RF Micro Devices Inc RF5722TR7

表面安装

YES

材料

polyolefin

终端数量

8

Rohs Code

有

Part Life Cycle Code

Transferred

Ihs Manufacturer

RF MICRO DEVICES INC

Package Description

2.20 X 2.20 MM, 0.45 MM HEIGHT, GREEN, QFN-8

Operating Temperature-Max

85 °C

Operating Temperature-Min

-30 °C

Package Body Material

UNSPECIFIED

Package Code

HVQCCN

Package Shape

SQUARE

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Supply Voltage-Nom

3.3 V

Weight gross

39.25

Transport packaging size/quantity

103*26*26/200

Diameter before shrink

12 mm

Diameter after shrink

4 mm

Nominal diameter

12 mm

Wall thickness before shrink

0.68 mm

包装

supplied in 1.0 m lengths

JESD-609代码

e3

ECCN 代码

5A991.G

类型

Heat shrink tubing with adhesive layer

端子表面处理

哑光锡

颜色

green

HTS代码

8517.70.00.00

端子位置

QUAD

终端形式

无铅

峰值回流焊温度（摄氏度）

260

功能数量

1

端子间距

0.65 mm

Reach合规守则

unknown

时间@峰值回流温度-最大值(s)

30

JESD-30代码

S-XQCC-N8

温度等级

OTHER

座位高度-最大

0.5 mm

Operating temperature range

-55…+125 degrees C

通信IC类型

电信电路

Shrink temperature

100 degrees C

饱和电流

2

Operating voltage

≤1500 V

Shrink ratio

3 : 1

宽度

2.2 mm

长度

1000 mm