类别是'category.片上系统(SoC)' (7720)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 质量 | 终端数量 | 表面贴装的焊盘尺寸 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | 零件状态 | 终端 | 温度系数 | 类型 | 应用 | 性别 | HTS代码 | 电容量 | 子类别 | 技术 | 电压 - 供电 | 端子位置 | 方向 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 频率稳定性 | 输出量 | JESD-30代码 | 功能 | 基本谐振器 | 最大电流源 | 输出的数量 | 资历状况 | 接头数量 | ESR(等效串联电阻) | 失败率 | 引线间距 | 电源 | 温度等级 | 电流 - 电源(禁用)(最大值) | 极化 | 阻抗 | 速度 | 内存大小 | 引线样式 | 核心处理器 | 纹波电流@高频 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 输入 | 产品类别 | 温度范围 | 消耗功率 | 速度等级 | 绝对牵引范围 (APR) | 主要属性 | 逻辑单元数 | 核数量 | 闪光大小 | 连接类型 | 特征 | 产品类别 | 电气连接 | 座位高度(最大) | 长度 | 宽度 | 厚度(最大) | 辐射硬化 | 评级结果 | |||||||||||||||||||||||||||||||||||||||
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![]() | XCZU7CG-L2FBVB900E | AMD | 数据表 | 891 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 900-FCBGA (31x31) | AMD | 活跃 | 204 | Tray | XCZU7 | -40°C ~ 85°C | Tape & Reel (TR) | SiT8209 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | 活跃 | XO (Standard) | 3.3V | 133.333333MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 36mA | 31mA | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | -- | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | 0.032 (0.80mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EV-2FFVF1517I | AMD | 数据表 | 546 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 6-SMD, No Lead | 1517-FCBGA (40x40) | AMD | 活跃 | 464 | Tray | XCZU7 | -20°C ~ 70°C | Tape & Reel (TR) | SiT9120 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | 活跃 | XO (Standard) | 2.25 V ~ 3.63 V | 156.25MHz | ±10ppm | LVDS | Standby (Power Down) | MEMS | 55mA | 35mA | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | -- | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | 0.032 (0.80mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EG-1FBVB900E | AMD | 数据表 | 560 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 4-SMD, No Lead | 900-FCBGA (31x31) | AMD | 活跃 | 204 | Tray | XCZU4 | -20°C ~ 70°C | Tape & Reel (TR) | SiT8208 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | 活跃 | XO (Standard) | 2.8V | 26MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 33mA | 31mA | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | -- | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | 0.032 (0.80mm) | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU25DR-L2FSVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Flanges | Compliant | Bulk | * | 活跃 | Crimp | Female | Straight | 18 | 无 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU48DR-2FFVG1517E | Xilinx | 数据表 | 105 In Stock | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | 17.3 kg | AMD 赛灵思 | 活跃 | Compliant | 561 | Tray | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1.6 kW | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU48DR-2FFVE1156E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | Non-Compliant | 366 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z035-2FFG900E | AMD | 数据表 | 751 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 130 | Tray | XC7Z035 | 活跃 | 0°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 275K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057K3F35I2SG | ALTERA | 数据表 | 611 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 活跃 | INTEL CORP | 0.93 V | 5.45 | VFD-050HB-442E | Johnson Controls | 396 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | BGA | SQUARE | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | FPGA - 570K Logic Elements | 570000 | -- | Flanged | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS016E3F27I2LG | ALTERA | 数据表 | 513 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-BBGA, FCBGA | YES | 672-FBGA (27x27) | 672 | CE | Autonics | 240 | Non-Compliant | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 160000 LE | 1 | SMD/SMT | 20000 LAB | 964696 | Intel / Altera | Arria 10 SoC | 2 x 32 kB | - | BGA, BGA672,26X26,40 | 网格排列 | PLASTIC/EPOXY | BGA672,26X26,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.47 | TPS20-G1FP2-00 | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | Gauge | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | 4-20 mA | S-PBGA-B672 | 240 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | 现场可编程门阵列 | 15-35 VDC | SoC FPGA | 14-158 °F | FPGA - 160K Logic Elements | 160000 | 2 Core | -- | SoC FPGA | Head Type | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057H4F34I3LG | ALTERA | 数据表 | 946 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | 492 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 570000 LE | 24 | SMD/SMT | 71250 LAB | 964915 | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | BGA | SQUARE | 活跃 | INTEL CORP | BGA, BGA1152,34X34,40 | 0.93 V | 5.45 | HVX005A1-2A1B1B5CAD3 | Cutler Hammer, Div of Eaton Co | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 492 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-2LSEVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 402 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-1MSIVIVA1596 | AMD | 数据表 | 699 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU1EG-2SBVA484I | AMD | 数据表 | 2184 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | - | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-2LSEVFVC1760 | AMD | 数据表 | 832 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 500 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-1MSINSVF1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 316 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-1LLINBVB1024 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 424 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-2MSEVSVD1760 | AMD | 数据表 | 701 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-1MSEVSVD1760 | AMD | 数据表 | 847 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z015-1CLG485C | AMD | 数据表 | 2352 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 通孔 | Radial, Can | 485-CSPBGA (19x19) | - | EPCOS - TDK Electronics | Bulk | Obsolete | 25 V | 5000 Hrs @ 105°C | 130 | XC7Z015 | -55°C ~ 105°C | B41858 | 0.492 Dia (12.50mm) | ±20% | 汽车 | 2200 µF | 30mOhm @ 10kHz | 0.197 (5.00mm) | Polar | 25 mOhms | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 2.858 A @ 100 kHz | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 74K Logic Cells | - | 1.654 (42.00mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z020-2CLG484I | AMD | 数据表 | 420 In Stock | - | 最小起订量: 1 最小包装量: 1 | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) | Molex | Bulk | 093338 | 活跃 | 130 | -40°C ~ 100°C (TJ) | * | 766MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 85K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z045-1FFG900C | AMD | 数据表 | 762 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | TE Connectivity Deutsch 连接器 | Bag | DIV40E15 | 活跃 | 130 | 0°C ~ 85°C (TJ) | * | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EV-1FBVB900I | AMD | 数据表 | 680 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | KEMET | Obsolete | Bulk | 204 | XCZU7 | -40°C ~ 100°C (TJ) | - | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA023R25A3I3E | Intel | 数据表 | 640 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Molex | Bulk | 120122 | 活跃 | 480 | -40°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA019R25A2E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | Radial, Disc | - | Vishay Beyschlag/Draloric/BC Components | 480 | Bulk | 活跃 | 440VAC | -40°C ~ 125°C | WYO | 0.256 Dia (6.50mm) | ±20% | Y5U (E) | Safety | 1000 pF | - | 0.197 (5.00mm) | 1.4GHz | 256KB | Straight | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | - | 0.374 (9.50mm) | - | X1, Y2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB027R31C2E1V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | TE Connectivity Deutsch 连接器 | Bag | DL66G12 | 活跃 | 720 | 0°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - |
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