N/A

-

表面贴装

425-VFBGA, FCCSPBGA

425-FCCSP (13x13)

-40°C ~ 125°C (TJ)

Tape & Reel (TR)

Sitara™

活跃

1GHz

ARM® Cortex®-A53

1.1V, 1.2V, 1.8V, 3.3V

10/100/1000Mbps (2)

1 Core, 64-Bit

无

DDR4, LPDDR4

USB 2.0 (2)

DMA, GPIO, I2C, I2S, MMC/SD, QSPI, SPDIF, SPI, TDM, UART/USART

ARM® Cortex®-M4F, ARM® Cortex®-R5F, Multimedia; NEON™

AES, ARM TZ, Cryptography, DRBG, ECC, MD5, PKA, Random Number Generator, RSA, Secure Boot, SHA2, SMS

LVDS, MIPI/CSI, MIPI-DPI, OLDI

N/A

-

表面贴装

425-VFBGA, FCCSPBGA

425-FCCSP (13x13)

-40°C ~ 125°C (TJ)

Tape & Reel (TR)

Sitara™

活跃

1.4GHz

ARM® Cortex®-A53

1.1V, 1.2V, 1.8V, 3.3V

10/100/1000Mbps (2)

1 Core, 64-Bit

无

DDR4, LPDDR4

USB 2.0 (2)

DMA, GPIO, I2C, I2S, MMC/SD, QSPI, SPDIF, SPI, TDM, UART/USART

ARM® Cortex®-M4F, ARM® Cortex®-R5F, Multimedia; NEON™

AES, ARM TZ, Cryptography, DRBG, ECC, MD5, PKA, Random Number Generator, RSA, Secure Boot, SHA2, SMS

LVDS, MIPI/CSI, MIPI-DPI, OLDI

N/A

-

表面贴装

1046-VFBGA

1046-VFBGA (15x15)

-40°C ~ 105°C (TJ)

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®

活跃

2GHz, 2.2GHz

ARM® Cortex®-A55, ARM® Cortex®-A78

1.2V, 1.8V

MII, RGMII, RMII

4, 4 Core, 64-Bit

有

LPDDR4x

USB 2.0 (2), USB 3.1 (2)

I2C, I2S, MMC/SD/SDIO, PCM, SPI, UART

ARM® Mali-G57MC5

AES, ARM TZ, Boot Security

MIPI-CSI

N/A

-

N/A

-

表面贴装

425-VFBGA, FCCSPBGA

425-FCCSP (13x13)

-40°C ~ 125°C (TJ)

Tape & Reel (TR)

Sitara™

活跃

1.4GHz

ARM® Cortex®-A53

1.1V, 1.2V, 1.8V, 3.3V

10/100/1000Mbps (2)

4 Core, 64-Bit

无

DDR4, LPDDR4

USB 2.0 (2)

DMA, GPIO, I2C, I2S, MMC/SD, QSPI, SPDIF, SPI, TDM, UART/USART

ARM® Cortex®-M4F, ARM® Cortex®-R5F, Multimedia; NEON™

AES, ARM TZ, Cryptography, DRBG, ECC, MD5, PKA, Random Number Generator, RSA, Secure Boot, SHA2, SMS

LVDS, MIPI/CSI, MIPI-DPI, OLDI

N/A

-

表面贴装

1046-VFBGA

1046-VFBGA (15x15)

-20°C ~ 65°C (TA)

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®

活跃

2GHz, 2.2GHz

ARM® Cortex®-A55, ARM® Cortex®-A78

1.2V, 1.8V

MII, RGMII, RMII

4, 4 Core, 64-Bit

有

LPDDR4x

USB 2.0 (2), USB 3.1 (2)

I2C, I2S, MMC/SD/SDIO, PCM, SPI, UART

ARM® Mali-G57MC5

AES, ARM TZ, Boot Security

MIPI-CSI

N/A

-

表面贴装

361-VFBGA

361-VFBGA (10x10)

-40°C ~ 125°C (TJ)

Tape & Reel (TR)

STM32MP2

活跃

1.5GHz

ARM® Cortex®-A35, ARM® Cortex®-M0+, ARM® Cortex®-M33

1.8V, 3.3V

10/100/1000Mbps (3)

2, 1, 1 Core, 32-Bit

有

DDR3L, DDR4, LPDDR4

USB 2.0 (1), USB 3.0 (1), USB Type-C (1)

GPIO, DMA, CANbus, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART

GPU

ARM TZ, Boot Security, TRNG

LCD, LVDS, MIPI-CSI2

N/A

-

表面贴装

424-VFBGA

424-VFBGA (14x14)

-40°C ~ 125°C (TJ)

Tray

STM32MP2

活跃

1.5GHz

ARM® Cortex®-A35, ARM® Cortex®-M0+, ARM® Cortex®-M33

1.8V, 3.3V

10/100/1000Mbps (3)

2, 1, 1 Core, 32-Bit

有

DDR3L, DDR4, LPDDR4

USB 2.0 (1), USB 3.0 (1), USB Type-C (1)

GPIO, DMA, CANbus, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART

GPU

ARM TZ, Boot Security, TRNG

LCD, LVDS, MIPI-CSI2

N/A

-

表面贴装

1204-VFBGA

1204-VFBGA (15x15)

-40°C ~ 105°C (TJ)

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®

活跃

2GHz, 2.2GHz

ARM® Cortex®-A55, ARM® Cortex®-A78

1.2V, 1.8V

MII, RGMII, RMII

4, 2 Core, 64-Bit

有

LPDDR4x

USB 2.0 (2), USB 3.1 (1)

I2C, I2S, MMC/SD/SDIO, PCM, SPI, UART

ARM® Mali-G57MC2

AES

MIPI-CSI

N/A

-

表面贴装

1204-VFBGA

1204-VFBGA (15x15)

-20°C ~ 95°C (TJ)

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®

活跃

2GHz, 2.2GHz

ARM® Cortex®-A55, ARM® Cortex®-A78

1.2V, 1.8V

MII, RGMII, RMII

4, 2 Core, 64-Bit

有

LPDDR4x

USB 2.0 (2), USB 3.1 (1)

I2C, I2S, MMC/SD/SDIO, PCM, SPI, UART

ARM® Mali-G57MC2

AES

MIPI-CSI

N/A

-

表面贴装

292-BCBGA Exposed Pad

292-CBGA (21x21)

-40°C ~ 105°C (TJ)

Bulk

活跃

933MHz

PowerPC 750GL

1.8V, 2.5V, 3.3V

1 Core, 32-Bit

无

N/A

-

YES

783

无

Obsolete

FREESCALE SEMICONDUCTOR INC

133 MHz

3

105 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA783,28X28,40

SQUARE

网格排列

1.155 V

1.045 V

1.1 V

e0

无

3A991.A.2

锡铅

8542.31.00.01

BOTTOM

BALL

260

1 mm

not_compliant

40

S-PBGA-B783

不合格

1333 MHz

MICROPROCESSOR, RISC

32

64

YES

AEC-Q100

64

浮点

N/A

-

YES

356

无

Obsolete

INTEL CORP

BGA

BGA,

3.6864 MHz

1

PLASTIC/EPOXY

BGA

SQUARE

网格排列

1.485 V

1.2825 V

1.35 V

8542.31.00.01

BOTTOM

BALL

compliant

356

S-PBGA-B356

不合格

416 MHz

MICROPROCESSOR, RISC

32

26

YES

YES

32

固定点

YES

N/A

-

YES

208

QFP, QFP208,1.2SQ,20

70 °C

PLASTIC/EPOXY

QFP

QFP208,1.2SQ,20

SQUARE

FLATPACK

3.3 V

Obsolete

NXP SEMICONDUCTORS

QFP

8542.31.00.01

QUAD

鸥翼

0.5 mm

compliant

208

S-PQFP-G208

不合格

COMMERCIAL

40 MHz

MICROPROCESSOR, RISC

32

N/A

-

N/A

-

N/A

-

YES

360

MOTOROLA INC

25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360

100 MHz

PLASTIC/EPOXY

BGA

SQUARE

网格排列

2.1 V

1.9 V

2 V

无

Transferred

e0

3A991.A.2

Tin/Lead (Sn/Pb)

8542.31.00.01

BOTTOM

BALL

1.27 mm

unknown

S-PBGA-B360

不合格

350 MHz

MICROPROCESSOR, RISC

32

2.77 mm

32

YES

YES

64

浮点

YES

25 mm

25 mm

N/A

-

YES

360

BGA

RECTANGULAR

网格排列

2.1 V

1.9 V

2 V

Obsolete

NXP SEMICONDUCTORS

BGA,

PLASTIC/EPOXY

8542.31.00.01

BOTTOM

BALL

unknown

R-PBGA-B360

350 MHz

MICROPROCESSOR, RISC

YES

NO

固定点

NO

N/A

-

YES

360

BGA

BGA,

100 MHz

PLASTIC/EPOXY

BGA

SQUARE

网格排列

2.1 V

1.9 V

2 V

Transferred

FREESCALE SEMICONDUCTOR INC

3A991

8542.31.00.01

BOTTOM

BALL

1.27 mm

unknown

360

S-PBGA-B360

不合格

350 MHz

MICROPROCESSOR, RISC

32

2.77 mm

32

YES

YES

64

浮点

YES

25 mm

25 mm

N/A

-

YES

360

无

Obsolete

FREESCALE SEMICONDUCTOR INC

BGA

BGA, BGA360,19X19,50

200 MHz

1

105 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

网格排列

1.15 V

1.05 V

1.1 V

e0

3A991

Tin/Lead (Sn/Pb)

睡眠模式功耗低

8542.31.00.01

BOTTOM

BALL

245

1.27 mm

not_compliant

30

360

S-CBGA-B360

不合格

INDUSTRIAL

1267 MHz

MICROPROCESSOR, RISC

32

2.8 mm

36

YES

YES

64

浮点

YES

25 mm

25 mm

N/A

-

YES

357

Obsolete

MOTOROLA INC

BGA

BGA, BGA357,19X19,50

66 MHz

3.3 V

3.135 V

3.465 V

网格排列

SQUARE

BGA357,19X19,50

BGA

PLASTIC/EPOXY

-40 °C

3A991.A.2

8542.31.00.01

BOTTOM

BALL

1.27 mm

unknown

357

S-PBGA-B357

不合格

66 MHz

MICROPROCESSOR, RISC

32

2.05 mm

32

YES

YES

32

固定点

YES

25 mm

25 mm

N/A

-

87 In Stock

-

YES

481

有

Obsolete

ADVANCED MICRO DEVICES INC

BGA

LEAD FREE, MS-034BAU-1, BGU-481

27 MHz

3

85 °C

PLASTIC/EPOXY

HBGA

BGA481,31X31,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

1.89 V

1.71 V

1.8 V

e2

3A991.A.1

锡银

ALSO REQUIRES 3.3V SUPPLY

8542.31.00.01

BOTTOM

BALL

260

1.27 mm

unknown

481

S-PBGA-B481

不合格

OTHER

266 MHz

MICROPROCESSOR

32

2.59 mm

32

YES

YES

32

浮点

YES

40 mm

40 mm

N/A

-

N/A

-

NO

40

NATIONAL SEMICONDUCTOR CORP

DIP,

8 MHz

90 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DIP

RECTANGULAR

IN-LINE

5.5 V

4.5 V

5 V

Obsolete

8542.31.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-CDIP-T40

不合格

OTHER

4 MHz

MICROPROCESSOR

8

5.08 mm

16

NO

YES

8

固定点

NO

15.24 mm