类别是'category.片上系统(SoC)' (7720)

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对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

触点镀层

底架

安装类型

包装/外壳

表面安装

引脚数

供应商器件包装

房屋材料

质量

终端数量

厂商

Voltage-Input

操作温度

包装

系列

尺寸/尺寸

容差

JESD-609代码

零件状态

终止次数

终端

温度系数

连接器类型

电阻

定位的数量

端子表面处理

最高工作温度

最小工作温度

组成

应用

功率(瓦特)

HTS代码

紧固类型

子类别

额定功率

技术

电压 - 供电

端子位置

方向

终端形式

峰值回流焊温度(摄氏度)

端子间距

深度

Reach合规守则

基本部件号

JESD-30代码

功能

输出的数量

资历状况

审批机构

效率

输出电压

工作电源电压

失败率

电源

温度等级

极化

最大输出电流

速度

内存大小

输出电流

核心处理器

周边设备

程序内存大小

连接方式

输入类型

输出功率

电压 - 输出

电压 - 输出 2

建筑学

输入数量

组织结构

座位高度-最大

可编程逻辑类型

电流-输出1

产品类别

电压 - 输出 3

表格

使用地区

线长

输入连接器

输出连接器

收发器数量

无负载功耗

主要属性

电流-输出2

逻辑块数量

逻辑单元数

核数量

闪光大小

电流-输出3

抽头/步数

独立延误次数

第一拍延迟

可用总延误

特征

触点增量

产品类别

高度

座位高度(最大)

长度

宽度

评级结果

10AS016E4F27E3LG
10AS016E4F27E3LG
ALTERA 数据表

880 In Stock

-

最小起订量: 1

最小包装量: 1

672-BBGA, FCBGA

YES

672-FBGA (27x27)

672

有

2 x 32 kB

1.2 GHz

160000 LE

1

SMD/SMT

20000 LAB

964735

Intel

Intel / Altera

Arria 10 SoC

2 x 32 kB

-

BGA, BGA672,26X26,40

网格排列

PLASTIC/EPOXY

BGA672,26X26,40

0.9 V

未说明

0.87 V

100 °C

有

10AS016E4F27E3LG

BGA

SQUARE

活跃

FPGA - Field Programmable Gate Array Arria 10 SX 160 SoC FPGA

INTEL CORP

0.93 V

1.96

Non-Compliant

240

0°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B672

240

不合格

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

240

3.25 mm

现场可编程门阵列

SoC FPGA

FPGA - 160K Logic Elements

160000

2 Core

--

SoC FPGA

27 mm

27 mm

XCZU2CG-2SFVA625I
XCZU2CG-2SFVA625I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Gold

Flanges, Panel, Through Hole

625-BFBGA, FCBGA

23

625-FCBGA (21x21)

AMD

Compliant

180

Tray

XCZU2

活跃

-40°C ~ 100°C (TJ)

Bulk

Zynq® UltraScale+™ MPSoC CG

Solder

Receptacle

19

175 °C

-65 °C

Threaded

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

Shielded

抗环境干扰

AGIB027R29A1E2VR3
AGIB027R29A1E2VR3
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Metal

Intel

Non-Compliant

720

Tray

活跃

1

Intel

Intel

0°C ~ 100°C (TJ)

Tray

Agilex I

Straight

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

Intel

XCZU3EG-1SFVA625I
XCZU3EG-1SFVA625I
AMD 数据表

663 In Stock

-

最小起订量: 1

最小包装量: 1

Panel

625-BFBGA, FCBGA

625-FCBGA (21x21)

230 g

AMD

XCZU3

活跃

5 V

Compliant

180

Tray

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

50 °C

0 °C

55 W

76.2 mm

3

70 %

12 V

500MHz, 600MHz, 1.2GHz

256KB

6 A

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

55 W

12 V

MCU, FPGA

6 A

-12 V

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

500 mA

-

500 mA

28.956 mm

127 mm

76.2 mm

AGID019R18A2E3E
AGID019R18A2E3E
Intel 数据表

670 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Intel

Non-Compliant

活跃

480

Tray

0°C ~ 100°C (TJ)

Agilex I

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

XC7Z035-2FBG676E
XC7Z035-2FBG676E
AMD 数据表

883 In Stock

-

最小起订量: 1

最小包装量: 1

676-BBGA, FCBGA

676-FCBGA (27x27)

AMD

130

Tray

XC7Z035

活跃

0°C ~ 100°C (TJ)

Zynq®-7000

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Kintex™-7 FPGA, 275K Logic Cells

-

5ASTMD3E3F31I3N
5ASTMD3E3F31I3N
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

896-BBGA, FCBGA

YES

896-FBGA (31x31)

896

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

1.18 V

5.29

Non-Compliant

MCU - 208, FPGA - 250

BGA, BGA896,30X30,40

网格排列

PLASTIC/EPOXY

BGA896,30X30,40

-40 °C

1.15 V

未说明

1.12 V

100 °C

有

5ASTMD3E3F31I3N

-40°C ~ 100°C (TJ)

Tray

Arria V ST

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

未说明

1 mm

compliant

5ASTMD3

S-PBGA-B896

540

INDUSTRIAL

1.05GHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

540

13207 CLBS

2.7 mm

现场可编程门阵列

FPGA - 350K Logic Elements

13207

350000

--

31 mm

31 mm

5CSEBA5U23C6N
5CSEBA5U23C6N
ALTERA 数据表

2307 In Stock

-

最小起订量: 1

最小包装量: 1

672-FBGA

YES

672-UBGA (23x23)

672

活跃

FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9

INTEL CORP

1.13 V

5.55

MCU - 181, FPGA - 145

FBGA, BGA672,28X28,32

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

BGA672,28X28,32

1.1 V

未说明

1.07 V

85 °C

有

5CSEBA5U23C6N

FBGA

SQUARE

Intel Corporation

0°C ~ 85°C (TJ)

Tray

Cyclone® V SE

活跃

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

0.8 mm

compliant

5CSEBA5

S-PBGA-B672

145

不合格

1.1,1.2/3.3,2.5 V

OTHER

925MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

145

1.85 mm

现场可编程门阵列

FPGA - 85K Logic Elements

85000

--

23 mm

23 mm

10AS016E3F29I1SG
10AS016E3F29I1SG
ALTERA 数据表

N/A

-

最小起订量: 1

最小包装量: 1

780-BBGA, FCBGA

780-FBGA (29x29)

288

Non-Compliant

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

Discontinued at Digi-Key

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 160K Logic Elements

--

M2S060TS-1VFG784I
M2S060TS-1VFG784I
Microchip 数据表

2218 In Stock

-

最小起订量: 1

最小包装量: 1

784-FBGA

784-VFBGA (23x23)

微芯片技术

Tray

活跃

-40°C ~ 100°C (TJ)

SmartFusion®2

166MHz

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

AGIB019R18A2E3V
AGIB019R18A2E3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

480

Tray

活跃

0°C ~ 100°C (TJ)

Agilex I

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

10AS027H3F34I2SG
10AS027H3F34I2SG
ALTERA 数据表

590 In Stock

-

最小起订量: 1

最小包装量: 1

FBGA-1152

YES

1152

384

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

270000 LE

1

SMD/SMT

33750 LAB

964831

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS027H3F34I2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

-40°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

384

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

384

3.65 mm

现场可编程门阵列

SoC FPGA

FPGA - 270K Logic Elements

270000

2 Core

--

SoC FPGA

35 mm

35 mm

XCZU2EG-2SFVA625I
XCZU2EG-2SFVA625I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

恩智浦半导体

Bulk

74AHC30

活跃

180

-40°C ~ 100°C (TJ)

*

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

AGFB008R16A2E3E
AGFB008R16A2E3E
Intel 数据表

595 In Stock

-

最小起订量: 1

最小包装量: 1

0805 (2012 Metric)

0805

KOA Speer Electronics, Inc.

Tape & Reel (TR)

RS73G2A

活跃

384

-55°C ~ 155°C

RS73

0.079 L x 0.049 W (2.00mm x 1.25mm)

±1%

2

±50ppm/°C

4.22 MOhms

厚膜

0.25W, 1/4W

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 764K Logic Elements

-

Automotive AEC-Q200, Moisture Resistant

0.024 (0.60mm)

AEC-Q200

XCZU3CG-1SFVA625E
XCZU3CG-1SFVA625E
AMD 数据表

2077 In Stock

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

霍尼韦尔传感与生产力解决方案

Bulk

Obsolete

180

XCZU3

0°C ~ 100°C (TJ)

-

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

5CSEBA6U23I7LN
5CSEBA6U23I7LN
ALTERA 数据表

2953 In Stock

-

最小起订量: 1

最小包装量: 1

5.79

INTEL CORP

活跃

Intel Corporation

5CSEBA6U23I7LN

Tray

*

活跃

compliant

现场可编程门阵列

XCZU25DR-1FFVE1156I
XCZU25DR-1FFVE1156I
Xilinx 数据表

752 In Stock

-

最小起订量: 1

最小包装量: 1

Tray

*

活跃

XCZU27DR-L2FSVG1517I
XCZU27DR-L2FSVG1517I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Tray

*

活跃

AGFA023R25A1I1V
AGFA023R25A1I1V
Intel 数据表

975 In Stock

-

最小起订量: 1

最小包装量: 1

表面贴装

8-TSSOP, 8-MSOP (0.118, 3.00mm Width)

8-uMAX/uSOP

Analog Devices Inc./Maxim Integrated

Tube

DS1100

Obsolete

480

-40°C ~ 85°C

-

4.75V ~ 5.25V

Nonprogrammable

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

5

1

100ns

500ns

100 ns

AGFC019R25A2I3E
AGFC019R25A2I3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

0402 (1005 Metric)

0402

KOA Speer Electronics, Inc.

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

RN73H1E

活跃

480

-55°C ~ 155°C

RN73H

0.039 L x 0.020 W (1.00mm x 0.50mm)

±0.5%

2

±50ppm/°C

10.1 Ohms

Metal Film

0.063W, 1/16W

-

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

Automotive AEC-Q200, Moisture Resistant

0.016 (0.40mm)

AEC-Q200

10AS022E3F29E1HG
10AS022E3F29E1HG
ALTERA 数据表

527 In Stock

-

最小起订量: 1

最小包装量: 1

780-BBGA, FCBGA

780-FBGA (29x29)

973472

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

有

10AS022E3F29E1HG

活跃

INTEL CORP

5.67

288

有

2 x 32 kB

1.2 GHz

220000 LE

+ 100 C

0 C

36

SMD/SMT

27500 LAB

0°C ~ 100°C (TJ)

Tray

Arria 10 SX

活跃

SOC - Systems on a Chip

unknown

950 mV

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

SoC FPGA

12 Transceiver

FPGA - 220K Logic Elements

2 Core

--

SoC FPGA

10AS057H2F34I2SG
10AS057H2F34I2SG
ALTERA 数据表

964 In Stock

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

Bulk

121024

活跃

492

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

570000 LE

24

SMD/SMT

Molex

71250 LAB

965012

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS057H2F34I2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.45

-40°C ~ 100°C (TJ)

Tray

*

活跃

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

492

不合格

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

492

3.65 mm

现场可编程门阵列

SoC FPGA

FPGA - 570K Logic Elements

570000

2 Core

--

SoC FPGA

35 mm

35 mm

10AS048K4F35I3LG
10AS048K4F35I3LG
ALTERA 数据表

724 In Stock

-

最小起订量: 1

最小包装量: 1

YES

-

1152

Advantech Corp

有

10AS048K4F35I3LG

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

0.93 V

5.47

Bulk

Obsolete

396

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

230VAC

100 °C

-

Tray

-

2.39 L x 2.01 W x 1.55 H (60.7mm x 51.1mm x 39.4mm)

活跃

ITE (Commercial)

6 W

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

396

不合格

CE, TUVgs

-

0.9 V

INDUSTRIAL

Positive Tip, Negative Sleeve

500mA

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

固定刀片

12V

MCU, FPGA

396

3.5 mm

现场可编程门阵列

Wall Mount (Class II)

Europe

72 (1.83m)

CEE 7/16

Phono Plug, 2.5mm O.D. x 11.5mm

-

FPGA - 480K Logic Elements

480000

--

35 mm

35 mm

10AS048K3F35I2SG
10AS048K3F35I2SG
ALTERA 数据表

554 In Stock

-

最小起订量: 1

最小包装量: 1

Axial

YES

Axial

1152

Tape & Reel (TR)

RNC60

活跃

396

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

480000 LE

1

SMD/SMT

Vishay Dale

60000 LAB

965306

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.9 V

未说明

0.87 V

100 °C

有

10AS048K3F35I2SG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.47

-65°C ~ 175°C

Tray

Military, MIL-PRF-55182/03, RNC60

0.097 Dia x 0.280 L (2.46mm x 7.11mm)

±0.1%

活跃

2

±50ppm/°C

124 Ohms

Metal Film

0.25W, 1/4W

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

396

不合格

M (1%)

0.9 V

INDUSTRIAL

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

396

3.5 mm

现场可编程门阵列

SoC FPGA

FPGA - 480K Logic Elements

480000

2 Core

--

Military, Moisture Resistant, Weldable

SoC FPGA

-

35 mm

35 mm

10AS066K3F35E2LG
10AS066K3F35E2LG
ALTERA 数据表

928 In Stock

-

最小起订量: 1

最小包装量: 1

0805 (2012 Metric)

YES

0805

1152

活跃

Tape & Reel (TR)

396

有

This product may require additional documentation to export from the United States.

2 x 32 kB

1.2 GHz

660000 LE

24

SMD/SMT

82500 LAB

Stackpole Electronics Inc

965076

Intel

Intel / Altera

Arria 10 SoC

Details

2 x 32 kB

-

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

未说明

0.87 V

100 °C

有

10AS066K3F35E2LG

BGA

SQUARE

活跃

INTEL CORP

0.93 V

5.46

-55°C ~ 155°C

Tray

RNCS

0.079 L x 0.049 W (2.00mm x 1.25mm)

±0.1%

活跃

2

±50ppm/°C

15.4 kOhms

Thin Film

0.1W, 1/10W

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

396

不合格

-

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

396

3.5 mm

现场可编程门阵列

SoC FPGA

FPGA - 660K Logic Elements

660000

2 Core

--

Anti-Corrosive, Automotive AEC-Q200, Moisture Resistant

SoC FPGA

0.026 (0.65mm)

35 mm

35 mm

AEC-Q200