类别是'category.串行设备服务器' (827)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | 包装 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 类型 | 端子表面处理 | HTS代码 | 子类别 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 界面 | 端口的数量 | 电源电流-最大值 | 座位高度-最大 | 产品类别 | 通信IC类型 | 产品类别 | 长度 | 宽度 | ||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | BBS2600STBR | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Details | 10 | 986308 | Intel | Intel | Bulk | Ethernet & Communication Modules | Servers | Servers | |||||||||||||||||||||||||||||||||||||||||||
![]() | R1208WFQYSR | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Details | 1 | 986059 | Intel | Intel | R1000WF | Ethernet & Communication Modules | Servers | Servers | |||||||||||||||||||||||||||||||||||||||||||
![]() | LIME2-SERVER-128GB-SSD | Olimex | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LIME2-SERVER-512GB-SSD | Olimex | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | STE-716BI | ICOMTECH, INC. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Bulk | 活跃 | 以太网转串口 | RS-422/485 | 16 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | STE-708BI | ICOMTECH, INC. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Bulk | 活跃 | 以太网转串口 | RS-422/485 | 8 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | KA8510Q | Samsung Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | 75 °C | -25 °C | PLASTIC/EPOXY | QFP | QFP64(UNSPEC) | RECTANGULAR | FLATPACK | 3 V | 无 | Obsolete | SAMSUNG SEMICONDUCTOR INC | QFP | QFP, QFP64(UNSPEC) | e0 | 无 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 1 mm | compliant | 64 | R-PQFP-G64 | 不合格 | 商业扩展 | 3 mm | 无绳电话射频和基带电路 | 20 mm | 14 mm | ||||||||||||||||||||
![]() | ML2725DH | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | SQUARE | FLATPACK, THIN PROFILE | Obsolete | MICRO LINEAR CORP | QFP | TQFP, | 60 °C | -10 °C | PLASTIC/EPOXY | TQFP | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.8 mm | unknown | 32 | S-PQFP-G32 | 不合格 | COMMERCIAL | 76 mA | 1.2 mm | 无绳电话射频和基带电路 | 7 mm | 7 mm | |||||||||||||||||||||||||
![]() | MC13158FTBR2 | Motorola Semiconductor Products | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | FLATPACK, LOW PROFILE | 3 V | Obsolete | MOTOROLA INC | LQFP, | 85 °C | -40 °C | PLASTIC/EPOXY | LQFP | SQUARE | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.8 mm | unknown | S-PQFP-G32 | 不合格 | INDUSTRIAL | 9.5 mA | 1.6 mm | 无绳电话射频和基带电路 | 7.025 mm | 7.025 mm | ||||||||||||||||||||||||||
![]() | MC13110BFTA | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | PLASTIC/EPOXY | QFP | QFP48,.35SQ,20 | SQUARE | FLATPACK | 3.6 V | 无 | Obsolete | MOTOROLA SEMICONDUCTOR PRODUCTS | QFP, QFP48,.35SQ,20 | 85 °C | -40 °C | e0 | Tin/Lead (Sn/Pb) | QUAD | 鸥翼 | 0.5 mm | unknown | S-PQFP-G48 | 不合格 | 3.6 V | INDUSTRIAL | 10.5 mA | |||||||||||||||||||||||||||
![]() | TA31165CFLG(LAEF) | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TA31137FNG | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 24 | -30 °C | PLASTIC/EPOXY | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | 3 V | 有 | Obsolete | TOSHIBA CORP | SSOP | LSSOP, | 85 °C | 8542.39.00.01 | DUAL | 鸥翼 | 未说明 | 1 | 0.65 mm | unknown | 未说明 | 24 | R-PDSO-G24 | 不合格 | OTHER | 5.6 mA | 1.6 mm | 无绳电话射频和基带电路 | 7.8 mm | 5.6 mm | |||||||||||||||||||||
![]() | SC14402CVJG | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | FLATPACK, LOW PROFILE, FINE PITCH | 3 V | 无 | Obsolete | NATIONAL SEMICONDUCTOR CORP | LFQFP, QFP100,.63SQ,20 | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.5 mm | unknown | S-PQFP-G100 | 不合格 | 1.6 mm | 无绳电话基带电路 | 14 mm | 14 mm | ||||||||||||||||||||||||||
![]() | SC14402CVJG | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | FLATPACK, LOW PROFILE, FINE PITCH | 3 V | 无 | Obsolete | NATIONAL SEMICONDUCTOR CORP | LFQFP, QFP100,.63SQ,20 | PLASTIC/EPOXY | LFQFP | QFP100,.63SQ,20 | SQUARE | e0 | 锡铅 | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.5 mm | unknown | S-PQFP-G100 | 不合格 | 1.6 mm | 无绳电话基带电路 | 14 mm | 14 mm | ||||||||||||||||||||||||||
![]() | TA31136FN | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | 2 V | Obsolete | TOSHIBA CORP | SOIC | LSSOP, | 85 °C | -30 °C | PLASTIC/EPOXY | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 0.65 mm | unknown | 16 | R-PDSO-G16 | 不合格 | OTHER | 4.6 mA | 1.6 mm | 无绳电话射频和基带电路 | 5 mm | 4.4 mm | ||||||||||||||||||||||||
![]() | SM5132DP | Nippon Precision Circuits Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 无 | Transferred | NIPPON PRECISION CIRCUITS INC | DIP, DIP16,.3 | 80 °C | -30 °C | PLASTIC/EPOXY | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T16 | 不合格 | 商业扩展 | 6 mA | ||||||||||||||||||||||||||||
![]() | S1A0429A01-S0BA | Samsung Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | 小概要 | 3 V | Obsolete | SAMSUNG SEMICONDUCTOR INC | SOIC | SOP, SOP16,.25 | 70 °C | -10 °C | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | compliant | 16 | R-PDSO-G16 | 不合格 | COMMERCIAL | 0.008 mA | 1.95 mm | 无绳电话射频和基带电路 | 9.9 mm | 3.95 mm | |||||||||||||||||||||||
![]() | TG2403CT | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | HVBCC | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3 V | 有 | 活跃 | TOSHIBA CORP | HVBCC, | 85 °C | -40 °C | UNSPECIFIED | 有 | 8542.39.00.01 | BOTTOM | BUTT | 未说明 | 1 | 0.5 mm | unknown | 未说明 | R-XBCC-B20 | 不合格 | INDUSTRIAL | 180 mA | 0.53 mm | 无绳电话射频和基带电路 | 3.9 mm | 2.9 mm | ||||||||||||||||||||||
![]() | TA31132FN | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 24 | LSSOP | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | 3.5 V | Obsolete | TOSHIBA CORP | SSOP | LSSOP, | 85 °C | -30 °C | PLASTIC/EPOXY | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 0.65 mm | unknown | 24 | R-PDSO-G24 | 不合格 | OTHER | 5 mA | 1.6 mm | 无绳电话射频和基带电路 | 7.8 mm | 5.6 mm | ||||||||||||||||||||||||
![]() | ML2724DH-T | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | TQFP | SQUARE | FLATPACK, THIN PROFILE | 3.3 V | Transferred | MICRO LINEAR CORP | QFP | TQFP, | 60 °C | -10 °C | PLASTIC/EPOXY | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.8 mm | unknown | 32 | S-PQFP-G32 | 不合格 | COMMERCIAL | 1.2 mm | 无绳电话射频和基带电路 | 7 mm | 7 mm | |||||||||||||||||||||||||
![]() | ML2725ADH | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | SQUARE | FLATPACK, THIN PROFILE | Obsolete | MICRO LINEAR CORP | QFP | TQFP, | 60 °C | -10 °C | PLASTIC/EPOXY | TQFP | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.8 mm | unknown | 32 | S-PQFP-G32 | 不合格 | COMMERCIAL | 1.2 mm | 无绳电话射频和基带电路 | 7 mm | 7 mm | ||||||||||||||||||||||||||
![]() | SC14437A2MS3VYXN | Sitel Semiconductor BV | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SC14404BFLBC | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Obsolete | NATIONAL SEMICONDUCTOR CORP | LFBGA, | PLASTIC/EPOXY | 8542.39.00.01 | BOTTOM | BALL | 1 | 0.8 mm | unknown | S-PBGA-B100 | 不合格 | 1.5 mm | 无绳电话基带电路 | 10 mm | 10 mm | |||||||||||||||||||||||||||||||
![]() | SC14404BFLBC | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | LFBGA | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Obsolete | NATIONAL SEMICONDUCTOR CORP | LFBGA, | PLASTIC/EPOXY | 8542.39.00.01 | BOTTOM | BALL | 1 | 0.8 mm | unknown | S-PBGA-B100 | 不合格 | 1.5 mm | 无绳电话基带电路 | 10 mm | 10 mm | |||||||||||||||||||||||||||||||
![]() | TK10492M | TOKO Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | 小概要 | 3 V | Obsolete | TOKO INC | SOP, | 70 °C | -30 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | R-PDSO-G16 | 不合格 | OTHER | 4.4 mA | 1.94 mm | 无绳电话射频和基带电路 | 9.9 mm | 3.9 mm |
BBS2600STBR
Intel
分类:Serial Device Servers
R1208WFQYSR
Intel
分类:Serial Device Servers
LIME2-SERVER-128GB-SSD
Olimex
分类:Serial Device Servers
LIME2-SERVER-512GB-SSD
Olimex
分类:Serial Device Servers
STE-716BI
ICOMTECH, INC.
分类:Serial Device Servers
STE-708BI
ICOMTECH, INC.
分类:Serial Device Servers
KA8510Q
Samsung Semiconductor
分类:Serial Device Servers
ML2725DH
RF Micro Devices Inc
分类:Serial Device Servers
MC13158FTBR2
Motorola Semiconductor Products
分类:Serial Device Servers
MC13110BFTA
Freescale Semiconductor
分类:Serial Device Servers
TA31165CFLG(LAEF)
Toshiba America Electronic Components
分类:Serial Device Servers
TA31137FNG
Toshiba America Electronic Components
分类:Serial Device Servers
SC14402CVJG
Texas Instruments
分类:Serial Device Servers
SC14402CVJG
National Semiconductor Corporation
分类:Serial Device Servers
TA31136FN
Toshiba America Electronic Components
分类:Serial Device Servers
SM5132DP
Nippon Precision Circuits Inc
分类:Serial Device Servers
S1A0429A01-S0BA
Samsung Semiconductor
分类:Serial Device Servers
TG2403CT
Toshiba America Electronic Components
分类:Serial Device Servers
TA31132FN
Toshiba America Electronic Components
分类:Serial Device Servers
ML2724DH-T
RF Micro Devices Inc
分类:Serial Device Servers
ML2725ADH
RF Micro Devices Inc
分类:Serial Device Servers
SC14437A2MS3VYXN
Sitel Semiconductor BV
分类:Serial Device Servers
SC14404BFLBC
National Semiconductor Corporation
分类:Serial Device Servers
SC14404BFLBC
Texas Instruments
分类:Serial Device Servers
TK10492M
TOKO Inc
分类:Serial Device Servers
