类别是'category.片上系统(SoC)' (7720)

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表面安装

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供应商器件包装

房屋材料

终端数量

触点材料 - 配套

触点材料 - 柱子

板材

厂商

操作温度

包装

系列

JESD-609代码

零件状态

湿度敏感性等级(MSL)

终端

端子表面处理

附加功能

HTS代码

子类别

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Reach合规守则

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JESD-30代码

输出的数量

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触点表面处理 - 柱子

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核心处理器

周边设备

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建筑学

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产品类别

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收发器数量

转换自(适配器端)

转换(适配器端)

主要属性

寄存器数量

逻辑单元数

核数量

闪光大小

特征

产品类别

长度

宽度

触点表面处理厚度 - 配套

触点表面处理厚度 - 柱子

材料可燃性等级

XCVM1302-3HSEVFVB1369
XCVM1302-3HSEVFVB1369
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

0 C

Xilinx

Xilinx

+ 100 C

SOC - Systems on a Chip

880 mV

System-On-Modules - SOM

SoC FPGA

XCVM1502-2LSEVFVC1760
XCVM1502-2LSEVFVC1760
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Xilinx

Xilinx

1

0 C

+ 110 C

SOC - Systems on a Chip

700 mV

System-On-Modules - SOM

SoC FPGA

XCVM1302-1MSEVFVB1369
XCVM1302-1MSEVFVB1369
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

0 C

Xilinx

Xilinx

+ 100 C

SOC - Systems on a Chip

800 mV

System-On-Modules - SOM

SoC FPGA

XCVM1502-1LSIVFVB1369
XCVM1502-1LSIVFVB1369
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Xilinx

- 40 C

+ 110 C

Xilinx

SOC - Systems on a Chip

700 mV

System-On-Modules - SOM

SoC FPGA

XCVM1502-1MLIVFVB1369
XCVM1502-1MLIVFVB1369
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Xilinx

- 40 C

+ 110 C

Xilinx

SOC - Systems on a Chip

800 mV

System-On-Modules - SOM

SoC FPGA

AGFB019R25A2E2V
AGFB019R25A2E2V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

480

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

XCZU4EG-L2SFVC784E
XCZU4EG-L2SFVC784E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

252

Tray

XCZU4

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

M2S060TS-1FCSG325
M2S060TS-1FCSG325
Microchip 数据表

2584 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

325-FCBGA (11x11)

微芯片技术

Tray

M2S060

活跃

-

166 MHz

56520 LE

-

64 kB

1.2 V

1.14 V

1.26 V

Compliant

200

0 to 85 °C

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 60K Logic Modules

1 Core

256KB

M2S010TS-FG484
M2S010TS-FG484
Microchip 数据表

31 In Stock

-

最小起订量: 1

最小包装量: 1

Production (Last Updated: 1 month ago)

484-BGA

YES

484-FPBGA (23x23)

484

PLASTIC/EPOXY

BGA484,22X22,40

1.2 V

微芯片技术

30

1.14 V

85 °C

无

M2S010TS-FG484

BGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.86

Non-Compliant

233

Tray

M2S010

活跃

-

166 MHz

12084 LE

-

64 kB

FBGA-484

网格排列

3

0°C ~ 85°C (TJ)

*

e0

活跃

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

233

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

现场可编程门阵列

FPGA - 10K Logic Modules

12084

1 Core

256KB

23 mm

23 mm

M2S090-FCSG325I
M2S090-FCSG325I
Microchip 数据表

2229 In Stock

-

最小起订量: 1

最小包装量: 1

通孔

325-TFBGA, FCBGA

YES

20

325-FCBGA (11x13.5)

--

325

--

Brass

FR4 Epoxy Glass

微芯片技术

活跃

Microsemi Corporation

RECTANGULAR

TFBGA

M2S090-FCSG325I

有

-

166 MHz

86316 LE

SMD/SMT

-

64 kB

--

--

180

Tray

M2S090

活跃

FBGA-325

GRID ARRAY, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

BGA325,21X21,20

1.2 V

40

1.14 V

5.74

1.26 V

MICROSEMI CORP

--

Correct-A-Chip® 352000

e1

活跃

--

Solder

Tin/Silver/Copper (Sn/Ag/Cu)

LG-MIN, WD-MIN

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

250

0.5 mm

compliant

1A

0.050 (1.27mm)

R-PBGA-B325

180

不合格

Tin-Lead

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.16 mm

现场可编程门阵列

0.125 (3.18mm)

0.100 (2.54mm)

PLCC

DIP, 0.3 (7.62mm) Row Spacing

FPGA - 90K Logic Modules

86316

1 Core

512KB

--

13.5 mm

11 mm

--

--

--

AGFD023R25A2E3E
AGFD023R25A2E3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

480

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

XCZU11EG-2FFVB1517I
XCZU11EG-2FFVB1517I
AMD 数据表

775 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

488

Tray

XCZU11

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

XCZU11EG-1FFVC1760E
XCZU11EG-1FFVC1760E
AMD 数据表

977 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

512

Tray

XCZU11

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 653K+ Logic Cells

-

XCVC1902-1LSEVSVA2197
XCVC1902-1LSEVSVA2197
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

770

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

400MHz, 1GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XCZU48DR-2FFVG1517I
XCZU48DR-2FFVG1517I
AMD 数据表

809 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

561

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

M2S090T-1FG676I
M2S090T-1FG676I
Microchip 数据表

2670 In Stock

-

最小起订量: 1

最小包装量: 1

676-BGA

676-FBGA (27x27)

微芯片技术

86316 LE

SMD/SMT

-

64 kB

1.2000 V

425

Tray

M2S090

活跃

-

166 MHz

-40 to 100 °C

SmartFusion®2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 90K Logic Modules

1 Core

512KB

10AS048E1F29I1HG
10AS048E1F29I1HG
ALTERA 数据表

928 In Stock

-

最小起订量: 1

最小包装量: 1

780-BBGA, FCBGA

780-FBGA (29x29)

Details

2 x 32 kB

-

有

10AS048E1F29I1HG

活跃

INTEL CORP

5.68

360

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

480000 LE

+ 100 C

- 40 C

36

SMD/SMT

60000 LAB

965004

Intel

Intel / Altera

Arria 10 SoC

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

SOC - Systems on a Chip

unknown

950 mV

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

SoC FPGA

12 Transceiver

FPGA - 480K Logic Elements

2 Core

--

SoC FPGA

10AS057H2F34E2LG
10AS057H2F34E2LG
ALTERA 数据表

700 In Stock

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

71250 LAB

965357

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

未说明

0.87 V

100 °C

有

10AS057H2F34E2LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

492

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

570000 LE

24

SMD/SMT

0°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

492

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

492

3.65 mm

现场可编程门阵列

SoC FPGA

FPGA - 570K Logic Elements

570000

2 Core

--

SoC FPGA

35 mm

35 mm

10AS027E1F29I1HG
10AS027E1F29I1HG
ALTERA 数据表

509 In Stock

-

最小起订量: 1

最小包装量: 1

780-BBGA, FCBGA

780-FBGA (29x29)

-

有

10AS027E1F29I1HG

活跃

INTEL CORP

5.64

360

有

2 x 32 kB

1.2 GHz

270000 LE

+ 100 C

- 40 C

36

SMD/SMT

33750 LAB

965279

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

SOC - Systems on a Chip

unknown

950 mV

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

SoC FPGA

12 Transceiver

FPGA - 270K Logic Elements

2 Core

--

SoC FPGA

10AS032H2F35E1SG
10AS032H2F35E1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

1152-FBGA (35x35)

Non-Compliant

384

0°C ~ 100°C (TJ)

Tray

Arria 10 SX

Discontinued at Digi-Key

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 320K Logic Elements

--

10AS032H1F35I1SG
10AS032H1F35I1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

1152-FBGA (35x35)

Non-Compliant

384

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

Discontinued at Digi-Key

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 320K Logic Elements

--

XCZU3CG-2SFVC784E
XCZU3CG-2SFVC784E
AMD 数据表

691 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

252

Bulk

XCZU3

活跃

154,350

FCBGA

0.8500 V

0.808 V

252

0.892 V

表面贴装

0 to 100 °C

Zynq® UltraScale+™ MPSoC CG

784

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

扩展工业

2

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

141,120

-

XCZU43DR-2FSVE1156E
XCZU43DR-2FSVE1156E
AMD 数据表

559 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

366

Tray

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU48DR-1FFVG1517E
XCZU48DR-1FFVG1517E
AMD 数据表

874 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD

561

Tray

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU49DR-1FSVF1760I
XCZU49DR-1FSVF1760I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD

622

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-