类别是'category.片上系统(SoC)' (7720)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 房屋材料 | 质量 | 终端数量 | 厂商 | Voltage-Input | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | JESD-609代码 | 零件状态 | 终止次数 | 终端 | 温度系数 | 连接器类型 | 电阻 | 定位的数量 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 组成 | 应用 | 功率(瓦特) | HTS代码 | 紧固类型 | 子类别 | 额定功率 | 技术 | 电压 - 供电 | 端子位置 | 方向 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | 深度 | Reach合规守则 | 基本部件号 | JESD-30代码 | 功能 | 输出的数量 | 资历状况 | 审批机构 | 效率 | 输出电压 | 工作电源电压 | 失败率 | 电源 | 温度等级 | 极化 | 最大输出电流 | 速度 | 内存大小 | 输出电流 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 输入类型 | 输出功率 | 电压 - 输出 | 电压 - 输出 2 | 建筑学 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 电流-输出1 | 产品类别 | 电压 - 输出 3 | 表格 | 使用地区 | 线长 | 输入连接器 | 输出连接器 | 收发器数量 | 无负载功耗 | 主要属性 | 电流-输出2 | 逻辑块数量 | 逻辑单元数 | 核数量 | 闪光大小 | 电流-输出3 | 抽头/步数 | 独立延误次数 | 第一拍延迟 | 可用总延误 | 特征 | 触点增量 | 产品类别 | 高度 | 座位高度(最大) | 长度 | 宽度 | 评级结果 | ||||||||||||||||||||||||||||||||||||||||
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![]() | 10AS016E4F27E3LG | ALTERA | 数据表 | 880 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-BBGA, FCBGA | YES | 672-FBGA (27x27) | 672 | 有 | 2 x 32 kB | 1.2 GHz | 160000 LE | 1 | SMD/SMT | 20000 LAB | 964735 | Intel | Intel / Altera | Arria 10 SoC | 2 x 32 kB | - | BGA, BGA672,26X26,40 | 网格排列 | PLASTIC/EPOXY | BGA672,26X26,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS016E4F27E3LG | BGA | SQUARE | 活跃 | FPGA - Field Programmable Gate Array Arria 10 SX 160 SoC FPGA | INTEL CORP | 0.93 V | 1.96 | Non-Compliant | 240 | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B672 | 240 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 160K Logic Elements | 160000 | 2 Core | -- | SoC FPGA | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU2CG-2SFVA625I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Gold | Flanges, Panel, Through Hole | 625-BFBGA, FCBGA | 23 | 625-FCBGA (21x21) | AMD | Compliant | 180 | Tray | XCZU2 | 活跃 | -40°C ~ 100°C (TJ) | Bulk | Zynq® UltraScale+™ MPSoC CG | Solder | Receptacle | 19 | 175 °C | -65 °C | Threaded | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | Shielded | 抗环境干扰 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGIB027R29A1E2VR3 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Metal | Intel | Non-Compliant | 720 | Tray | 活跃 | 1 | Intel | Intel | 0°C ~ 100°C (TJ) | Tray | Agilex I | Straight | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | Intel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3EG-1SFVA625I | AMD | 数据表 | 663 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Panel | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | 230 g | AMD | XCZU3 | 活跃 | 5 V | Compliant | 180 | Tray | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 50 °C | 0 °C | 55 W | 76.2 mm | 3 | 70 % | 12 V | 500MHz, 600MHz, 1.2GHz | 256KB | 6 A | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 55 W | 12 V | MCU, FPGA | 6 A | -12 V | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 500 mA | - | 500 mA | 28.956 mm | 127 mm | 76.2 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGID019R18A2E3E | Intel | 数据表 | 670 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Non-Compliant | 活跃 | 480 | Tray | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z035-2FBG676E | AMD | 数据表 | 883 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | AMD | 130 | Tray | XC7Z035 | 活跃 | 0°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 275K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASTMD3E3F31I3N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 896-BBGA, FCBGA | YES | 896-FBGA (31x31) | 896 | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 1.18 V | 5.29 | Non-Compliant | MCU - 208, FPGA - 250 | BGA, BGA896,30X30,40 | 网格排列 | PLASTIC/EPOXY | BGA896,30X30,40 | -40 °C | 1.15 V | 未说明 | 1.12 V | 100 °C | 有 | 5ASTMD3E3F31I3N | -40°C ~ 100°C (TJ) | Tray | Arria V ST | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASTMD3 | S-PBGA-B896 | 540 | INDUSTRIAL | 1.05GHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA5U23C6N | ALTERA | 数据表 | 2307 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-FBGA | YES | 672-UBGA (23x23) | 672 | 活跃 | FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9 | INTEL CORP | 1.13 V | 5.55 | MCU - 181, FPGA - 145 | FBGA, BGA672,28X28,32 | GRID ARRAY, FINE PITCH | PLASTIC/EPOXY | BGA672,28X28,32 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5CSEBA5U23C6N | FBGA | SQUARE | Intel Corporation | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | 活跃 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 5CSEBA5 | S-PBGA-B672 | 145 | 不合格 | 1.1,1.2/3.3,2.5 V | OTHER | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | 现场可编程门阵列 | FPGA - 85K Logic Elements | 85000 | -- | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS016E3F29I1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 780-BBGA, FCBGA | 780-FBGA (29x29) | 288 | Non-Compliant | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Discontinued at Digi-Key | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 160K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060TS-1VFG784I | Microchip | 数据表 | 2218 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-FBGA | 784-VFBGA (23x23) | 微芯片技术 | Tray | 活跃 | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGIB019R18A2E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 480 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027H3F34I2SG | ALTERA | 数据表 | 590 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-1152 | YES | 1152 | 384 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 270000 LE | 1 | SMD/SMT | 33750 LAB | 964831 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS027H3F34I2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 384 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU2EG-2SFVA625I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | 恩智浦半导体 | Bulk | 74AHC30 | 活跃 | 180 | -40°C ~ 100°C (TJ) | * | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB008R16A2E3E | Intel | 数据表 | 595 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 0805 (2012 Metric) | 0805 | KOA Speer Electronics, Inc. | Tape & Reel (TR) | RS73G2A | 活跃 | 384 | -55°C ~ 155°C | RS73 | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±1% | 2 | ±50ppm/°C | 4.22 MOhms | 厚膜 | 0.25W, 1/4W | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | Automotive AEC-Q200, Moisture Resistant | 0.024 (0.60mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3CG-1SFVA625E | AMD | 数据表 | 2077 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | 霍尼韦尔传感与生产力解决方案 | Bulk | Obsolete | 180 | XCZU3 | 0°C ~ 100°C (TJ) | - | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA6U23I7LN | ALTERA | 数据表 | 2953 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 5.79 | INTEL CORP | 活跃 | Intel Corporation | 5CSEBA6U23I7LN | Tray | * | 活跃 | compliant | 现场可编程门阵列 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU25DR-1FFVE1156I | Xilinx | 数据表 | 752 In Stock | - | 最小起订量: 1 最小包装量: 1 | Tray | * | 活跃 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU27DR-L2FSVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Tray | * | 活跃 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA023R25A1I1V | Intel | 数据表 | 975 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8-uMAX/uSOP | Analog Devices Inc./Maxim Integrated | Tube | DS1100 | Obsolete | 480 | -40°C ~ 85°C | - | 4.75V ~ 5.25V | Nonprogrammable | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | 5 | 1 | 100ns | 500ns | 100 ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFC019R25A2I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 0402 (1005 Metric) | 0402 | KOA Speer Electronics, Inc. | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | RN73H1E | 活跃 | 480 | -55°C ~ 155°C | RN73H | 0.039 L x 0.020 W (1.00mm x 0.50mm) | ±0.5% | 2 | ±50ppm/°C | 10.1 Ohms | Metal Film | 0.063W, 1/16W | - | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | Automotive AEC-Q200, Moisture Resistant | 0.016 (0.40mm) | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS022E3F29E1HG | ALTERA | 数据表 | 527 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 780-BBGA, FCBGA | 780-FBGA (29x29) | 973472 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | 有 | 10AS022E3F29E1HG | 活跃 | INTEL CORP | 5.67 | 288 | 有 | 2 x 32 kB | 1.2 GHz | 220000 LE | + 100 C | 0 C | 36 | SMD/SMT | 27500 LAB | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 12 Transceiver | FPGA - 220K Logic Elements | 2 Core | -- | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS057H2F34I2SG | ALTERA | 数据表 | 964 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | Bulk | 121024 | 活跃 | 492 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 570000 LE | 24 | SMD/SMT | Molex | 71250 LAB | 965012 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS057H2F34I2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | -40°C ~ 100°C (TJ) | Tray | * | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 492 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS048K4F35I3LG | ALTERA | 数据表 | 724 In Stock |
- | 最小起订量: 1 最小包装量: 1 | YES | - | 1152 | Advantech Corp | 有 | 10AS048K4F35I3LG | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 0.93 V | 5.47 | Bulk | Obsolete | 396 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 230VAC | 100 °C | - | Tray | - | 2.39 L x 2.01 W x 1.55 H (60.7mm x 51.1mm x 39.4mm) | 活跃 | ITE (Commercial) | 6 W | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | CE, TUVgs | - | 0.9 V | INDUSTRIAL | Positive Tip, Negative Sleeve | 500mA | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 固定刀片 | 12V | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | Wall Mount (Class II) | Europe | 72 (1.83m) | CEE 7/16 | Phono Plug, 2.5mm O.D. x 11.5mm | - | FPGA - 480K Logic Elements | 480000 | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS048K3F35I2SG | ALTERA | 数据表 | 554 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Axial | YES | Axial | 1152 | Tape & Reel (TR) | RNC60 | 活跃 | 396 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 480000 LE | 1 | SMD/SMT | Vishay Dale | 60000 LAB | 965306 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS048K3F35I2SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.47 | -65°C ~ 175°C | Tray | Military, MIL-PRF-55182/03, RNC60 | 0.097 Dia x 0.280 L (2.46mm x 7.11mm) | ±0.1% | 活跃 | 2 | ±50ppm/°C | 124 Ohms | Metal Film | 0.25W, 1/4W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | M (1%) | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 480K Logic Elements | 480000 | 2 Core | -- | Military, Moisture Resistant, Weldable | SoC FPGA | - | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS066K3F35E2LG | ALTERA | 数据表 | 928 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 0805 (2012 Metric) | YES | 0805 | 1152 | 活跃 | Tape & Reel (TR) | 396 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 660000 LE | 24 | SMD/SMT | 82500 LAB | Stackpole Electronics Inc | 965076 | Intel | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS066K3F35E2LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.46 | -55°C ~ 155°C | Tray | RNCS | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.1% | 活跃 | 2 | ±50ppm/°C | 15.4 kOhms | Thin Film | 0.1W, 1/10W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | - | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | Anti-Corrosive, Automotive AEC-Q200, Moisture Resistant | SoC FPGA | 0.026 (0.65mm) | 35 mm | 35 mm | AEC-Q200 |
10AS016E4F27E3LG
ALTERA
分类:Embedded - System On Chip (SoC)
5,299.321312
XCZU2CG-2SFVA625I
AMD
分类:Embedded - System On Chip (SoC)
AGIB027R29A1E2VR3
Intel
分类:Embedded - System On Chip (SoC)
XCZU3EG-1SFVA625I
AMD
分类:Embedded - System On Chip (SoC)
4,291.528673
AGID019R18A2E3E
Intel
分类:Embedded - System On Chip (SoC)
181,373.957666
XC7Z035-2FBG676E
AMD
分类:Embedded - System On Chip (SoC)
10,193.526215
5ASTMD3E3F31I3N
ALTERA
分类:Embedded - System On Chip (SoC)
5CSEBA5U23C6N
ALTERA
分类:Embedded - System On Chip (SoC)
2,023.666798
10AS016E3F29I1SG
ALTERA
分类:Embedded - System On Chip (SoC)
M2S060TS-1VFG784I
Microchip
分类:Embedded - System On Chip (SoC)
1,475.000659
AGIB019R18A2E3V
Intel
分类:Embedded - System On Chip (SoC)
10AS027H3F34I2SG
ALTERA
分类:Embedded - System On Chip (SoC)
13,079.553478
XCZU2EG-2SFVA625I
AMD
分类:Embedded - System On Chip (SoC)
AGFB008R16A2E3E
Intel
分类:Embedded - System On Chip (SoC)
70,985.597902
XCZU3CG-1SFVA625E
AMD
分类:Embedded - System On Chip (SoC)
2,921.923061
5CSEBA6U23I7LN
ALTERA
分类:Embedded - System On Chip (SoC)
2,639.568967
XCZU25DR-1FFVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU27DR-L2FSVG1517I
Xilinx
分类:Embedded - System On Chip (SoC)
AGFA023R25A1I1V
Intel
分类:Embedded - System On Chip (SoC)
194,195.197742
AGFC019R25A2I3E
Intel
分类:Embedded - System On Chip (SoC)
10AS022E3F29E1HG
ALTERA
分类:Embedded - System On Chip (SoC)
8,470.005892
10AS057H2F34I2SG
ALTERA
分类:Embedded - System On Chip (SoC)
32,322.948912
10AS048K4F35I3LG
ALTERA
分类:Embedded - System On Chip (SoC)
31,527.175963
10AS048K3F35I2SG
ALTERA
分类:Embedded - System On Chip (SoC)
32,373.784309
10AS066K3F35E2LG
ALTERA
分类:Embedded - System On Chip (SoC)
37,709.893533
