类别是'category.片上系统(SoC)' (7720)
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![]() | XAZU4EV-L1SFVC784I | AMD | 数据表 | 936 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 0.742 V | 252 | Tray | XAZU4 | 活跃 | 0.7200 V | 0.698 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1L | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010T-1FG484 | Microchip | 数据表 | 5000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | 1.26 V | 233 | Tray | M2S010 | 活跃 | - | 166 MHz | 12084 LE | SMD/SMT | - | 64 kB | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S010T-1FG484 | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.3 | 1.2000 V | 1.14 V | 0 to 85 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 233 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | 现场可编程门阵列 | 1 | FPGA - 10K Logic Modules | 9744 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150T-1FCV484I | Microchip | 数据表 | 2240 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA | 484-FBGA (19x19) | 微芯片技术 | Tray | M2S150 | 活跃 | - | 166 MHz | 146124 LE | - | 64 kB | 1.2000 V | 1.14 V | 1.26 V | 273 | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 150K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010T-1VF400I | Microchip | 数据表 | 11 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | 微芯片技术 | 活跃 | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 1.14 V | 无 | M2S010T-1VF400I | LFBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.3 | - | 166 MHz | 12084 LE | SMD/SMT | - | 64 kB | 1.2000 V | 1.14 V | 1.26 V | 195 | Tray | M2S010 | -40 to 100 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 160 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | 现场可编程门阵列 | 1 | FPGA - 10K Logic Modules | 9744 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EG-1FFVC1156I | AMD | 数据表 | 908 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 0.808 V | 0.892 V | 360 | Tray | XCZU7 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090T-1FGG676I | Microchip | 数据表 | 2357 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 676-BGA | YES | 676-FBGA (27x27) | 676 | 微芯片技术 | 1.2000 V | 425 | Tray | M2S090 | 活跃 | FBGA-676 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | 1.2 V | 1.14 V | 有 | M2S090T-1FGG676I | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.78 | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 40 | S-PBGA-B676 | 425 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | 现场可编程门阵列 | 1 | FPGA - 90K Logic Modules | 86316 | 512KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150-1FCG1152I | Microchip | 数据表 | 2550 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 微芯片技术 | SMD/SMT | - | 64 kB | 1.2000 V | 574 | Tray | M2S150 | 活跃 | - | 166 MHz | 146124 LE | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 150K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010TS-1VFG400T2 | Microchip | 数据表 | 2180 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | 400-VFBGA (17x17) | 微芯片技术 | 1.2000 V | 195 | Tray | M2S010 | 活跃 | , | 40 | 有 | M2S010TS-1VFG400T2 | Microsemi Corporation | 活跃 | MICROSEMI CORP | 5.8 | 0 to 85 °C | Automotive, AEC-Q100, SmartFusion®2 | e1 | 有 | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | compliant | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 现场可编程门阵列 | 1 | FPGA - 10K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU11EG-2FFVB1517E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 488 | Tray | XCZU11 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F200M3F-CSG288 | Microchip | 数据表 | 28 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 288-TFBGA, CSPBGA | YES | 288-CSP (11x11) | 288 | 微芯片技术 | 3 | PLASTIC/EPOXY | BGA288,21X21,20 | 1.5 V | 未说明 | 1.425 V | 85 °C | 有 | A2F200M3F-CSG288 | 80 MHz | TFBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 5.23 | 1.5000 V | 1.425 V | 200000 | 1.575 V | MCU - 31, FPGA - 78 | Tray | A2F200 | 活跃 | 11 X 11 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, GREEN, BGA-288 | GRID ARRAY, THIN PROFILE, FINE PITCH | 0 to 85 °C | SmartFusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 0.5 mm | compliant | S-PBGA-B288 | 78 | 不合格 | 1.5,1.8,2.5,3.3 V | OTHER | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 78 | 4608 CLBS, 200000 GATES | 1.05 mm | 现场可编程门阵列 | STD | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 200000 | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F200M3F-PQG208I | Microchip | 数据表 | 19 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | 微芯片技术 | QFP208,1.2SQ,20 | 1.5 V | 30 | 1.425 V | 有 | A2F200M3F-PQG208I | 80 MHz | FQFP | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.575 V | 1.51 | 1.5000 V | 1.425 V | 200000 | 1.575 V | MCU - 22, FPGA - 66 | Tray | A2F200 | 活跃 | FQFP, QFP208,1.2SQ,20 | FLATPACK, FINE PITCH | 3 | PLASTIC/EPOXY | -40 to 100 °C | SmartFusion® | Pure Matte Tin (Sn) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 245 | 0.5 mm | compliant | S-PQFP-G208 | 66 | 不合格 | 1.5,1.8,2.5,3.3 V | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 4608 CLBS, 200000 GATES | 4.1 mm | 现场可编程门阵列 | STD | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 200000 | 256KB | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU17EG-2FFVB1517I | AMD | 数据表 | 985 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 644 | Tray | XCZU17 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU17EG-1FFVB1517I | AMD | 数据表 | 907 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 644 | Tray | XCZU17 | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EV-2FBVB900I | AMD | 数据表 | 705 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 192,150 | 0.8500 V | 0.808 V | 204 | 0.892 V | 204 | Tray | XCZU4 | 活跃 | Industrial grade | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EV | 900 | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 2 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 175,680 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050-FGG484I | Microchip | 数据表 | 2253 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | 484-FPBGA (23x23) | 微芯片技术 | 267 | Tray | M2S050 | 活跃 | SMARTFUSION2 | 100C | Industrial | FPBGA | -40C to 100C | 267 | 56340 | 65nm | 1.26(V) | 1.2(V) | 无 | 1.14(V) | -40C | 有 | 56340 | 表面贴装 | 有 | This product may require additional documentation to export from the United States. | - | 166 MHz | 56340 LE | 0.489749 oz | 60 | SMD/SMT | 4695 LAB | Microchip | Microchip Technology / Atmel | Details | - | 64 kB | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | SOC - Systems on a Chip | 484 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060-1FCSG325 | Microchip | 数据表 | 2735 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | 微芯片技术 | 166 MHz | 56520 LE | - | 64 kB | Miscellaneous | 1.2000 V | Compliant | 200 | Tray | M2S060 | 活跃 | - | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EG-3SFVC784E | AMD | 数据表 | 869 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 0.873 V | 0.927 V | 252 | Tray | XCZU4 | 活跃 | 139743 | Schneider | 0.9000 V | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | Threaded | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7CG-2FBVB900I | AMD | 数据表 | 601 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | Turck | 0.8500 V | 0.808 V | 0.892 V | 204 | Tray | XCZU7 | 活跃 | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010-VFG256I | Microchip | 数据表 | 6000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | 微芯片技术 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA256,16X16,32 | 1.2 V | 40 | 1.14 V | 有 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.76 | UX07628 | UL | Turck | TPE | Cat 5e | 2.5, 3.3 V | 1.14 V | 1.26 V | 有 | - | 166 MHz | 12084 LE | 138 I/O | + 100 C | - 40 C | 119 | SMD/SMT | 1007 LAB | Microchip Technology / Atmel | Details | - | 64 kB | Tray | M2S010 | 活跃 | LFBGA, BGA256,16X16,32 | -40 to 100 °C | Tray | SmartFusion2 | e1 | RJ45 | Tin/Silver/Copper (Sn/Ag/Cu) | Teal | LG-MIN, WD-MIN | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 有 | 250 | 0.8 mm | compliant | S-PBGA-B256 | 138 | 不合格 | 1.2 V | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | 现场可编程门阵列 | SoC FPGA | STD | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | SoC FPGA | 无 | 39 Feet | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU11EG-L2FFVF1517E | AMD | 数据表 | 722 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 464 | Tray | XCZU11 | 活跃 | 4000-70403-0100220 | UR | Murrelektronik | 无 | 653,100 | FCBGA | 0.8500 V | 0.808 V | 464 | 0.892 V | 表面贴装 | 0 to 110 °C | Zynq® UltraScale+™ MPSoC EG | Black | 1517 | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 扩展工业 | 2L | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | 597,120 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3CG-L1SFVC784I | AMD | 数据表 | 544 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 0.808 V | 0.892 V | 252 | Tray | XCZU3 | 活跃 | DH365NDKV | Cutler Hammer, Div of Eaton Corp | 0.8500 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1L | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050-FGG484 | Microchip | 数据表 | 6000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-484 | 484-FPBGA (23x23) | Polyester | 微芯片技术 | 64 kB | + 85 C | 0 C | 60 | SMD/SMT | 4695 LAB | Microchip Technology / Atmel | Details | - | 64 kB | Tray | M2S050 | 活跃 | 125819 | Brady | 1.2000 V | 1.14 V | 1.26 V | 有 | This product may require additional documentation to export from the United States. | - | 1.314 Mbit | 166 MHz | 56340 LE | 267 I/O | 0 to 85 °C | Tray | SmartFusion2 | Warning Signs | SOC - Systems on a Chip | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | STD | Vinyl Chloride May Cause Cancer Authorized Personnel Only | FPGA - 50K Logic Modules | 1 Core | White | 256KB | English | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU19EG-1FFVD1760E | AMD | 数据表 | 751 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 3EU30 | CE, CSA, UL | Altech | DIN Rail | 308 | Tray | XCZU19 | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 30 A | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Motor | MCU, FPGA | Screw | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A2F200M3F-FGG484 | Microchip | 数据表 | 155 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | 微芯片技术 | Tray | A2F200 | 活跃 | BGA, BGA484,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,26X26,40 | 1.5 V | 40 | 1.425 V | 85 °C | 有 | 80 MHz | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.575 V | 1.36 | E57LBL30T110 | 10 mm | Cutler Hammer, Div of Eaton Co | 1.5000 V | 1.425 V | 200000 | 1.575 V | MCU - 41, FPGA - 94 | 0 to 85 °C | SmartFusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | Shielded | 250 | 1 mm | compliant | S-PBGA-B484 | 94 | 不合格 | NC NPN | 1.5,1.8,2.5,3.3 V | OTHER | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 94 | 4608 CLBS, 200000 GATES | 2.44 mm | 现场可编程门阵列 | STD | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 200000 | 256KB | Cable Connection | DC | 30 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010T-VFG256I | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | 微芯片技术 | 166 MHz | 12084 LE | SMD/SMT | - | 64 kB | VFBGA-256 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA256,16X16,32 | 1.2 V | 40 | 1.14 V | 有 | M2S010T-VFG256I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.77 | GE - General Electric | 1.2000 V | Non-Compliant | 138 | Tray | M2S010 | 活跃 | - | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B256 | 138 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | 现场可编程门阵列 | STD | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm |
XAZU4EV-L1SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
12,409.077417
M2S010T-1FG484
Microchip
分类:Embedded - System On Chip (SoC)
699.008318
M2S150T-1FCV484I
Microchip
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1,936.906287
M2S010T-1VF400I
Microchip
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697.746455
XCZU7EG-1FFVC1156I
AMD
分类:Embedded - System On Chip (SoC)
23,993.075663
M2S090T-1FGG676I
Microchip
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2,683.986861
M2S150-1FCG1152I
Microchip
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3,915.792323
M2S010TS-1VFG400T2
Microchip
分类:Embedded - System On Chip (SoC)
901.519698
XCZU11EG-2FFVB1517E
AMD
分类:Embedded - System On Chip (SoC)
A2F200M3F-CSG288
Microchip
分类:Embedded - System On Chip (SoC)
490.477795
A2F200M3F-PQG208I
Microchip
分类:Embedded - System On Chip (SoC)
626.828084
XCZU17EG-2FFVB1517I
AMD
分类:Embedded - System On Chip (SoC)
48,480.356425
XCZU17EG-1FFVB1517I
AMD
分类:Embedded - System On Chip (SoC)
38,219.758121
XCZU4EV-2FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
18,873.913884
M2S050-FGG484I
Microchip
分类:Embedded - System On Chip (SoC)
1,340.804850
M2S060-1FCSG325
Microchip
分类:Embedded - System On Chip (SoC)
1,188.657337
XCZU4EG-3SFVC784E
AMD
分类:Embedded - System On Chip (SoC)
15,074.529362
XCZU7CG-2FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
29,024.267371
M2S010-VFG256I
Microchip
分类:Embedded - System On Chip (SoC)
415.846182
XCZU11EG-L2FFVF1517E
AMD
分类:Embedded - System On Chip (SoC)
45,143.635833
XCZU3CG-L1SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
4,722.998402
M2S050-FGG484
Microchip
分类:Embedded - System On Chip (SoC)
738.016373
XCZU19EG-1FFVD1760E
AMD
分类:Embedded - System On Chip (SoC)
50,286.944877
A2F200M3F-FGG484
Microchip
分类:Embedded - System On Chip (SoC)
688.080010
M2S010T-VFG256I
Microchip
分类:Embedded - System On Chip (SoC)
