类别是'category.电信接口IC' (8324)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 材料 | Housing material | 终端数量 | Case Diameter | Case Material | Coil resistance | Colour | Current Consumption | Date Of Intro | Diameter after shrink | Diameter before shrink | Dielectric strength | External height | External width | Gross weight | Gross Weight | Heatsink shape | Internal diameter | Internal height | Internal width | Material finishing | Maximum Charging Voltage | Maximum Current | Mounting hole size | Noal current | Noal voltage | Nominal Voltage | Number of contacts in group/number of groups (total contacts) | Number of electrical switching cycles | Number of switching cycles (electrical) | Operating conditions | Permissible load | Plate thickness | Protection | Purpose | Relative humidity | Service Life | Shipping Package Size/Quantity | Switching scheme | Transport packaging size/quantity | Transport Packaging size/quantity | Type of cable accessories | Type of heatsink | Type of transistor | Wall thickness before shrink | Weight gross | 包装 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 组成 | 颜色 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | 深度 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | Number of contacts | 电源 | Contact resistance | 温度等级 | 操作模式 | 电源电流-最大值 | 数据率 | 座位高度-最大 | Tool type | Operating temperature range | 工作温度范围 | Switching voltage | 筛选水平 | 通信IC类型 | 收发器数量 | Shrink temperature | 第二个连接器加载的位置数 | 过滤器 | 压缩法 | 饱和电流 | 负电源电压 | Operating voltage | 电池类型 | 模块类型 | Shrink ratio | 直径 | 高度 | 长度 | 宽度 | ||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | ZGM130S037HGN2R | Silicon Laboratories Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | Ф9.8 mm | Metal | 15 mA | 2019-11-22 | 4.95 | SILICON LABORATORIES INC | 85 °C | -40 °C | QCCN | 12 V | LCC64,.35SQ,20 | SQUARE | CHIP CARRIER | 1.8 V | Ф8 mm | 有 | 活跃 | 10000 hours | 42*28*23.5/1000 | RUICHI L-705 Series LED Indicator in Case | Red | 8542.39.00.01 | QUAD | 无铅 | 260 | 0.5 mm | 37.5 ± 1 mm | unknown | 40 | S-PQCC-N64 | INDUSTRIAL | 1.3 mm | -20…+55 °C | 电信电路 | 3 | 9 mm | 9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MGA-43003-TR1G | Avago Technologies | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | 13.80 | AVAGO TECHNOLOGIES INC | 16.8…18.1 V | charging - 20; discharging - 40; starting - 60 A | HVQCCN, | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | Protection board for Li-Ion battery (4S 40A) with balancing and recovery function | triggering on current overload - 500; on SC - 100 ms | from overloading/overcharging 4.095…4.195/4.28 ± 0.05 V; overdischarge 2.55 ± 0.08 V; SC | 42*28*23.5/500 | Obsolete | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | unknown | S-XQCC-N28 | 1 mm | 电信电路 | 4 batteries (4S) Unom=3.7 V: 18650; 26650; Li-Po | Protection board for Li-Ion battery (4S 40A) with balancing and recovery function | 5 mm | 5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TJA1050T | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 不推荐 | 6 g | NXP SEMICONDUCTORS | SOIC | 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8 | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 5 V | 有 | IGBT | e4 | 有 | EAR99 | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 40 | 8 | R-PDSO-G8 | 不合格 | AUTOMOTIVE | 0.075 mA | 1000 Mbps | 1.75 mm | 电路接口 | 1 | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GRF4005 | Guerrilla RF | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | fiberglass rod in blue plastic cover | 6 | 138.67 | HSON, | 105 °C | -40 °C | PLASTIC/EPOXY | maximum bending radius - 30mm | HSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG | 5 V | 接触制造商 | static tensile forces - not more than 2 kN; crushing forces - not more than 0.5 kN/cm | for cable pulling in cable channels, boxes, pipes, etc. | GUERRILLA RF INC | 39*39*37/50 | in coil | Fiberglass rod | blue | 8542.39.00.01 | DUAL | 无铅 | 1 | unknown | S-PDSO-N6 | INDUSTRIAL | Cable channel preparation device (CCPD) | -20…+50 °C | 电信电路 | 1 | external on the cover - 4mm | 5m | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RF5722TR7 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | polyolefin | 8 | Transferred | 4 mm | 12 mm | RF MICRO DEVICES INC | 2.20 X 2.20 MM, 0.45 MM HEIGHT, GREEN, QFN-8 | 85 °C | -30 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3.3 V | 12 mm | 有 | 103*26*26/200 | 0.68 mm | 39.25 | supplied in 1.0 m lengths | e3 | 5A991.G | Heat shrink tubing with adhesive layer | 哑光锡 | green | 8517.70.00.00 | QUAD | 无铅 | 260 | 1 | 0.65 mm | unknown | 30 | S-XQCC-N8 | OTHER | 0.5 mm | -55…+125 degrees C | 电信电路 | 100 degrees C | 2 | ≤1500 V | 3 : 1 | 1000 mm | 2.2 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | KSZ8061RNBW | Micrel Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | Zinc | 32 | 9.94 | QFN-32 | 105 °C | -40 °C | 250min | UNSPECIFIED | ≥500 | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3.3 V | Transferred | 93% | 42*28*18.5/1000 | MICREL INC | XS9 | QUAD | 无铅 | 1 | 0.5 mm | unknown | S-XQCC-N32 | 4 | ≤1000 Mohm | INDUSTRIAL | 100000 Mbps | 1 mm | -55…+85°C | 以太网收发器 | 1 | 9 | 5 mm | 5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS2984-INE3 | Gennum Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | aluminium | 16 | black | Transferred | 700 g | grilled | GENNUM CORP | anodized | QCCN, LCC16,.16SQ,25 | 85 °C | -20 °C | PLASTIC/EPOXY | QCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER | 3.3 V | for back plate | 有 | 15mm | extruded | 8542.39.00.01 | QUAD | 无铅 | 0.635 mm | unknown | S-PQCC-N16 | 不合格 | OTHER | universal | 84mm | 0.15m | 300mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | UJA1169ATK/3 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | aluminium | 20 | black | 700 g | round | 活跃 | 60mm | anodized | NXP SEMICONDUCTORS | HVSON-20 | PLASTIC/EPOXY | HVSON | SOLCC20,.14,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 13 V | heat transfer glue, | 有 | extruded | DUAL | 无铅 | 1 | 0.5 mm | compliant | R-PDSO-N20 | 67 mA | 15000 Mbps | 1 mm | AEC-Q100 | CAN FD TRANSCEIVER | 1 | LED | 120mm | 5.5 mm | 3.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | KSZ8851SNLI | Micrel Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | Transferred | MICREL INC | 5 X 5 MM, LEAD FREE, QFN-32 | 85 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 1.8 V | 有 | e4 | 镍钯金 | QUAD | 无铅 | 260 | 1 | 0.5 mm | compliant | 40 | S-PQCC-N32 | 不合格 | INDUSTRIAL | 0.9 mm | 以太网收发器 | 2 | 5 mm | 5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AMIS41682NGA | AMI Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 14 | 1000 (at Uисп.dc=500 V) MΩ | 1500 (50 Hz, 1 min.) V | 4.50 | AMI SEMICONDUCTOR | 0.150 INCH, GREEN, PLASTIC, MS-012AB, SOIC-14 | --- mm | 125 °C | 3 (6) Amin | -40 °C | 3/ 1 (3P) | ≥10000 | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 5 V | 有 | ON-OFF-ON, SPDT | 28.5*21*19/1000 | Transferred | e3/e4 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | 27.55 mm | unknown | 40 | R-PDSO-G14 | 不合格 | ≤20 mΩ | AUTOMOTIVE | 1.7272 mm | -25 …+85 °C | 250 (125) V | 电路接口 | 7.9 (body) mm | 8.6868 mm | 3.937 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BCM4330FKUBG | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 133 | 13.10 | WLBGA-133 | 85 °C | -30 °C | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 1.2 V | 活跃 | 42*28*18.5/500 | INFINEON TECHNOLOGIES AG | BOTTOM | BALL | 1 | 0.4 mm | compliant | R-PBGA-B133 | OTHER | 0.55 mm | 电信电路 | 5.33 mm | 4.89 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BCM4330FKUBG | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 133 | 8.12 | WLBGA-133 | 85 °C | -30 °C | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 1.2 V | Transferred | 45*38*20/500 | CYPRESS SEMICONDUCTOR CORP | 8542.39.00.01 | BOTTOM | BALL | 1 | 0.4 mm | compliant | R-PBGA-B133 | OTHER | 0.55 mm | 电信电路 | 5.33 mm | 4.89 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DS856 | Euvis Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | EUVIS INC | PACKAGE | UNSPECIFIED | UNSPECIFIED | 有 | 接触制造商 | UNSPECIFIED | 1 | unknown | 电信电路 | -5 V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC2833P | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | Obsolete | MOTOROLA SEMICONDUCTOR PRODUCTS | DIP, DIP16,.3 | 70 °C | -30 °C | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 4 V | 无 | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T16 | 不合格 | 4 V | OTHER | 4.3 mA | 电信电路 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LM567CMX | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | NATIONAL SEMICONDUCTOR CORP | SOP-8 | 70 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 5 V | 无 | Transferred | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | 鸥翼 | 235 | 1 | 1.27 mm | not_compliant | 30 | R-PDSO-G8 | 不合格 | COMMERCIAL | 15 mA | 1.753 mm | 音调解码电路 | 1 | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TP3067WMX | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | SOP, | 70 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 5 V | Obsolete | NATIONAL SEMICONDUCTOR CORP | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | R-PDSO-G20 | 不合格 | COMMERCIAL | SYNCHRONOUS/ASYNCHRONOUS | 10 mA | 2.65 mm | PCM 编解码器 | YES | A-LAW | -5 V | 12.8 mm | 7.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LM567CN/NOPB | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 8 | NATIONAL SEMICONDUCTOR CORP | PLASTIC, DIP-8 | 70 °C | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 5 V | 有 | Transferred | e3 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 260 | 1 | 2.54 mm | compliant | 40 | R-PDIP-T8 | 不合格 | COMMERCIAL | 15 mA | 5.08 mm | 音调解码电路 | 1 | 9.817 mm | 7.62 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TJA1044GT | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | frames openable from inner radius | 50mm | 92.5mm | 1220 g | 有 | 35mm | 76mm | 活跃 | NXP SEMICONDUCTORS | SOP, | 150 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 5 V | 200mm | cable chain | ESD on pins CANH and CANL ESD is 8kV | 8542.39.00.01 | DUAL | 鸥翼 | 未说明 | 1 | 1.27 mm | compliant | 未说明 | R-PDSO-G8 | 110 mA | 5000 Mbps | 1.75 mm | AEC-Q100 | 电路接口 | 1 | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RF9802TR13 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 23 | Transferred | RF MICRO DEVICES INC | QMA | BCC, LCC22,.2X.26,40/36 | 85 °C | -30 °C | UNSPECIFIED | BCC | LCC22,.2X.26,40/36 | RECTANGULAR | CHIP CARRIER | 3.5 V | 有 | 5A991.G | 8517.62.00.50 | BOTTOM | BUTT | 1 | 0.91 mm | unknown | 22 | R-XBCC-B23 | 不合格 | OTHER | 0.00001 mA | 1.05 mm | 射频和基带电路 | 5A | 6.63 mm | 5.24 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TJA1040T/VM | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | NXP SEMICONDUCTORS | SOIC | SOP, | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 5 V | 有 | Obsolete | e4 | 有 | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 40 | 8 | R-PDSO-G8 | 不合格 | 1.75 mm | 电路接口 | 1 | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MCP2551-I/SNVAO | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | MICROCHIP TECHNOLOGY INC | SOIC-8 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 5 V | 不推荐 | EAR99 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | compliant | R-PDSO-G8 | INDUSTRIAL | 75 mA | 1000 Mbps | 1.75 mm | AEC-Q100; TS 16949 | 可收发器 | 1 | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TJA1051T/E | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 活跃 | NXP SEMICONDUCTORS | SOIC | SOP-8 | PLASTIC/EPOXY | SOP | SOP8,.24 | RECTANGULAR | 小概要 | 5 V | 有 | e4 | EAR99 | 镍钯金银 | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | compliant | 30 | 8 | R-PDSO-G8 | 不合格 | 110 mA | 5000 Mbps | 1.75 mm | AEC-Q100 | 可收发器 | 1 | 1 | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | T7024-TRQ | Atmel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | Obsolete | ATMEL CORP | PLASTIC, SSO-20 | 85 °C | -25 °C | PLASTIC/EPOXY | SSOP | SSOP20,.25 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | 3 V | 无 | e0 | 锡铅 | DUAL | 鸥翼 | 1 | 0.65 mm | compliant | R-PDSO-G20 | 不合格 | OTHER | 1.44 mm | 电信电路 | 4.4 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | T7024-TRQ | Temic Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | PLASTIC, SSO-20 | 70 °C | -25 °C | PLASTIC/EPOXY | RECTANGULAR | 小概要 | Transferred | TEMIC SEMICONDUCTORS | DUAL | 鸥翼 | 1 | unknown | R-PDSO-G20 | 不合格 | OTHER | 电信电路 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GL850 | Genesys Logic Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | QFP, QFP64,.47SQ,20 | PLASTIC/EPOXY | QFP | QFP64,.47SQ,20 | SQUARE | FLATPACK | 3.3 V | 接触制造商 | GENESYS LOGIC INC | 8542.39.00.01 | QUAD | 鸥翼 | 0.5 mm | unknown | S-PQFP-G64 | 不合格 |
ZGM130S037HGN2R
Silicon Laboratories Inc
分类:Interface - Telecom
MGA-43003-TR1G
Avago Technologies
分类:Interface - Telecom
TJA1050T
NXP Semiconductors
分类:Interface - Telecom
GRF4005
Guerrilla RF
分类:Interface - Telecom
RF5722TR7
RF Micro Devices Inc
分类:Interface - Telecom
KSZ8061RNBW
Micrel Inc
分类:Interface - Telecom
GS2984-INE3
Gennum Corporation
分类:Interface - Telecom
UJA1169ATK/3
NXP Semiconductors
分类:Interface - Telecom
KSZ8851SNLI
Micrel Inc
分类:Interface - Telecom
AMIS41682NGA
AMI Semiconductor
分类:Interface - Telecom
BCM4330FKUBG
Infineon Technologies AG
分类:Interface - Telecom
BCM4330FKUBG
Cypress Semiconductor
分类:Interface - Telecom
DS856
Euvis Inc
分类:Interface - Telecom
MC2833P
Freescale Semiconductor
分类:Interface - Telecom
LM567CMX
National Semiconductor Corporation
分类:Interface - Telecom
TP3067WMX
Texas Instruments
分类:Interface - Telecom
LM567CN/NOPB
National Semiconductor Corporation
分类:Interface - Telecom
TJA1044GT
NXP Semiconductors
分类:Interface - Telecom
RF9802TR13
RF Micro Devices Inc
分类:Interface - Telecom
TJA1040T/VM
NXP Semiconductors
分类:Interface - Telecom
MCP2551-I/SNVAO
Microchip Technology Inc
分类:Interface - Telecom
TJA1051T/E
NXP Semiconductors
分类:Interface - Telecom
T7024-TRQ
Atmel Corporation
分类:Interface - Telecom
T7024-TRQ
Temic Semiconductors
分类:Interface - Telecom
GL850
Genesys Logic Inc
分类:Interface - Telecom
