类别是'category.片上系统(SoC)' (7720)

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JESD-30代码

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纹波电流@高频

周边设备

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建筑学

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电气连接

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评级结果

XCZU7CG-L2FBVB900E
XCZU7CG-L2FBVB900E
AMD 数据表

891 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

900-FCBGA (31x31)

AMD

活跃

204

Tray

XCZU7

-40°C ~ 85°C

Tape & Reel (TR)

SiT8209

0.197 L x 0.126 W (5.00mm x 3.20mm)

活跃

XO (Standard)

3.3V

133.333333MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

36mA

31mA

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

--

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

0.032 (0.80mm)

--

XCZU7EV-2FFVF1517I
XCZU7EV-2FFVF1517I
AMD 数据表

546 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

6-SMD, No Lead

1517-FCBGA (40x40)

AMD

活跃

464

Tray

XCZU7

-20°C ~ 70°C

Tape & Reel (TR)

SiT9120

0.126 L x 0.098 W (3.20mm x 2.50mm)

活跃

XO (Standard)

2.25 V ~ 3.63 V

156.25MHz

±10ppm

LVDS

Standby (Power Down)

MEMS

55mA

35mA

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

--

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

0.032 (0.80mm)

--

XCZU4EG-1FBVB900E
XCZU4EG-1FBVB900E
AMD 数据表

560 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

4-SMD, No Lead

900-FCBGA (31x31)

AMD

活跃

204

Tray

XCZU4

-20°C ~ 70°C

Tape & Reel (TR)

SiT8208

0.126 L x 0.098 W (3.20mm x 2.50mm)

活跃

XO (Standard)

2.8V

26MHz

±10ppm

LVCMOS, LVTTL

Enable/Disable

MEMS

33mA

31mA

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1

--

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

0.032 (0.80mm)

--

XCZU25DR-L2FSVG1517I
XCZU25DR-L2FSVG1517I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Flanges

Compliant

Bulk

*

活跃

Crimp

Female

Straight

18

无

XCZU48DR-2FFVG1517E
XCZU48DR-2FFVG1517E
Xilinx 数据表

105 In Stock

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FCBGA (40x40)

17.3 kg

AMD 赛灵思

活跃

Compliant

561

Tray

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1.6 kW

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU48DR-2FFVE1156E
XCZU48DR-2FFVE1156E
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD 赛灵思

Non-Compliant

366

Tray

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XC7Z035-2FFG900E
XC7Z035-2FFG900E
AMD 数据表

751 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

130

Tray

XC7Z035

活跃

0°C ~ 100°C (TJ)

Zynq®-7000

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 275K Logic Cells

-

10AS057K3F35I2SG
10AS057K3F35I2SG
ALTERA 数据表

611 In Stock

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

活跃

INTEL CORP

0.93 V

5.45

VFD-050HB-442E

Johnson Controls

396

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

BGA

SQUARE

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

396

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

396

3.5 mm

现场可编程门阵列

FPGA - 570K Logic Elements

570000

--

Flanged

35 mm

35 mm

10AS016E3F27I2LG
10AS016E3F27I2LG
ALTERA 数据表

513 In Stock

-

最小起订量: 1

最小包装量: 1

672-BBGA, FCBGA

YES

672-FBGA (27x27)

672

CE

Autonics

240

Non-Compliant

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

160000 LE

1

SMD/SMT

20000 LAB

964696

Intel / Altera

Arria 10 SoC

2 x 32 kB

-

BGA, BGA672,26X26,40

网格排列

PLASTIC/EPOXY

BGA672,26X26,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.47

TPS20-G1FP2-00

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

Gauge

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

4-20 mA

S-PBGA-B672

240

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

240

3.25 mm

现场可编程门阵列

15-35 VDC

SoC FPGA

14-158 °F

FPGA - 160K Logic Elements

160000

2 Core

--

SoC FPGA

Head Type

27 mm

27 mm

10AS057H4F34I3LG
10AS057H4F34I3LG
ALTERA 数据表

946 In Stock

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

492

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

570000 LE

24

SMD/SMT

71250 LAB

964915

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

BGA

SQUARE

活跃

INTEL CORP

BGA, BGA1152,34X34,40

0.93 V

5.45

HVX005A1-2A1B1B5CAD3

Cutler Hammer, Div of Eaton Co

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

492

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

492

3.65 mm

现场可编程门阵列

SoC FPGA

FPGA - 570K Logic Elements

570000

2 Core

--

SoC FPGA

35 mm

35 mm

XCVM1302-2LSEVSVD1760
XCVM1302-2LSEVSVD1760
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

402

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ Prime

450MHz, 1.08GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCVC1902-1MSIVIVA1596
XCVC1902-1MSIVIVA1596
AMD 数据表

699 In Stock

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

1596-FCBGA (40x40)

AMD

500

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XCZU1EG-2SBVA484I
XCZU1EG-2SBVA484I
AMD 数据表

2184 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

484-FCBGA (19x19)

AMD

-

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

-

MPU, FPGA

-

-

XCVM1802-2LSEVFVC1760
XCVM1802-2LSEVFVC1760
AMD 数据表

832 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

500

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ Prime

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XCVM1302-1MSINSVF1369
XCVM1302-1MSINSVF1369
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1369-BFBGA

1369-BGA (35x35)

AMD

316

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

600MHz, 1.3GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 70k Logic Cells

-

XCVM1402-1LLINBVB1024
XCVM1402-1LLINBVB1024
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1024-BFBGA

1024-BGA (31x31)

AMD

424

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ Prime

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

XCVC1902-2MSEVSVD1760
XCVC1902-2MSEVSVD1760
AMD 数据表

701 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

692

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.4GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XCVC1902-1MSEVSVD1760
XCVC1902-1MSEVSVD1760
AMD 数据表

847 In Stock

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD

692

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.9M Logic Cells

-

XC7Z015-1CLG485C
XC7Z015-1CLG485C
AMD 数据表

2352 In Stock

-

最小起订量: 1

最小包装量: 1

通孔

Radial, Can

485-CSPBGA (19x19)

-

EPCOS - TDK Electronics

Bulk

Obsolete

25 V

5000 Hrs @ 105°C

130

XC7Z015

-55°C ~ 105°C

B41858

0.492 Dia (12.50mm)

±20%

汽车

2200 µF

30mOhm @ 10kHz

0.197 (5.00mm)

Polar

25 mOhms

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

2.858 A @ 100 kHz

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 74K Logic Cells

-

1.654 (42.00mm)

-

XC7Z020-2CLG484I
XC7Z020-2CLG484I
AMD 数据表

420 In Stock

-

最小起订量: 1

最小包装量: 1

484-LFBGA, CSPBGA

484-CSPBGA (19x19)

Molex

Bulk

093338

活跃

130

-40°C ~ 100°C (TJ)

*

766MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 85K Logic Cells

-

XC7Z045-1FFG900C
XC7Z045-1FFG900C
AMD 数据表

762 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

TE Connectivity Deutsch 连接器

Bag

DIV40E15

活跃

130

0°C ~ 85°C (TJ)

*

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 350K Logic Cells

-

XCZU7EV-1FBVB900I
XCZU7EV-1FBVB900I
AMD 数据表

680 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

KEMET

Obsolete

Bulk

204

XCZU7

-40°C ~ 100°C (TJ)

-

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

-

AGFA023R25A3I3E
AGFA023R25A3I3E
Intel 数据表

640 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Molex

Bulk

120122

活跃

480

-40°C ~ 100°C (TJ)

*

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

AGFA019R25A2E3E
AGFA019R25A2E3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

通孔

Radial, Disc

-

Vishay Beyschlag/Draloric/BC Components

480

Bulk

活跃

440VAC

-40°C ~ 125°C

WYO

0.256 Dia (6.50mm)

±20%

Y5U (E)

Safety

1000 pF

-

0.197 (5.00mm)

1.4GHz

256KB

Straight

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

-

0.374 (9.50mm)

-

X1, Y2

AGFB027R31C2E1V
AGFB027R31C2E1V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

TE Connectivity Deutsch 连接器

Bag

DL66G12

活跃

720

0°C ~ 100°C (TJ)

*

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-