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首页 全部商品 category.集成电路IC category.片上系统（SoC）

类别是'category.片上系统（SoC）' (7720)

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对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

工厂交货时间

底架

包装/外壳

表面安装

引脚数

供应商器件包装

# Application Cores / # Real-Time Cores

100G Multirate Ethernet MAC

14-bit RF-ADC # of ADCs

14-bit RF-ADC Max Sample Rate (GSPS)

14-bit RF-DAC # of DACs

14-bit RF-DAC Max Sample Rate (GSPS)

400G High-Speed Crypto Engines

600G Ethernet MAC

AI Engine Tiles

AIE-ML v2 Tiles

Application Cores / Real-Time Cores

Application Cores Core Details

Application Cores Cores per Cluster / # Clusters

Application Processing Unit

Application Processor

Channelizer

DDR Memory Controllers

DSP Engines

DSP58

FFT/iFFT

General Connectivity

GPU

GPU Cores (Arm Mali-G78AE)

GTM Transceivers (56G (112G))

GTM2 CPM6 32G (64G)8, 9

GTM2 PL Only 56G (112G)7, 8

GTMP Transceivers (56G (112G))

GTYP Transceivers

GTYP Transceivers (PL-Only)

High-Performance I/O

High-Performance I/O (X5IO)

High-Speed Connectivity

High-Speed Crypto Engine (HSC)

Image Signal Processor (ISP) Tiles

INT8 TOPS (Dense)

INT8 TOPS (Max Sparsity)

Integrated Memory on Package (LPDDR5X)

L3 Cache per Cluster (MB)

LDPC Decoder

Max. Memory Bandwidth (LPDDR5X)

MX6 TOPS (Dense)

On-Chip Memory w/ECC (MB)

PCI Express®

PCIe® w/ DMA & CXL® 3.1 (CPM6)

PL PCIe (Gen5 x4)

PL PCIe (Gen5x4)

Poly Block

Real-Time Cores Core Details

Real-Time Cores Cores per Cluster / # Clusters

Real-Time Processing Unit

Real-Time Processor

System Logic Cells

System-Level Cache (MB)

Total PL Memory (Mb)

Total PL Memory6(Mb)

Video Codec Unit (VCU) Tiles

操作温度

包装

已出版

系列

JESD-609代码

零件状态

湿度敏感性等级(MSL)

终止次数

端子表面处理

HTS代码

端子位置

终端形式

峰值回流焊温度（摄氏度）

电源电压

端子间距

Reach合规守则

频率

时间@峰值回流温度-最大值(s)

基本部件号

JESD-30代码

输出的数量

资历状况

工作电源电压

电源电压-最大值(Vsup)

电源

电源电压-最小值(Vsup)

界面

最大电源电压

最小电源电压

内存大小

工作电源电流

速度

内存大小

uPs/uCs/外围ICs类型

核心处理器

周边设备

连接方式

数据率

建筑学

输入数量

可编程逻辑类型

逻辑元件/单元数

核心架构

阀门数量

主要属性

逻辑单元数

闪光大小

LUTs（图形用户界面）

座位高度(最大)

长度

宽度

RoHS状态

无铅
2VM3654
2VM3654
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

4/6

2

Arm® Cortex®-A78AE, 64 KB I w/parity & D w/ECC L1 Cache, 512 KB L2 Cache

4/1

1428

CAN/CAN-FD, SPI, UART, USB 2.0, I2C/I3C, GPIO

1

24

260

PCI Express® Gen5 x4 , USB 3.2, DisplayPort™ 1.4, 10G Ethernet, 1G Ethernet, UFS 3.1

1

2

136 GB/s

1

2

Arm Cortex-R52, 32 KB L1 Cache w/ECC, 128 KB TCM w/ECC

2/3

695800

55.2

2

318080

 2VM3358
2VM3358
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8/10

1

Arm® Cortex®-A78AE, 64 KB I w/parity & D w/ECC L1 Cache, 512 KB L2 Cache

2/4

184

CAN/CAN-FD, SPI, UART, USB 2.0, I2C/I3C, GPIO

4

4

288

PCI Express® Gen5 x4 , USB 3.2, DisplayPort™ 1.4, 10G Ethernet, 1G Ethernet, UFS 3.1

1

102 GB/s

2

1

Arm Cortex-R52, 32 KB L1 Cache w/ECC, 128 KB TCM w/ECC

2/5

206920

4

21.1

1

94592

 2VM3558
2VM3558
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8/10

1

Arm® Cortex®-A78AE, 64 KB I w/parity & D w/ECC L1 Cache, 512 KB L2 Cache

2/4

700

CAN/CAN-FD, SPI, UART, USB 2.0, I2C/I3C, GPIO

4

12

384

PCI Express® Gen5 x4 , USB 3.2, DisplayPort™ 1.4, 10G Ethernet, 1G Ethernet, UFS 3.1

1

136 GB/s

2

3

Arm Cortex-R52, 32 KB L1 Cache w/ECC, 128 KB TCM w/ECC

2/5

492188

4

23.9

1

225000

 2VM3858
2VM3858
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8/10

3

Arm® Cortex®-A78AE, 64 KB I w/parity & D w/ECC L1 Cache, 512 KB L2 Cache

2/4

2064

CAN/CAN-FD, SPI, UART, USB 2.0, I2C/I3C, GPIO

4

20

512

PCI Express® Gen5 x4 , USB 3.2, DisplayPort™ 1.4, 10G Ethernet, 1G Ethernet, UFS 3.1

1

170 GB/s

2

4

Arm Cortex-R52, 32 KB L1 Cache w/ECC, 128 KB TCM w/ECC

2/5

1188040

4

97.0

1

543104

 VR1602
VR1602
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2

16

8

16

16

126

Application Processing Unit Dual-core Arm® Cortex®-A72, 48 KB/32 KB L1 Cache w/ parity & ECC; 1 MB L2 Cache w/ ECC

224

5

2256

28

8 (4)

12

4

Memory 256 KB On-Chip Memory w/ECC

1 x Gen5x4

Real-Time Processing Unit Dual-core Arm Cortex-R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM w/ECC

1205400

156

Connectivity Ethernet (x2); UART (x2); CAN-FD (x2); USB 2.0 (x1); SPI (x2); I2C (x2)

551040

 VR1952
VR1952
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2

8

32

16

16

3

120

Application Processing Unit Dual-core Arm® Cortex®-A72, 48 KB/32 KB L1 Cache w/ parity & ECC; 1 MB L2 Cache w/ ECC

320

5

3976

40

20 (10)

6

Memory 256 KB On-Chip Memory w/ECC

1 x Gen5x4

24*

Real-Time Processing Unit Dual-core Arm Cortex-R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM w/ECC

2473800

189

Connectivity Ethernet (x2); UART (x2); CAN-FD (x2); USB 2.0 (x1); SPI (x2); I2C (x2)

1130880

 2VP3402
2VP3402
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1

1

3

Dual-core Arm® Cortex® A72, 48 KB/32 KB L1 Cache w/ parity & ECC; 1 MB L2 Cache w/ ECC

6080

16 (16)

40 (40)

736

273 GB/s

256 KB On-Chip Memory w/ECC

2x Gen6x8

Dual-core Arm Cortex R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM w/ECC

2561160

256

Ethernet (x2); UART (x2); CAN-FD (x2); USB 2.0 (x1); SPI (x2); I2C (x2)

1170816

 2VP3522
2VP3522
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1

1

5

Dual-core Arm® Cortex® A72, 48 KB/32 KB L1 Cache w/ parity & ECC; 1 MB L2 Cache w/ ECC

2856

16 (16)

56 (56)

32 GB

307 GB/s

256 KB On-Chip Memory w/ECC

2x Gen6x8

Dual-core Arm Cortex R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM w/ECC

3273480

327

Ethernet (x2); UART (x2); CAN-FD (x2); USB 2.0 (x1); SPI (x2); I2C (x2)

1496448

 2VP3622
2VP3622
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1

1

5

Dual-core Arm® Cortex® A72, 48 KB/32 KB L1 Cache w/ parity & ECC; 1 MB L2 Cache w/ ECC

7616

16 (16)

56 (56)

32 GB

307 GB/s

256 KB On-Chip Memory w/ECC

2x Gen6x8

Dual-core Arm Cortex R5F, 32 KB/32 KB L1 Cache, and 256 KB TCM w/ECC

3273480

327

Ethernet (x2); UART (x2); CAN-FD (x2); USB 2.0 (x1); SPI (x2); I2C (x2)

1496448

 2VE3304
2VE3304
 AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1

24

4 / 4

Arm Cortex-A78AE, 64 KB I w/parity & D w/ECC L1 Cache, 512 KB L2 Cache, 1 MB L3 Cache (per 2-core cluster), CMN600 w/4 MB Last-Level Cache (shared)

184

CAN/CAN-FD, SPI, UART, USB 2.0, I2C/I3C, GPIO

1x 4-Core Arm Mali-G78AE GPU

4

260

PCI Express® Gen5x4, USB 3.2, DisplayPort™ 1.4, 10G Ethernet, 1G Ethernet, UFS 3.1

0

31

61

102 GB/s

2 MB On-Chip Memory w/ECC

61

1

Arm Cortex-R52, 32 KB L1 Cache w/ECC, 128 KB TCM w/ECC

206920

21.1

0

94592

 5CSEBA4U19I7LN
5CSEBA4U19I7LN
 Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

15 Weeks

484-FBGA

MCU - 151, FPGA - 66

-40°C~100°C TJ

Tray

2018

Cyclone® V SE

活跃

compliant

925MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

现场可编程门阵列

FPGA - 40K Logic Elements

 5ASXFB5H4F40I3NES
5ASXFB5H4F40I3NES
 Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1517-BBGA, FCBGA

1517-FBGA, FC (40x40)

MCU - 208, FPGA - 540

-40°C~100°C TJ

Tray

Arria V SX

Obsolete

3 (168 Hours)

5ASXFB5

1.05GHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 462K Logic Elements

 1SX280LU3F50I2VG
1SX280LU3F50I2VG
 Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

12 Weeks

2397-BBGA, FCBGA

704

-40°C~100°C TJ

Tray

Stratix® 10 SX

活跃

3 (168 Hours)

1.5GHz

256KB

微处理器电路

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 2800K Logic Elements

符合RoHS标准

 10AS032H2F35E1HG
10AS032H2F35E1HG
 Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

384

0°C~100°C TJ

Tray

Arria 10 SX

活跃

3 (168 Hours)

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 320K Logic Elements

符合RoHS标准

 10AS032H2F34E1HG
10AS032H2F34E1HG
 Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8 Weeks

1152-BBGA, FCBGA

384

0°C~100°C TJ

Tray

Arria 10 SX

活跃

3 (168 Hours)

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 320K Logic Elements

符合RoHS标准

 10AS066H2F34E1HG
10AS066H2F34E1HG
 Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8 Weeks

1152-BBGA, FCBGA

492

0°C~100°C TJ

Tray

Arria 10 SX

活跃

3 (168 Hours)

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 660K Logic Elements

符合RoHS标准

 10AS032H2F35I1HG
10AS032H2F35I1HG
 Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

384

-40°C~100°C TJ

Tray

Arria 10 SX

活跃

3 (168 Hours)

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 320K Logic Elements

符合RoHS标准

 10AS048E2F29I1HG
10AS048E2F29I1HG
 Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8 Weeks

780-BBGA, FCBGA

360

-40°C~100°C TJ

Tray

Arria 10 SX

活跃

3 (168 Hours)

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 480K Logic Elements

符合RoHS标准

 5CSEBA5U23C7SN
5CSEBA5U23C7SN
 Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

8 Weeks

672-FBGA

YES

MCU - 181, FPGA - 145

0°C~85°C TJ

Tray

2018

Cyclone® V SE

活跃

3 (168 Hours)

672

8542.39.00.01

BOTTOM

BALL

未说明

1.1V

0.8mm

未说明

5CSEBA5

S-PBGA-B672

145

不合格

1.13V

1.11.2/3.32.5V

1.07V

800MHz

64KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

145

现场可编程门阵列

FPGA - 85K Logic Elements

85000

1.85mm

23mm

23mm

符合RoHS标准

 5CSXFC6C6U23I7LN
5CSXFC6C6U23I7LN
 Intel 数据表

2302 In Stock

-

最小起订量: 1

最小包装量: 1

15 Weeks

672-FBGA

MCU - 181, FPGA - 145

-40°C~100°C TJ

Tray

2018

Cyclone® V SX

活跃

compliant

925MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

现场可编程门阵列

FPGA - 110K Logic Elements

 BCM3383DUKFEBG
BCM3383DUKFEBG
 Broadcom Limited 数据表

420 In Stock

-

最小起订量: 1

最小包装量: 1

活跃

1 (Unlimited)

ROHS3 Compliant

 A2F200M3F-FGG484
A2F200M3F-FGG484
 Microsemi Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2 Weeks

484-BGA

YES

484

MCU - 41, FPGA - 94

0°C~85°C TJ

Tray

2011

SmartFusion®

e1

活跃

3 (168 Hours)

484

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

250

1.5V

1mm

80MHz

40

A2F200

94

不合格

1.5V

1.51.82.53.3V

EBI/EMI, Ethernet, I2C, SPI, UART, USART

1.575V

1.425V

4.5kB

7mA

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

400 kbps

MCU, FPGA

现场可编程门阵列

2500

ARM

200000

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

2.44mm

23mm

23mm

符合RoHS标准

无铅

 BCM1125HA2K600
BCM1125HA2K600
 Broadcom Limited 数据表

N/A

-

最小起订量: 1

最小包装量: 1

表面贴装

BGA

Obsolete

1 (Unlimited)

600MHz

符合RoHS标准

 1SX280LU3F50E2LG
1SX280LU3F50E2LG
 Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2397-BBGA, FCBGA

704

0°C~100°C TJ

Tray

Stratix® 10 SX

活跃

3 (168 Hours)

1.5GHz

256KB

微处理器电路

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 2800K Logic Elements

符合RoHS标准

 1SX280LU2F50I2VG
1SX280LU2F50I2VG
 Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

12 Weeks

2397-BBGA, FCBGA

704

-40°C~100°C TJ

Tray

Stratix® 10 SX

活跃

3 (168 Hours)

1.5GHz

256KB

微处理器电路

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 2800K Logic Elements

符合RoHS标准