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类别是'category.片上系统（SoC）' (7720)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	生命周期状态	安装类型	包装/外壳	表面安装	越来越多的功能	触点形状	外壳材料	供应商器件包装	质量	插入材料	终端数量																						厂商																																		操作温度	包装	系列	尺寸/尺寸	容差	JESD-609代码	无铅代码	零件状态	湿度敏感性等级(MSL)	温度系数	连接器类型	类型	定位的数量	端子表面处理	应用	HTS代码	电容量	紧固类型	子类别	触点类型	技术	端子位置	方向	终端形式	屏蔽/屏蔽	峰值回流焊温度（摄氏度）	入口保护	端子间距	深度	Reach合规守则	时间@峰值回流温度-最大值(s)	外壳完成	引脚数量	外壳尺寸-插入	JESD-30代码	输出的数量	资历状况	房屋颜色	工作电源电压	失败率	引线间距	电源	温度等级	界面	速度	内存大小	外壳尺寸，MIL	引线样式
XCVM1502-1MLIVFVB1369	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1							Xilinx	Xilinx	- 40 C	+ 110 C																									SOC - Systems on a Chip																			800 mV																				System-On-Modules - SOM										SoC FPGA
M2S050T-FGG896ES	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1													1935297	Phoenix Contact
M2S025-1FGG484	Microchip	数据表	2667 In Stock	1: ¥1,096.710698 10: ¥1,034.632732 100: ¥976.068619 500: ¥920.819451 查看所有的价格 -	最小起订量: 1 最小包装量: 1	484-BGA	YES	484-FPBGA (23x23)	484	微芯片技术	有	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.78								10250T436H621	Cutler Hammer, Div of Eaton Co	267	Tray	M2S025	活跃	-	166 MHz	27696 LE	SMD/SMT	-	64 kB	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	1.2 V	40	1.14 V	85 °C	0°C ~ 85°C (TJ)		SmartFusion®2		e1								Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01		现场可编程门阵列		CMOS	BOTTOM		BALL		250		1 mm		compliant					S-PBGA-B484	267	不合格					1.2 V	OTHER			166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		267	2.44 mm	现场可编程门阵列				1	FPGA - 25K Logic Modules		27696	1 Core	256KB				23 mm	23 mm
5CSXFC6C6U23I7NTS	ALTERA	数据表	2209 In Stock	1: ¥3,109.522840 10: ¥2,933.512115 100: ¥2,767.464258 500: ¥2,610.815336 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Free Hanging (In-Line)	-	Circular	Aluminum	-	Amphenol Aerospace Operations					Bulk	D38999/26FD	20	活跃			-65°C ~ 200°C	Tray	Military, MIL-DTL-38999 Series III, Tri-Start™ TV					活跃			Plug Housing	用于公引脚	18					Threaded		Crimp			N (Normal)		Unshielded		抗环境干扰				化学镍		15-18				Silver					不包括触点				D													-								Backshell, Coupling Nut, Self Locking							-
XC7Z045-3FFG676E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Surface Mount, MLCC	0603 (1608 Metric)	676-FCBGA (27x27)	AMD		Lead free / RoHS Compliant	200V	Thumb-2	1.2, 3.3 V	FCBGA	2	表面贴装	130	Tray	XC7Z045	活跃								-55°C ~ 150°C	Tape & Reel (TR)	GA	0.063 L x 0.032 W (1.60mm x 0.80mm)	±2%				1 (Unlimited)	C0G, NP0					汽车		270pF															676					1 V	-	-					1GHz	256KB		-	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	32 Bit								Kintex™-7 FPGA, 350K Logic Cells				-	-			-			0.038 (0.97mm)		AEC-Q200
XC7Z045-1FBG676I	AMD	数据表	693 In Stock	1: ¥12,089.476235 10: ¥11,691.949938 25: ¥11,610.675209 50: ¥11,529.965449 查看所有的价格 -	最小起订量: 1 最小包装量: 1	通孔	Radial, Disc	676-FCBGA (27x27)	AMD	Thumb-2	1.2, 3.3 V	FCBGA	2	130	Tray	XC7Z045	活跃									Lead free / RoHS Compliant	400VAC	-30°C ~ 125°C	Bulk	Cera-Mite 125L	0.563 Dia (14.30mm)	±20%				1 (Unlimited)	Y5V (F)					Safety		10000pF															676					1 V	-	0.374 (9.50mm)					667MHz	256KB		Straight	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	32 Bit								Kintex™-7 FPGA, 350K Logic Cells				-	-			0.689 (17.50mm)			-		X1, Y4
XC7Z020-L1CLG484I	AMD	数据表	2074 In Stock	1: ¥1,363.367782 10: ¥1,286.196018 100: ¥1,213.392472 500: ¥1,144.709877 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Surface Mount, MLCC	1812 (4532 Metric)	484-CSPBGA (19x19)	AMD	130	Tray	XC7Z020	活跃									Lead free / RoHS Compliant	50V	1 V	0.95 V	1.05 V	-55°C ~ 150°C	Tape & Reel (TR)	GA	0.177 L x 0.126 W (4.50mm x 3.20mm)	±20%				1 (Unlimited)	X7R					汽车		0.056µF																					-	-					667MHz	256KB		-	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								1L	Artix™-7 FPGA, 85K Logic Cells				-	-			-			0.086 (2.18mm)		AEC-Q200
XC7Z100-1FFG1156I	AMD	数据表	993 In Stock	1: ¥22,939.503025 10: ¥22,185.206019 25: ¥22,030.989100 50: ¥21,877.844191 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD		RISC	1.5, 2, 2.5 V	FBGA	2	CAN/I2C/SPI/UART	表面贴装	250	Tray	XC7Z100	活跃									-40 to 100 °C		Zynq®-7000																													1156					1, 1.8 V						CAN/I2C/SPI/UART	667MHz	256 KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	32 Bit								Kintex™-7 FPGA, 444K Logic Cells				-
XC7Z030-1FFG676C	AMD	数据表	2836 In Stock	1: ¥2,337.076154 10: ¥2,204.788827 100: ¥2,079.989460 500: ¥1,962.254205 查看所有的价格 -	最小起订量: 1 最小包装量: 1	676-BBGA, FCBGA	676-FCBGA (27x27)	AMD	Tray	XC7Z030	活跃										Thumb-2	1.2, 3.3 V	FCBGA	表面贴装	130	0 to 85 °C		Zynq®-7000																													676					1 V							667MHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	32 Bit								Kintex™-7 FPGA, 125K Logic Cells				-
XC7Z035-1FFG676C	AMD	数据表	636 In Stock	1: ¥10,470.894689 10: ¥10,126.590610 25: ¥10,056.197229 50: ¥9,986.293177 查看所有的价格 -	最小起订量: 1 最小包装量: 1	676-BBGA, FCBGA	676-FCBGA (27x27)	AMD		275,000	1.0000 V	0.95 V	130	1.05 V	130	Tray	XC7Z035	活跃	Commercial grade									0 to 85 °C		Zynq®-7000																																									667MHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	XC7Z035	MCU, FPGA							Commercial	1	Kintex™-7 FPGA, 275K Logic Cells	343,800			-
M2S005S-TQ144I	Microchip	数据表	2678 In Stock	-	最小起订量: 1 最小包装量: 1	144-LQFP	YES	144-TQFP (20x20)	4400g	144	微芯片技术			(W x H x D) 348 x 100 x 289 mm	无	Black	84	Tray	Obsolete	TQFP-144	FLATPACK, LOW PROFILE, FINE PITCH	3	PLASTIC/EPOXY	QFP144,.87SQ,20	1.2 V	30	1.14 V	无	M2S005S-TQ144I	LFQFP	SQUARE	Microsemi Corporation	Obsolete	MICROSEMI CORP	1.26 V	5.88					-40°C ~ 100°C (TJ)		SmartFusion®2			e0							Tin/Lead (Sn/Pb)		8542.39.00.01			现场可编程门阵列		CMOS	QUAD	鸥翼		240		0.5 mm	289mm	not_compliant					S-PQFP-G144	84	不合格					1.2 V				166MHz	64KB			ARM® Cortex®-M3	-		CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		84	1.6 mm	现场可编程门阵列					FPGA - 5K Logic Modules		6060		128KB			100m		20 mm	348mm
XCZU3CG-2SBVA484I	AMD	数据表	924 In Stock	1: ¥4,456.090302 10: ¥4,203.858777 100: ¥3,965.904505 500: ¥3,741.419344 查看所有的价格 -	最小起订量: 1 最小包装量: 1	484-BFBGA, FCBGA	484-FCBGA (19x19)	AMD					154,350	FCBGA	0.8500 V	0.808 V	82	0.892 V	82	Tray	XCZU3	活跃	Industrial grade						-40 to 100 °C		Zynq® UltraScale+™ MPSoC CG																													484												533MHz, 1.3GHz	256KB			Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA							Industrial	2	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells				-
M2S060-FGG676	Microchip	数据表	2124 In Stock	1: ¥1,416.354017 10: ¥1,336.183038 100: ¥1,260.550030 500: ¥1,189.198145 查看所有的价格 -	最小起订量: 1 最小包装量: 1	Production (Last Updated: 2 months ago)	676-BGA	676-FBGA (27x27)	微芯片技术		1.2000 V	Non-Compliant	387	Tray	M2S060	活跃	-	166 MHz	56520 LE	-	64 kB								0 to 85 °C		SmartFusion®2																																									166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA								STD	FPGA - 60K Logic Modules			1 Core	256KB
XCZU11EG-2FFVF1517E	AMD	数据表	627 In Stock	1: ¥39,300.785980 10: ¥38,008.497081 25: ¥37,744.287067 50: ¥37,481.913677 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD										464	Tray	XCZU11	活跃	0°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																																									533MHz, 600MHz, 1.3GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA									Zynq®UltraScale+™ FPGA, 653K+ Logic Cells				-
M2S010TS-1FGG484T2	Microchip	数据表	2346 In Stock	1: ¥1,049.292750 10: ¥989.898821 100: ¥933.866813 500: ¥881.006424 查看所有的价格 -	最小起订量: 1 最小包装量: 1	484-BGA	484-FPBGA (23x23)	微芯片技术								1.2000 V	233	Tray	M2S010	活跃	40	有	M2S010TS-1FGG484T2	Microsemi Corporation	活跃	MICROSEMI CORP	5.81			0 to 85 °C		Automotive, AEC-Q100, SmartFusion®2			e1	有							Tin/Silver/Copper (Sn/Ag/Cu)											250				compliant															166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA				现场可编程门阵列				1	FPGA - 10K Logic Modules				256KB
M2S090TS-1FGG676T2	Microchip	数据表	2671 In Stock	1: ¥1,823.129040 10: ¥1,719.933059 100: ¥1,622.578352 500: ¥1,530.734301 查看所有的价格 -	最小起订量: 1 最小包装量: 1	676-BGA	676-FBGA (27x27)	微芯片技术	1.2000 V	425	Tray	M2S090	活跃										0 to 85 °C		Automotive, AEC-Q100, SmartFusion®2																																									166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA								1	FPGA - 90K Logic Modules				512KB
XAZU4EV-L1SFVC784I	AMD	数据表	936 In Stock	1: ¥12,409.077417 10: ¥12,001.041990 25: ¥11,917.618659 50: ¥11,834.775228 查看所有的价格 -	最小起订量: 1 最小包装量: 1	784-BFBGA, FCBGA	784-FCBGA (23x23)	AMD									0.7200 V	0.698 V	0.742 V	252	Tray	XAZU4	活跃		-40 to 100 °C		Zynq® UltraScale+™ MPSoC EV																																									500MHz, 600MHz, 1.2GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								1L	Zynq®UltraScale+™ FPGA, 192K+ Logic Cells				-
M2S010T-1FG484	Microchip	数据表	5000 In Stock	1: ¥699.008318 10: ¥659.441810 100: ¥622.114915 500: ¥586.900860 查看所有的价格 -	最小起订量: 1 最小包装量: 1	484-BGA	YES	484-FPBGA (23x23)	484	1.2 V	30	1.14 V	微芯片技术	85 °C	无	M2S010T-1FG484	BGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.3								1.2000 V	1.14 V	1.26 V	233	Tray	M2S010	活跃	-	166 MHz	12084 LE	SMD/SMT	-	64 kB	FBGA-484	网格排列	3	PLASTIC/EPOXY	BGA484,22X22,40	0 to 85 °C	SmartFusion®2			e0								Tin/Lead (Sn/Pb)	8542.39.00.01			现场可编程门阵列		CMOS	BOTTOM		BALL		240		1 mm		not_compliant					S-PBGA-B484	233	不合格					1.2 V	OTHER			166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		233	2.44 mm	现场可编程门阵列				1	FPGA - 10K Logic Modules		9744	1 Core	256KB				23 mm	23 mm
M2S150T-1FCV484I	Microchip	数据表	2240 In Stock	1: ¥1,936.906287 10: ¥1,827.270082 100: ¥1,723.839703 500: ¥1,626.263870 查看所有的价格 -	最小起订量: 1 最小包装量: 1	484-BFBGA	484-FBGA (19x19)	微芯片技术								1.2000 V	1.14 V	1.26 V	273	Tray	M2S150	活跃	-	166 MHz	146124 LE	-	64 kB			-40 to 100 °C		SmartFusion®2																																									166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA								1	FPGA - 150K Logic Modules			1 Core	512KB
M2S010T-1VF400I	Microchip	数据表	11 In Stock	1: ¥697.746455 10: ¥658.251371 100: ¥620.991859 500: ¥585.841376 查看所有的价格 -	最小起订量: 1 最小包装量: 1	400-LFBGA	YES	400-VFBGA (17x17)	400	MICROSEMI CORP	微芯片技术	1.26 V	5.3	-	166 MHz	12084 LE	SMD/SMT	-	64 kB								1.2000 V	1.14 V	1.26 V	195	Tray	M2S010	活跃	LFBGA, BGA400,20X20,32	GRID ARRAY, LOW PROFILE, FINE PITCH	PLASTIC/EPOXY	BGA400,20X20,32	1.2 V	30	1.14 V	无	M2S010T-1VF400I	LFBGA	SQUARE	Microsemi Corporation	活跃	-40 to 100 °C		SmartFusion®2		e0								Tin/Lead (Sn/Pb)		8542.39.00.01		现场可编程门阵列		CMOS	BOTTOM		BALL		240		0.8 mm		not_compliant					S-PBGA-B400	160	不合格					1.2 V				166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		160	1.51 mm	现场可编程门阵列				1	FPGA - 10K Logic Modules		9744	1 Core	256KB				17 mm	17 mm
XCZU7EG-1FFVC1156I	AMD	数据表	908 In Stock	1: ¥23,993.075663 10: ¥23,204.135068 25: ¥23,042.835227 50: ¥22,882.656625 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD					0.808 V	0.892 V	360	Tray	XCZU7	活跃						-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ MPSoC EG																																									500MHz, 600MHz, 1.2GHz	256KB			Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								1	Zynq®UltraScale+™ FPGA, 504K+ Logic Cells				-
M2S090T-1FGG676I	Microchip	数据表	2357 In Stock	1: ¥2,683.986861 10: ¥2,532.063075 100: ¥2,388.738749 500: ¥2,253.527123 查看所有的价格 -	最小起订量: 1 最小包装量: 1	676-BGA	YES	676-FBGA (27x27)	676	微芯片技术	1.2000 V	425	Tray	M2S090	活跃	FBGA-676	网格排列	3	PLASTIC/EPOXY	BGA676,26X26,40	1.2 V	1.14 V	有	M2S090T-1FGG676I	BGA	SQUARE	Microsemi Corporation	活跃	MICROSEMI CORP	1.26 V	5.78								-40 to 100 °C		SmartFusion®2			e1							Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01			现场可编程门阵列		CMOS	BOTTOM		BALL	250		1 mm		compliant	40				S-PBGA-B676	425	不合格					1.2 V				166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES		CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		425	2.44 mm	现场可编程门阵列				1	FPGA - 90K Logic Modules		86316		512KB					27 mm	27 mm
M2S150-1FCG1152I	Microchip	数据表	2550 In Stock	1: ¥3,915.792323 10: ¥3,694.143698 100: ¥3,485.041226 500: ¥3,287.774738 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FCBGA (35x35)	微芯片技术					1.2000 V	574	Tray	M2S150	活跃	-	166 MHz	146124 LE	SMD/SMT	-	64 kB						-40 to 100 °C		SmartFusion®2																																									166MHz	64KB			ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA								1	FPGA - 150K Logic Modules			1 Core	512KB
BCM33843MVFSBGB0T	Broadcom	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Broadcom Limited					E22VB51	Cutler Hammer, Div of Eaton Co	-	Tray	BCM33843	Obsolete						-		-																																									2.4GHz, 5GHz	-			-	-		-		-									-				-
10AS066H1F34E1HG	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FBGA (35x35)										96000	Cully-Minerallac	492	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	660000 LE	+ 100 C	0 C	24	SMD/SMT	82500 LAB	966266	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	有	活跃		INTEL CORP	5.66	0°C ~ 100°C (TJ)	Tray	Arria 10 SX					活跃										SOC - Systems on a Chip										unknown									950 mV							1.5GHz	256KB			Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA					SoC FPGA				FPGA - 660K Logic Elements			2 Core	--		SoC FPGA