
TISP61CAP3P
Bourns Inc
分类:Interface - Telecom
TSOT0410G14
Avago Technologies
分类:Interface - Telecom
TK5530H-138-PP
Temic Semiconductors
分类:Interface - Telecom
FX-500-LAC-GNJ-A3-E7
Microchip Technology Inc
分类:Interface - Telecom
FX-500-LAC-GNJ-A3-E7
Microsemi Corporation
分类:Interface - Telecom
PEF2091F
Infineon Technologies AG
分类:Interface - Telecom
CS61544-ID
Crystal Semiconductor Corp
分类:Interface - Telecom
SC14408B80VDX
National Semiconductor Corporation
分类:Interface - Telecom
LAN9311I-NZW-TR
SMSC
分类:Interface - Telecom
GD16557
Giga
分类:Interface - Telecom
S19205CBIAB
Applied Micro Circuits Corporation
分类:Interface - Telecom
PEB2260N2V3.0
Infineon Technologies AG
分类:Interface - Telecom
RF6555
RF Micro Devices Inc
分类:Interface - Telecom
R8071AG
Conexant Systems Inc
分类:Interface - Telecom
PX1012AI-EL1/G
NXP Semiconductors
分类:Interface - Telecom
TH72015
Melexis Microelectronic Integrated Systems
分类:Interface - Telecom
ATA8403C-6AQY
Microchip Technology Inc
分类:Interface - Telecom
MXL86282C-ABE-R
MaxLinear Inc
分类:Interface - Telecom
SY8805DFC
Silergy Corporation
分类:Interface - Telecom
WM9712LSEFT/V
Cirrus Logic
分类:Interface - Telecom
AWT6321RM28P9
ANADIGICS Inc
分类:Interface - Telecom
AWT6321RM28P9
Coherent Thermal Solutions
分类:Interface - Telecom
L7582HAE
Alcatel-Lucent
分类:Interface - Telecom
