N/A

-

表面贴装

551-LFBGA

551-LFBGA (21x21)

Renesas Electronics America Inc

Tray

活跃

-40°C ~ 85°C (TA)

*

200MHz, 1.2GHz

ARM® Cortex®-A55, ARM® Cortex®-M33

1.8V, 3.3V

10/100/1000Mbps (2)

2 Core, 64-Bit

无

DDR3L, DDR4

USB 2.0 (2)

CANbus, eMMC/SD/SDIO, I²C, SPI, UART

ARM® Mali-G31

-

MIPI/CSI, MIPI/DSI

-

N/A

-

PCIe

64 Bit

N/A

-

表面贴装

621-FBGA, FCBGA

621-FCPBGA (17x17)

NXP USA Inc.

有

AEC-Q100

450

935438206557

NXP

恩智浦半导体

Details

Bulk

活跃

-40°C ~ 125°C (TJ)

Tray

FS32V23

Microcontrollers - MCU

800MHz

ARM® Cortex®-A53

ARM Microcontrollers - MCU

1V, 1.8V, 3.3V

GbE

4 Core, 32/64-Bit

无

DDR3, DDR3L, LPDDR2

-

I²C, SPI, PCI, UART

ARM® Cortex®-M4

AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG

APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU

-

ARM Microcontrollers - MCU

N/A

-

表面贴装

621-FBGA, FCBGA

621-FCPBGA (17x17)

NXP USA Inc.

有

AEC-Q100

450

935438209557

NXP

恩智浦半导体

Details

Bulk

活跃

-40°C ~ 125°C (TJ)

Tray

FS32V23

Microcontrollers - MCU

1GHz

ARM® Cortex®-A53

ARM Microcontrollers - MCU

1V, 1.8V, 3.3V

GbE

4 Core, 32/64-Bit

无

DDR3, DDR3L, LPDDR2

-

I²C, SPI, PCI, UART

ARM® Cortex®-M4

AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG

APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU

-

ARM Microcontrollers - MCU

N/A

-

BGA-270

+ 85 C

- 40 C

SMD/SMT

1.7 V to 1.95 V

I2S/Serial I2C/SPI/U

64 Bit

N/A

-

N/A

-

N/A

-

FCLGA-3647

有

2.1 GHz

5218R

Revision 3.0

+ 87 C

27.5 MB

1

6 Channel

Cascade Lake

999VLN

Intel

Intel

英特尔转强

Non-Embedded

Details

DDR4-2667

1 V

Bulk

Gold 5218R

Embedded Processors & Controllers

1.8 V

Serial I2C/PCIe/JTAG

1 TB

英特尔转强

64 Bit

CPU - Central Processing Units

16 Core

Server Processors

CPU - Central Processing Units

N/A

-

LGA-16

Intel

Details

3.6 GHz

18 MB

1

SMD/SMT

99AHJ7

Intel

Tray

6334

Embedded Processors & Controllers

CPU - Central Processing Units

CPU - Central Processing Units

N/A

-

N/A

-

FC-LGA-16A

Intel

Intel

英特尔转强

Details

250 W

+ 81 C

SMD/SMT

Ice Lake

Non-Embedded

DDR4-3200

2.6 GHz

8358

48 MB

1

99A9KF

Tray

Embedded Processors & Controllers

6 TB

英特尔转强

64 bit

CPU - Central Processing Units

32 Core

Embedded Processors

CPU - Central Processing Units

N/A

-

NXP USA Inc.

活跃

N/A

-

FCLGA-3647

Revision 3.0

+ 85 C

24.75 MB

1

SMD/SMT

6 Channel

Cascade Lake

999FP1

Intel

Intel

Xeon

Non-Embedded

DDR4-2933

150 W

2.6 GHz

Intel Xeon Gold 6240

Bulk

6240

Embedded Processors & Controllers

1 TB

英特尔转强

64 bit

CPU - Central Processing Units

18 Core

Server Processors

CPU - Central Processing Units

N/A

-

FCLGA-3647

2.2 GHz

Intel Xeon Silver 4214Y

Revision 3.0

+ 77 C

16.5 MB

1

SMD/SMT

6 Channel

Cascade Lake

999DKL

Intel

Intel

Xeon

Non-Embedded

Details

DDR4-2400

85 W

Tray

4214Y

Embedded Processors & Controllers

1 TB

英特尔转强

64 bit

CPU - Central Processing Units

12 Core

Server Processors

CPU - Central Processing Units

N/A

-

68-LCC (J-Lead)

YES

68-PLCC (24.23x24.23)

68

Intersil

CHIP CARRIER

PLASTIC/EPOXY

-40 °C

5 V

4.5 V

85 °C

QCCJ

SQUARE

活跃

RENESAS ELECTRONICS CORP

5.5 V

5.77

LB1S-3LT2

CE, CSA, UL

IDEC

Bulk

活跃

QCCJ,

-40°C ~ 85°C (TA)

80C286

3

CMOS

QUAD

J BEND

1.27 mm

compliant

S-PQCC-J68

INDUSTRIAL

12.5MHz

MICROPROCESSOR

80C286

4.57 mm

24

NO

YES

16

固定点

NO

5V

-

1 Core, 16b

无

-

-

-

Math Engine; 80C287

-

-

-

2NO, 2NC

24.23 mm

24.23 mm

N/A

-

BR250H

Cutler Hammer, Div of Eaton Corp

N/A

-

YES

196

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA196,14X14,30

-40 °C

1.2 V

1.1 V

85 °C

24 MHz

TFBGA

SQUARE

活跃

MICROCHIP TECHNOLOGY INC

1.32 V

5.28

HS350600C3330

Danaher Controls

TFBGA-196

8542.31.00.01

CMOS

BOTTOM

BALL

0.75 mm

compliant

S-PBGA-B196

INDUSTRIAL

500 MHz

MICROPROCESSOR, RISC

32

1.2 mm

26

YES

YES

32

浮点

YES

131072

125

8

51

11 mm

11 mm

N/A

-

YES

196

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA196,14X14,30

-40 °C

1.2 V

1.1 V

105 °C

24 MHz

TFBGA

SQUARE

活跃

MICROCHIP TECHNOLOGY INC

1.32 V

5.28

ACH580-BCR-027A4B6EFK51L1

ABB

TFBGA, BGA196,14X14,30

8542.31.00.01

CMOS

BOTTOM

BALL

0.75 mm

compliant

S-PBGA-B196

INDUSTRIAL

500 MHz

MICROPROCESSOR, RISC

32

1.2 mm

26

YES

YES

32

浮点

YES

131072

125

8

51

11 mm

11 mm

N/A

-

N/A

-

NXP USA Inc.

Tray

活跃

-

N/A

-

FCLGA-1200

65 W

3.6 GHz

i3-10100

Revision 3.0

1 Configuration

+ 100 C

6 MB

1

SMD/SMT

2 Channel

Comet Lake

999TKG

Intel

Intel

1x16, 2x8, 1x8 + 2x4

3 Display

Non-Embedded

Details

DDR4-2666

Tray

i3-10100

Embedded Processors & Controllers

1200

PCIe

128 GB

Intel Core i3

64 Bit

CPU - Central Processing Units

4 Core

Desktop Processors

CPU - Central Processing Units

N/A

-

N/A

-

225-LFBGA

225-FBGA (13x13)

Renesas Electronics America Inc

Tray

R9A07

活跃

119

Renesas Electronics

Renesas Electronics

Details

-40°C ~ 125°C (TJ)

Tray

RZ/T2M

Microprocessors - MPU

600MHz, 800MHz

ARM® Cortex®-R52

Microprocessors - MPU

1.8V, 3.3V

10/100/1000Mbps (2)

2 Core, 32-Bit

无

-

USB 2.0 (1)

CANbus, I²C, SCI, SPI, WDT

Multimedia; NEON™ SIMD

Boot Security, Crypto Accelerator, JTAG, TRNG

-

-

Microprocessors - MPU

N/A

-

1000

NXP

恩智浦半导体

Details

Reel

恩智浦半导体

N/A

-