类别是'category.片上系统(SoC)' (7720)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 表面安装 | 越来越多的功能 | 引脚数 | 触点形状 | 外壳材料 | 供应商器件包装 | 质量 | 插入材料 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | 终端 | 温度系数 | 连接器类型 | 类型 | 电阻 | 定位的数量 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 组成 | 颜色 | 应用 | 功率(瓦特) | HTS代码 | 紧固类型 | 子类别 | 触点类型 | 技术 | 电压 - 供电 | 端子位置 | 方向 | 终端形式 | 屏蔽/屏蔽 | 峰值回流焊温度(摄氏度) | 入口保护 | 端子间距 | Reach合规守则 | 频率 | 频率稳定性 | 基本部件号 | 外壳完成 | 外壳尺寸-插入 | JESD-30代码 | 输出的数量 | 资历状况 | 房屋颜色 | 工作电源电压 | ESR(等效串联电阻) | 失败率 | 电源 | 温度等级 | 注意 | 界面 | 负载电容 | 速度 | 内存大小 | 反向泄漏电流@ Vr | 操作模式 | 外壳尺寸,MIL | 不同 If 时电压 - 正向 (Vf) | 核心处理器 | 频率容差 | 周边设备 | 程序存储器类型 | 程序内存大小 | 连接方式 | 电流源 | 建筑学 | 工作温度 - 结点 | 输入数量 | 组织结构 | 座位高度-最大 | 电压 - 直流逆向(Vr)(最大值) | 平均整流电流(Io) | 可编程逻辑类型 | 工具类型 | 逻辑元件/单元数 | 产品类别 | 包括 | 总 RAM 位数 | 电容@Vr, F | LABs数量/ CLBs数量 | 速度等级 | 收发器数量 | 主要属性 | 寄存器数量 | 逻辑块数量 | 逻辑单元数 | 核数量 | 结束 - 大小 | 等效门数 | 闪光大小 | 控制器系列 | 特征 | 产品类别 | 计数 | 座位高度(最大) | 长度 | 宽度 | 材料可燃性等级 | 评级结果 | |||||||||||||||||||||||||||||||||||||||||||||
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![]() | 10AS032H3F34E2LG | ALTERA | 数据表 | 910 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-1152 | YES | 1152 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 320000 LE | 1 | SMD/SMT | 40000 LAB | 964899 | Intel | Intel / Altera | Arria 10 SoC | Details | PEI-Genesis | 2 x 32 kB | - | 5.45 | 0.93 V | INTEL CORP | 活跃 | SQUARE | BGA | 10AS032H3F34E2LG | 有 | 100 °C | 0.87 V | 未说明 | 0.9 V | BGA1152,34X34,40 | PLASTIC/EPOXY | 网格排列 | BGA, BGA1152,34X34,40 | Bulk | 活跃 | 384 | 0°C ~ 100°C (TJ) | Tray | * | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 384 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066K2F35I2SG | ALTERA | 数据表 | 773 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 0603 (1608 Metric) | YES | 0603 | 1152 | 活跃 | 396 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 660000 LE | 24 | SMD/SMT | 82500 LAB | 973537 | Intel | Intel / Altera | Arria 10 SoC | KOA Speer Electronics, Inc. | Details | 2 x 32 kB | - | 0.93 V | 5.46 | INTEL CORP | 活跃 | SQUARE | BGA | 10AS066K2F35I2SG | 有 | 100 °C | 0.87 V | 未说明 | 0.9 V | -40 °C | BGA1152,34X34,40 | PLASTIC/EPOXY | 网格排列 | BGA, BGA1152,34X34,40 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | RN73R1J | -55°C ~ 155°C | Tray | RN73R | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±0.25% | 活跃 | 2 | ±50ppm/°C | 560 Ohms | Thin Film | 0.1W, 1/10W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | - | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | Automotive AEC-Q200, Moisture Resistant | SoC FPGA | 0.022 (0.55mm) | 35 mm | 35 mm | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057K4F40E3SG | ALTERA | 数据表 | 510 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | YES | 1517-FCBGA (40x40) | 1517 | Details | Arria 10 SoC | Intel / Altera | Intel | 965070 | 71250 LAB | SMD/SMT | 1 | 570000 LE | 1.2 GHz | 2 x 32 kB | Suntsu Electronics, Inc. | This product may require additional documentation to export from the United States. | 有 | BGA, BGA1517,39X39,40 | 网格排列 | PLASTIC/EPOXY | BGA1517,39X39,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS057K4F40E3SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | Bulk | 活跃 | 696 | - | 2 x 32 kB | -20°C ~ 70°C | Tray | SXT224 | 0.098 L x 0.079 W (2.50mm x 2.00mm) | 活跃 | 兆赫晶体 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | 19.2 MHz | ±30ppm | S-PBGA-B1517 | 696 | 不合格 | 100 Ohms | 0.9 V | OTHER | 18pF | 1.5GHz | 256KB | Fundamental | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | ±15ppm | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 696 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | SoC FPGA | 0.026 (0.65mm) | 40 mm | 40 mm | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032H1F34E1HG | ALTERA | 数据表 | 679 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | 965058 | Intel | Intel / Altera | Arria 10 SoC | Reliance North America | Details | 2 x 32 kB | - | 有 | 10AS032H1F34E1HG | 活跃 | INTEL CORP | 5.66 | Tape & Box (TB) | 活跃 | 384 | 有 | 2 x 32 kB | 1.2 GHz | 320000 LE | + 100 C | 0 C | 24 | SMD/SMT | 40000 LAB | 0°C ~ 100°C (TJ) | Tray | * | 活跃 | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 24 Transceiver | FPGA - 320K Logic Elements | 2 Core | -- | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057H2F34E2SG | ALTERA | 数据表 | 603 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 570000 LE | 24 | SMD/SMT | 71250 LAB | 965358 | Intel | Intel / Altera | Arria 10 SoC | Details | KEMET | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS057H2F34E2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | Tape & Box (TB) | 活跃 | 492 | 有 | 0°C ~ 100°C (TJ) | Tray | * | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 492 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032H4F34E3LG | ALTERA | 数据表 | 776 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Panel Mount, Through Hole | FBGA-1152 | YES | Flange | Aluminum | 1152 | Copper Alloy | Gold | 384 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 320000 LE | 1 | SMD/SMT | 40000 LAB | 964935 | Intel | Glenair | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS032H4F34E3LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | 零售包装 | Metal | 活跃 | -65°C ~ 175°C | Tray | 806 | 活跃 | Solder | Plug, Male Pins | Silver | 8542.39.00.01 | Threaded | SOC - Systems on a Chip | CMOS | BOTTOM | B | BALL | 未说明 | 1 mm | compliant | 化学镍 | 20-4 | S-PBGA-B1152 | 384 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | Ground | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027E1F29E1HG | ALTERA | 数据表 | 928 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Panel Mount, Through Hole | 780-BBGA, FCBGA | Flange | 不锈钢 | 780-FBGA (29x29) | Glenair | + 100 C | 270000 LE | 1.2 GHz | 2 x 32 kB | 有 | 零售包装 | Metal | 活跃 | Copper Alloy | Gold | 360 | - | 2 x 32 kB | Details | Arria 10 SoC | Intel / Altera | Intel | 965040 | 33750 LAB | SMD/SMT | 36 | 0 C | -65°C ~ 175°C | Tray | 806 | 活跃 | Solder | Plug, Male Pins | Silver | Threaded | SOC - Systems on a Chip | B | Passivated | 22-28 | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 12 Transceiver | FPGA - 270K Logic Elements | 2 Core | -- | Ground | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS022E4F29I3LG | ALTERA | 数据表 | 533 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | DO-214AC, SMA | SMA (DO-214AC) | SMC 二极管解决方案 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 活跃 | 288 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 220000 LE | 1 | SMD/SMT | 27500 LAB | 965278 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | -40°C ~ 100°C (TJ) | Tray | * | 活跃 | SOC - Systems on a Chip | Schottky | No Recovery Time > 500mA (Io) | 256KB | 500 µA @ 100 V | 850 mV @ 1 A | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -55°C ~ 150°C | 100 V | 1A | SoC FPGA | 35pF @ 4V, 1MHz | FPGA - 220K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032H4F34E3SG | ALTERA | 数据表 | 851 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 48-VFQFN Exposed Pad | YES | 48-QFN (7x7) | 1152 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 320000 LE | 1 | SMD/SMT | 40000 LAB | 964978 | Intel | Intel / Altera | Arria 10 SoC | Infineon Technologies | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS032H4F34E3SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.44 | 36 | Tape & Reel (TR) | CY8C20646 | Obsolete | -40°C ~ 85°C | Tray | CapSense® Controllers | 活跃 | 电容式传感 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | 1.71V ~ 5.5V | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 384 | 不合格 | 0.9 V | OTHER | I²C, SPI, USB | 1.5GHz | 2K x 8 | M8C | DMA, POR, WDT | FLASH (16kB) | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | CY8C20xx6A | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS016E3F29I2SG | ALTERA | 数据表 | 925 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 780-BBGA, FCBGA | YES | 780-FBGA (29x29) | 780 | 有 | 2 x 32 kB | 1.2 GHz | 160000 LE | 1 | SMD/SMT | 20000 LAB | 964682 | Intel | Intel / Altera | Arria 10 SoC | 2 x 32 kB | Glenair | - | BGA, BGA780,28X28,40 | 网格排列 | PLASTIC/EPOXY | BGA780,28X28,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS016E3F29I2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 1.96 | 零售包装 | 活跃 | 288 | Non-Compliant | -40°C ~ 100°C (TJ) | Tray | * | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B780 | 288 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 3.35 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 160K Logic Elements | 160000 | 2 Core | -- | SoC FPGA | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027H2F34I2LG | ALTERA | 数据表 | 503 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-1152 | YES | 1152 | 1.2 GHz | 270000 LE | 1 | SMD/SMT | 33750 LAB | 964800 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS027H2F34I2LG | BGA | SQUARE | 活跃 | INTEL CORP | 5.43 | 0.93 V | 384 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 384 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GUT2100 S LKJQ | Intel | 数据表 | 214 In Stock | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z007S-1CLG400C5283 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 1152-BBGA, FCBGA | 1152-HBGA, FC (42.5x42.5) | 744 | -40°C ~ 100°C (TJ) | STRATIX® IV E | 活跃 | 0.87 V ~ 0.93 V | EP4SE820 | 813050 | 34093056 | 32522 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU25DR-L2FSVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Molex | Bulk | 075577 | 活跃 | Tray | * | 活跃 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU28DR-L1FFVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | TE Connectivity Deutsch 连接器 | Bag | AFD57 | 活跃 | Tray | MIL-DTL-26482 G Series II, AFD | 活跃 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F500M3G-1PQG208I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 面板安装 | 208-BFQFP | YES | Flange | Circular | Composite | 208-PQFP (28x28) | Plastic | 208 | 微芯片技术 | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.59 | -- | 20 | MCU - 22, FPGA - 66 | Tray | A2F500 | 活跃 | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | QFP208,1.2SQ,20 | 1.5 V | 30 | 1.425 V | 有 | A2F500M3G-1PQG208I | 100 MHz | FQFP | SQUARE | -65°C ~ 175°C | Bulk | MIL-DTL-38999 Series III, ACT | 活跃 | -- | 插座外壳 | 用于内螺纹插座 | 10 | Pure Matte Tin (Sn) | 8542.39.00.01 | Threaded | 现场可编程门阵列 | Crimp | CMOS | QUAD | B | 鸥翼 | Shielded | 245 | 抗环境干扰 | 0.5 mm | compliant | Chromate over Cadmium | 13-98 | S-PQFP-G208 | 66 | 不合格 | 橄榄色 | 1.5,1.8,2.5,3.3 V | 不包括触点 | 100MHz | 64KB | C | ARM® Cortex®-M3 | DMA, POR, WDT | Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 11520 CLBS, 500000 GATES | 4.1 mm | 现场可编程门阵列 | -- | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 500000 | 512KB | -- | 28 mm | 28 mm | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PIMX8QM5AVUDDAA | NXP | 数据表 | 100000 In Stock | - | 最小起订量: 1 最小包装量: 1 | 面板安装 | Flange | Circular | Composite | Plastic | -- | 12 (12), 16 (12) | -65°C ~ 200°C | Bulk | MIL-DTL-38999 Series III, ACT | 活跃 | -- | 插座外壳 | 用于内螺纹插座 | 24 | Threaded | Crimp | A | Shielded | 抗环境干扰 | 化学镍 | 25-24 | Silver | 不包括触点 | J | -- | -- | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS022C4U19I3SG | ALTERA | 数据表 | 874 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 6-CLCC | YES | 484 | 6-CLCC (7x5) | 484 | 5.46 | 192 | Compliant | FBGA, BGA484,22X22,32 | GRID ARRAY, FINE PITCH | PLASTIC/EPOXY | BGA484,22X22,32 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS022C4U19I3SG | FBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 0.93 V | -40°C ~ 85°C | Tape & Reel (TR) | FemtoClock® NG | 活跃 | VCXO | 100 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | 2.375 V ~ 2.625 V | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 155.52MHz | IDT8N3SV75LC | S-PBGA-B484 | 192 | 不合格 | 1.8 V | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 120mA | MCU, FPGA | 192 | 3.25 mm | 现场可编程门阵列 | 3 | FPGA - 220K Logic Elements | 334920 | 220000 | -- | -- | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1502-1LSIVFVC1760 | AMD | 数据表 | 578 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | Non-Compliant | 500 | Tray | 活跃 | Versal™ Prime | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BCM3384EUKFSBGB0T | Broadcom | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | -- | Broadcom Limited | Tray | Obsolete | -- | 活跃 | 扳手套件 | 1-1/8 ~ 1-1/2 | Set of 5, Angled 15° | Assorted | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU6EG-3FFVC900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 204 | Tray | XCZU6 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU2EG-L1SFVA625I | AMD | 数据表 | 2203 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | 180 | Tray | XCZU2 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU17EG-1FFVC1760I | AMD | 数据表 | 827 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 512 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-2MLIVIVA1596 | AMD | 数据表 | 664 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1802-1MLIVSVD1760 | AMD | 数据表 | 750 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - |
10AS032H3F34E2LG
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分类:Embedded - System On Chip (SoC)
16,459.061439
10AS066K2F35I2SG
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分类:Embedded - System On Chip (SoC)
38,330.844272
10AS057K4F40E3SG
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22,849.599280
10AS032H1F34E1HG
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21,948.474749
10AS057H2F34E2SG
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10AS032H4F34E3LG
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12,528.418043
10AS027E1F29E1HG
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13,803.799150
10AS022E4F29I3LG
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10AS032H4F34E3SG
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10,013.384994
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6,193.016438
10AS027H2F34I2LG
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20,064.156028
GUT2100 S LKJQ
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XC7Z007S-1CLG400C5283
AMD
分类:Embedded - System On Chip (SoC)
XCZU25DR-L2FSVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU28DR-L1FFVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
A2F500M3G-1PQG208I
Microchip
分类:Embedded - System On Chip (SoC)
PIMX8QM5AVUDDAA
NXP
分类:Embedded - System On Chip (SoC)
10AS022C4U19I3SG
ALTERA
分类:Embedded - System On Chip (SoC)
6,081.535183
XCVM1502-1LSIVFVC1760
AMD
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XCZU6EG-3FFVC900E
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3,445.180888
XCZU17EG-1FFVC1760I
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分类:Embedded - System On Chip (SoC)
51,549.455428
XCVC1902-2MLIVIVA1596
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