类别是'category.电信接口IC' (8324)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | Date Of Intro | JESD-609代码 | 无铅代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 功能数量 | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 操作模式 | 电源电流-最大值 | 数据率 | 座位高度-最大 | 通信IC类型 | 过滤器 | 压缩法 | 负电源电压 | 线性编码 | 电池供电 | PSRR-Min | 混合动力车 | 电池供电 | 马克斯噪音 | 突破比率 | 传真率 | 长度 | 宽度 | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | PCD3322CT | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | 飞利浦半导体 | SOP, SOP20,.4 | 70 °C | -25 °C | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | 小概要 | 无 | Transferred | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | 鸥翼 | 1.27 mm | unknown | R-PDSO-G20 | 不合格 | OTHER | 0.4 mA | |||||||||||||||||||||||||||
![]() | PEB2041P | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 40 | DIP-40 | 70 °C | PLASTIC/EPOXY | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | 无 | Obsolete | INFINEON TECHNOLOGIES AG | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T40 | 不合格 | COMMERCIAL | |||||||||||||||||||||||||||||
![]() | SKY66291-21 | Skyworks Solutions Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TM1250HCB | Pulse Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | 活跃 | PULSE ELECTRONICS CORP | SOP, SOP16,.4 | 125 °C | -55 °C | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | 小概要 | 3.3 V | 无 | 8542.39.00.01 | DUAL | 鸥翼 | 1.27 mm | compliant | R-PDSO-G16 | 不合格 | MILITARY | ATM/SONET/SDH TRANSCEIVER | ||||||||||||||||||||||||||||
![]() | SL869 | Telit | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 24 | 85 °C | -40 °C | UNSPECIFIED | DMA | RECTANGULAR | 微电子组件 | 3.3 V | Obsolete | TELIT COMMUNICATIONS PLC | , | 8542.39.00.01 | DUAL | 无铅 | 1 | unknown | R-XDMA-N24 | 2.4 mm | 电信电路 | 16 mm | 12.2 mm | |||||||||||||||||||||||||||||
![]() | S1208CAI31 | Applied Micro Circuits Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HC1-5504B-5 | Intersil Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 24 | Obsolete | INTERSIL CORP | DIP | CERDIP-24 | 75 °C | CERAMIC, GLASS-SEALED | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | 12 V | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | 24 | R-GDIP-T24 | 不合格 | 商业扩展 | 41 mA | SLIC | -48 V | CONSTANT CURRENT | 15 dB | 2-4 CONVERSION | -48 V | 5 dBrnC | |||||||||||||||||
![]() | UM91317A | United Microelectronics Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | -20 °C | PLASTIC/EPOXY | RECTANGULAR | IN-LINE | 2.5 V | Obsolete | UNITED MICROELECTRONICS CORP | , | 70 °C | SELECTABLE MAKE/BREAK RATIO 1:2 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | unknown | R-PDIP-T16 | 不合格 | COMMERCIAL | 2 mA | 电话拨号电路 | 1:1.5 | ||||||||||||||||||||||||||||
![]() | S1T8503X01-D0B0 | Samsung Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 18 | DIP, | 70 °C | -40 °C | UNSPECIFIED | DIP | RECTANGULAR | IN-LINE | Obsolete | SAMSUNG SEMICONDUCTOR INC | DIP | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 18 | R-XDIP-T18 | 不合格 | OTHER | 5.08 mm | 电话语音电路 | 22.95 mm | 7.62 mm | |||||||||||||||||||||||||
![]() | TH72012 | Melexis Microelectronic Integrated Systems | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | SOIC | SOP, | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 3 V | Obsolete | MELEXIS N V | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | compliant | 8 | R-PDSO-G8 | 不合格 | AUTOMOTIVE | 1.72 mm | 电信电路 | 4.89 mm | 3.9 mm | ||||||||||||||||||||||||
![]() | MSM6963RS | LAPIS Semiconductor Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | LAPIS SEMICONDUCTOR CO LTD | DIP, DIP16,.3 | 70 °C | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T16 | 不合格 | COMMERCIAL | 11 mA | PCM 编解码器 | YES | A-LAW | -5 V | 不提供 | |||||||||||||||||||||
![]() | MSM6963RS | OKI Electric Industry Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | DIP, | 70 °C | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 5 V | Obsolete | OKI ELECTRIC INDUSTRY CO LTD | DIP | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 16 | R-PDIP-T16 | 不合格 | COMMERCIAL | SYNCHRONOUS/ASYNCHRONOUS | 11 mA | 4.55 mm | PCM 编解码器 | YES | A-LAW | -5 V | 19.1 mm | 7.62 mm | ||||||||||||||||||||
![]() | RFFM8500SQ | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | Transferred | RF MICRO DEVICES INC | QCCN, LCC16,.12SQ,20 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER | 3.3 V | 有 | 8542.39.00.01 | QUAD | 无铅 | 0.5 mm | unknown | S-PQCC-N16 | 不合格 | INDUSTRIAL | 260 mA | ||||||||||||||||||||||||||||
![]() | MX165CLH | CML Microcircuits Plc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 24 | CML MICROCIRCUITS LTD | LCC | QCCJ, LDCC24,.44SQ | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | LDCC24,.44SQ | SQUARE | CHIP CARRIER | 3.3 V | Obsolete | 8542.39.00.01 | QUAD | J BEND | 1 | 1.27 mm | compliant | 24 | S-PQCC-J24 | 不合格 | INDUSTRIAL | 0.0042 mA | 3.7 mm | 电信电路 | 10 mm | 10 mm | ||||||||||||||||||||||
![]() | R8071J | Conexant Systems Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 68 | 康讯系统 | QCCJ, LDCC68,1.0SQ | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | 5 V | 无 | Obsolete | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | unknown | S-PQCC-J68 | 不合格 | COMMERCIAL | 47.6 mA | |||||||||||||||||||||||||||
![]() | QN9022 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 40 | 2016-04-14 | -40 °C | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3 V | Transferred | NXP SEMICONDUCTORS | HVQCCN, | 85 °C | QUAD | 无铅 | 1 | 0.4 mm | unknown | S-PQCC-N40 | INDUSTRIAL | 0.9 mm | 电信电路 | 5 mm | 5 mm | |||||||||||||||||||||||||||
![]() | SX1308IMLTRT-CUT | Semtech Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | IDT82V3355TF | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | LFQFP, | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 3.3 V | QFP | INTEGRATED DEVICE TECHNOLOGY INC | Obsolete | 无 | e0 | 无 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.5 mm | compliant | 64 | S-PQFP-G64 | 不合格 | INDUSTRIAL | 1.4 mm | 电信电路 | 10 mm | 10 mm | |||||||||||||||||||
![]() | SY8702AABC | Silergy Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SA1620BE | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | Transferred | 飞利浦半导体 | QFP, QFP48,.35SQ,20 | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP48,.35SQ,20 | SQUARE | FLATPACK | 3 V | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | unknown | S-PQFP-G48 | 不合格 | INDUSTRIAL | |||||||||||||||||||||||||||
![]() | BCM3022KPF | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RFX96V12 | Conexant Systems Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | Transferred | 康讯系统 | QFP | QFP, LDCC68,1.0SQ | 70 °C | PLASTIC/EPOXY | QFP | LDCC68,1.0SQ | RECTANGULAR | FLATPACK | 5 V | 无 | e0 | 无 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | 不合格 | COMMERCIAL | 119 mA | 9 Mbps | 2.3 mm | MODEM-DATA/FAX/VOICE | 9.6 kbps | 20 mm | 14 mm | |||||||||||||||||
![]() | TXC-03108AIBG | Tri-Star Electronics International | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MH88634T-2 | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 21 | 5 V | 无 | Transferred | MICROSEMI CORP | 70 °C | PLASTIC/EPOXY | SIP21H,.6 | 8542.39.00.01 | SINGLE | 2.54 mm | unknown | 不合格 | COMMERCIAL | 13 mA | -5 V | ||||||||||||||||||||||||||||||||||
![]() | MH88634T-2 | Zarlink Semiconductor Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 21 | PLASTIC/EPOXY | SIP21H,.6 | 5 V | 无 | Obsolete | ZARLINK SEMICONDUCTOR INC | , SIP21H,.6 | 70 °C | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | SINGLE | 2.54 mm | unknown | 不合格 | COMMERCIAL | 0.013 mA | -5 V |
PCD3322CT
Philips Semiconductors
分类:Interface - Telecom
PEB2041P
Infineon Technologies AG
分类:Interface - Telecom
SKY66291-21
Skyworks Solutions Inc
分类:Interface - Telecom
TM1250HCB
Pulse Electronics Corporation
分类:Interface - Telecom
SL869
Telit
分类:Interface - Telecom
S1208CAI31
Applied Micro Circuits Corporation
分类:Interface - Telecom
HC1-5504B-5
Intersil Corporation
分类:Interface - Telecom
UM91317A
United Microelectronics Corporation
分类:Interface - Telecom
S1T8503X01-D0B0
Samsung Semiconductor
分类:Interface - Telecom
TH72012
Melexis Microelectronic Integrated Systems
分类:Interface - Telecom
MSM6963RS
LAPIS Semiconductor Co Ltd
分类:Interface - Telecom
MSM6963RS
OKI Electric Industry Co Ltd
分类:Interface - Telecom
RFFM8500SQ
RF Micro Devices Inc
分类:Interface - Telecom
MX165CLH
CML Microcircuits Plc
分类:Interface - Telecom
R8071J
Conexant Systems Inc
分类:Interface - Telecom
QN9022
NXP Semiconductors
分类:Interface - Telecom
SX1308IMLTRT-CUT
Semtech Corporation
分类:Interface - Telecom
IDT82V3355TF
Integrated Device Technology Inc
分类:Interface - Telecom
SY8702AABC
Silergy Corporation
分类:Interface - Telecom
SA1620BE
Philips Semiconductors
分类:Interface - Telecom
BCM3022KPF
Broadcom Limited
分类:Interface - Telecom
RFX96V12
Conexant Systems Inc
分类:Interface - Telecom
TXC-03108AIBG
Tri-Star Electronics International
分类:Interface - Telecom
MH88634T-2
Microsemi Corporation
分类:Interface - Telecom
MH88634T-2
Zarlink Semiconductor Inc
分类:Interface - Telecom
