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类别是'category.片上系统（SoC）' (7720)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	触点镀层	底架	包装/外壳	表面安装	引脚数	供应商器件包装	房屋材料	质量	终端数量																厂商																													操作温度	包装	系列	容差	JESD-609代码	零件状态	终端	ECCN 代码	温度系数	连接器类型	类型	电阻	定位的数量	端子表面处理	最高工作温度	最小工作温度	颜色	性别	HTS代码	电容量	紧固类型	子类别	额定功率	技术	端子位置	方向	终端形式	屏蔽/屏蔽	峰值回流焊温度（摄氏度）	端子间距	深度	Reach合规守则	时间@峰值回流温度-最大值(s)	基本部件号	终端样式	JESD-30代码	输出的数量	资历状况	效率	输出电压	工作电源电压	电源	温度等级	配置	内存大小	端口的数量	核心处理器	周边设备	程序内存大小	连接方式	输出功率	电压 - 输出 2	建筑学	输入数量	逻辑元件/单元数	工作温度范围	最高频率
XCVM1302-2LLEVFVB1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1						Glenair	Glenair		+ 110 C	0 C																										SOC - Systems on a Chip														700 mV																				System-On-Modules - SOM																	Glenair
XCVM1502-2LSEVFVB1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1						Glenair	Glenair		+ 110 C	0 C																										Circular Connectors														700 mV																				军规圆形连接器																	军规圆形连接器
XCVC1502-1LLIVSVG1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1						Glenair	Glenair		+ 110 C	- 40 C																										Circular Connectors														700 mV																				军规圆形连接器																	军规圆形连接器
XCVC1502-2LSEVBVA1024	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1										Glenair		Glenair	+ 110 C	0 C	1																						MIL-Spec / MIL-Type														700 mV																				矩形MIL规格连接器																	矩形MIL规格连接器
XCVC1502-2MLIVSVA1596	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1										Glenair		Glenair	+ 110 C	- 40 C	1																						Circular Connectors														800 mV																				军规圆形连接器																	军规圆形连接器
XCVM1502-2LLEVFVB1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1						Glenair	Glenair		+ 110 C	0 C																										Circular Connectors														700 mV																				军规圆形连接器																	军规圆形连接器
5CSEBA5U19C7N	ALTERA	数据表	2769 In Stock	1: ¥1,361.016015 10: ¥1,283.977374 100: ¥1,211.299410 500: ¥1,142.735292 查看所有的价格 -	最小起订量: 1 最小包装量: 1	484-FBGA	YES	484	484-UBGA (19x19)	484			MIL-DTL-38999	Glenair	Glenair	MCU - 151, FPGA - 66	Compliant	FBGA, BGA484,22X22,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA484,22X22,32	1.1 V	未说明	1.07 V	85 °C	有	5CSEBA5U19C7N		FBGA	SQUARE	活跃	INTEL CORP	1.13 V	5.55			0°C ~ 85°C (TJ)	Tray	Cyclone® V SE			活跃									85 °C	0 °C		Circular Connectors	CMOS	BOTTOM	BALL		未说明	0.8 mm		compliant		5CSEBA5		S-PBGA-B484	66	不合格			1.13 V	1.1,1.2/3.3,2.5 V	OTHER		556.3 kB		800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA	66	1.9 mm	现场可编程门阵列		85000	军规圆形连接器			800 MHz	32075	7	FPGA - 85K Logic Elements		85000		--		Connectors		军规圆形连接器			19 mm	19 mm
XCZU43DR-L2FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思				Amphenol	Non-Illuminated	Amphenol Nexus Technologies	Details	366	活跃					-40°C ~ 100°C (TJ)		NX300																			Switches																		533MHz, 1.333GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA						按钮开关						Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-			-				按钮开关
XCZU47DR-1FSVE1156E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思	Details	366	Tray	活跃								1	Honeywell	Non-Illuminated	Honeywell	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																			Switches																		500MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA						限位开关						Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-			-				限位开关
XCVC1502-2LSEVSVA1596	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1						2 oz	1		TE Connectivity	测量专业						Bulk	R60D																			Sensors																																		线性位移传感器																	线性位移传感器
XCVC1902-1MLIVSVA2197	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	2197-BFBGA, FCBGA	2197-FCBGA (45x45)	AMD 赛灵思								1	施耐德电气	Telemecanique	Details	770	Tray	活跃	-40°C ~ 100°C (TJ)		XUB																			Sensors																		600MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA											Versal™ AI Core FPGA, 1.9M Logic Cells				-							接近传感器
XCVC1902-2MSIVIVA1596	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1596-BFBGA, FCBGA	1596-FCBGA (40x40)	AMD 赛灵思			+ 155 C	- 55 C	400	PCB 安装	EPCOS / TDK	EPCOS / TDK	Details	500	Tray	活跃						-40°C ~ 100°C (TJ)	Bulk	B58100	2 %							NTC	1.465 kOhms										Thermistors	60 mW							Radial										600MHz, 1.4GHz	256KB		Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA						NTC热敏电阻						Versal™ AI Core FPGA, 1.9M Logic Cells				-							NTC热敏电阻	11 mm	12 mm	12.6 mm	15 mm
XCZU48DR-2FFVE1156I	Xilinx	数据表	1200 In Stock	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思				Amphenol Commercial Products	Amphenol	125	366	Tray	活跃					-40°C ~ 100°C (TJ)	Reel	Zynq® UltraScale+™ RFSoC																			Modular Connectors / Ethernet Connectors																		533MHz, 1.333GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA						Modular Connectors / Ethernet Connectors						Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-							Modular Connectors / Ethernet Connectors
XCZU47DR-1FFVG1517E	Xilinx	数据表	50 In Stock	-	最小起订量: 1 最小包装量: 1	1111 (2828 metric)	1517-FCBGA (40x40)	AMD 赛灵思	500 V	561	Tray	活跃								Details	ATC / KYOCERA AVX	KYOCERA AVX	1000	- 55 C	+ 125 C	P90	2828	1111	0°C ~ 100°C (TJ)	Reel	100B	0.25 pF					90 PPM / C		High Q, Low ESR/ESL Porcelain Superchip Capacitor									3.9 pF		Capacitors							SMD/SMT											500MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA						Silicon RF Capacitors / Thin Film						Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-		RF/Microwave Multilayer Capacitors (MLC)					Silicon RF Capacitors / Thin Film		2.59 mm	2.79 mm	2.79 mm
XCZU46DR-2FFVH1760I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD 赛灵思				5	Positronic	Amphenol Positronic	574	Tray	活跃					-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																			D-Sub Connectors																		533MHz, 1.333GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA						Mixed Contact D-Sub Connectors						Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-							D-Sub Mixed Contact Connectors
AGFA008R24C2I3V	Intel	数据表	800 In Stock	1: ¥71,356.843653 10: ¥69,010.487088 25: ¥68,530.771692 50: ¥68,054.390950 查看所有的价格 -	最小起订量: 1 最小包装量: 1	-	-	Intel				1	Advanced Energy	Advanced Energy	576	Tray	活跃					-40°C ~ 100°C (TJ)		Agilex F																			DC-DC Converter																		1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA						Non-Isolated DC-DC Converters						FPGA - 764K Logic Elements				-							Non-Isolated DC/DC Converters
AGFB006R16A2E3V	Intel	数据表	983 In Stock	1: ¥44,591.923198 10: ¥43,125.651060 25: ¥42,825.869971 50: ¥42,528.172763 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Gold	-	-	Thermoplastic polyester	Intel	450	0 C	+ 70 C	384	Tray	活跃						Amphenol Commercial Products	Amphenol	磷青铜	8P8C	0°C ~ 100°C (TJ)	Tray	Agilex F								磁性千斤顶						Black	Jack (Female)				Modular Connectors / Ethernet Connectors						Shielded		焊针								1x1	1 Port	1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA						Modular Connectors / Ethernet Connectors		0 C to + 70 C				FPGA - 573K Logic Elements				-		Connectors		直角		RJ45	Modular Connectors / Ethernet Connectors					UL 94V-0
10AS016E4F27E3LG	ALTERA	数据表	880 In Stock	1: ¥5,299.321312 10: ¥4,999.359727 100: ¥4,716.377101 500: ¥4,449.412364 查看所有的价格 -	最小起订量: 1 最小包装量: 1	672-BBGA, FCBGA	YES	672-FBGA (27x27)	672	Arria 10 SoC	2 x 32 kB	-		BGA, BGA672,26X26,40	网格排列	PLASTIC/EPOXY	BGA672,26X26,40	0.9 V	未说明	0.87 V	100 °C	有	10AS016E4F27E3LG	BGA	SQUARE	活跃	FPGA - Field Programmable Gate Array Arria 10 SX 160 SoC FPGA	INTEL CORP	0.93 V	1.96						Non-Compliant	240	有	2 x 32 kB	1.2 GHz	160000 LE	1	SMD/SMT	20000 LAB	964735	Intel	Intel / Altera	0°C ~ 100°C (TJ)	Tray	Arria 10 SX			活跃							8542.39.00.01			SOC - Systems on a Chip		CMOS	BOTTOM		BALL		未说明	1 mm		compliant				S-PBGA-B672	240	不合格				0.9 V	OTHER			1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA	240	3.25 mm	现场可编程门阵列			SoC FPGA			FPGA - 160K Logic Elements		160000	2 Core	--				SoC FPGA	27 mm	27 mm
XCZU2CG-2SFVA625I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Gold	Flanges, Panel, Through Hole	625-BFBGA, FCBGA	23	625-FCBGA (21x21)	AMD	活跃					Compliant	180	Tray	XCZU2	-40°C ~ 100°C (TJ)	Bulk	Zynq® UltraScale+™ MPSoC CG				Solder			Receptacle			19		175 °C	-65 °C					Threaded																			533MHz, 1.3GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA												Zynq®UltraScale+™ FPGA, 103K+ Logic Cells				-					Shielded								抗环境干扰
AGIB027R29A1E2VR3	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Metal	Intel				Non-Compliant	720	Tray	活跃	1	Intel	Intel				0°C ~ 100°C (TJ)	Tray	Agilex I																							Straight														1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA											FPGA - 2.7M Logic Elements				-							Intel
XCZU3EG-1SFVA625I	AMD	数据表	663 In Stock	1: ¥4,291.528673 10: ¥4,048.611954 100: ¥3,819.445239 500: ¥3,603.250230 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Panel	625-BFBGA, FCBGA	625-FCBGA (21x21)	230 g	AMD	活跃						5 V	Compliant	180	Tray	XCZU3	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG												50 °C	0 °C							55 W								76.2 mm		3	70 %	12 V					500MHz, 600MHz, 1.2GHz	256KB	6 A	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	55 W	12 V	MCU, FPGA				6 A			-12 V					Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	500 mA			-	500 mA								28.956 mm	127 mm	76.2 mm
M2S060TS-1VFG784I	Microchip	数据表	2218 In Stock	1: ¥1,475.000659 10: ¥1,391.510059 100: ¥1,312.745334 500: ¥1,238.438995 查看所有的价格 -	最小起订量: 1 最小包装量: 1	784-FBGA	784-VFBGA (23x23)	微芯片技术						Tray	活跃			-40°C ~ 100°C (TJ)		SmartFusion®2																																						166MHz			ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA												FPGA - 60K Logic Modules
AGIB019R18A2E3V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel		480	Tray	活跃							0°C ~ 100°C (TJ)		Agilex I																																					1.4GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MPU, FPGA												FPGA - 1.9M Logic Elements				-
A2F200M3F-1PQ208I	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	208-BFQFP	208-PQFP (28x28)	微芯片技术	MCU - 22, FPGA - 66	Tray	A2F200	Obsolete								3-1191563-0	TE Connectivity	TE Connectivity	Details	-40°C ~ 100°C (TJ)		SmartFusion®																																					100MHz	64KB		ARM® Cortex®-M3	DMA, POR, WDT		EBI/EMI, Ethernet, I²C, SPI, UART/USART			MCU, FPGA						Hook-up Wire						ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops				256KB							Hook-up Wire
M2S150TS-1FCG1152M	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FCBGA (35x35)	1152	微芯片技术	活跃	MICROSEMI CORP	1.26 V	5.8						1	Glenair	Glenair	574	Tray	M2S150	活跃	FBGA-1152	网格排列	4	PLASTIC/EPOXY	BGA1152,34X34,40	-55 °C	1.2 V	1.14 V	125 °C	有	M2S150TS-1FCG1152M	BGA	SQUARE	-55°C ~ 125°C (TJ)		SmartFusion®2		e1			3A001.A.2.C						Tin/Silver/Copper (Sn/Ag/Cu)	8542.39.00.01		D-Sub Connectors	CMOS	BOTTOM		BALL		250	1 mm		compliant	40			S-PBGA-B1152	574	不合格				1.2 V	MILITARY			166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA	574	2.9 mm	现场可编程门阵列			Mixed Contact D-Sub Connectors						FPGA - 150K Logic Modules		146124		512KB				D-Sub Mixed Contact Connectors			35 mm	35 mm