100000 In Stock

• 1: ¥52.228991
• 10: ¥49.272631
• 100: ¥46.483617
• 500: ¥43.852466
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-

表面贴装

44-SMD Module

Silicon Labs

1.8 V

SMD/SMT

8.8 mA

I2C, SPI, UART

- 98.6 dBm

4.8 mA

Silicon Laboratories

Silicon Labs

Integrated

Details

Bluetooth Low Energy (BLE)

6 mm x 6 mm x 1.1 mm

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

BGM220

活跃

Chip

有

+ 105 C

3.8 V

- 40 C

-40°C ~ 105°C (TA)

MouseReel

-

Wireless & RF Modules

1.8V ~ 3.8V

Shielded

2.4GHz ~ 2.4835GHz

2500

1.8 V to 3.8 V

512kB Flash, 32kB RAM

6 dBm

2Mbps

EFR32BG22

蓝牙模块

Bluetooth v5.2

2.4 GHz to 2.4835 GHz

6dBm

Bluetooth

Integrated, Chip

-106.4dBm

ADC, I²C, I²S, PWM, SPI, IrDA, UART, USART

4.2mA ~ 4.8mA

4.6mA ~ 8.8mA

GFSK

蓝牙模块

Bluetooth Modules - 802.15.1

1.1 mm

6 mm

6 mm

N/A

-

N/A

-

200 In Stock

-

Non-Compliant

205 In Stock

• 1: ¥345.098506
• 10: ¥325.564628
• 100: ¥307.136444
• 500: ¥289.751359
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-

卡边缘

Module

SIMCom Wireless Solutions Limited

Tray

活跃

-40°C ~ 85°C

-

0.25 %

100 ppm/°C

965 Ω

155 °C

-55 °C

Thin Film

250 mW

3V ~ 3.6V

850MHz, 900MHz, 1.8GHz, 1.9GHz

150 V

-

10Mbps

-

EDGE, GPRS, HSPA+, LTE, WCDMA

-

Cellular

不包括天线

-

I²C, PCM, UART, USB

-

-

-

650 µm

27 In Stock

• 1: ¥103.365172
• 10: ¥97.514314
• 100: ¥91.994639
• 500: ¥86.787392
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Gold

Jam Nut

表面贴装

36-SMD Module

微芯片技术

802.11 b/g/n, Bluetooth

ATWINC3400

活跃

Chip

22.43 mm x 14.73 mm x 2 mm

Non-Compliant

802.11 b/g/n

+ 85 C

3.6 V

- 40 C

500

802.11b

2.7 V

SMD/SMT

87 mA

SPI, UART

256 mA

Microchip

Microchip Technology / Atmel

-40°C ~ 85°C

Bulk

Crimp

介质访问控制网络控制器

125 °C

-55 °C

Male

Wireless & RF Modules

2.7V ~ 3.6V

Straight

49.63 mm

2.412 GHz to 2.472 GHz

55

Chip

Pin

10 Channel

Cadmium

256 kB

18.3 dBm

1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s

-

多协议模块

802.11b/g/n, Bluetooth v5.0

18.3dBm

Bluetooth, WiFi

Integrated, Chip

-95dBm

I²C, SPI, UART

23.7mA

24mA

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, DSSS, OFDM, QPSK

能源模块

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK

多协议模块

55.16 mm

无

有

N/A

-

Production (Last Updated: 3 years ago)

表面贴装

66-SMD Module

Vertical

Analog Devices Inc.

Non-Compliant

This product may require additional documentation to export from the United States.

+ 85 C

3.76 V

0.626450 oz

- 40 C

22

2.1 V

SPI, UART

Analog Devices Inc.

模拟器件

ARM Cortex M3

Tray

LTP5901

活跃

-40°C ~ 85°C

Tray

LTP5901-IPR

Ethernet & Communication Modules

2.1V ~ 3.76V

Vertical

5 A

2.4 GHz to 2.484 GHz

6.35 mm

Brass

512kB Flash, 72kB SRAM

-

5 A

250 kb/s

-

13.33 mm

网络模块

Smartmesh IP™, 6LoWPAN

8dBm

802.15.4

Integrated, Chip

-95dBm

SPI, UART

4.5mA

5.4mA ~ 9.7mA

-

Wireless Sensor Networks

网络模块

1000 In Stock

• 1: ¥574.216393
• 10: ¥541.713578
• 100: ¥511.050548
• 500: ¥482.123158
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表面贴装

66-SMD Module

Analog Devices Inc.

2.1 V

SPI, UART

Analog Devices Inc.

模拟器件

ARM Cortex M3

Details

Tray

LTP5901

活跃

有

LTP5901IPC-IPRA1C1#PBF

Unknown

LINEAR TECHNOLOGY CORP

8.42

凌力尔特

有

This product may require additional documentation to export from the United States.

+ 85 C

3.76 V

0.626450 oz

- 40 C

-40°C ~ 85°C

Tray

LTP5901-IPR

Ethernet & Communication Modules

2.1V ~ 3.76V

compliant

2.4 GHz to 2.484 GHz

66

22

512kB Flash, 72kB SRAM

-

250 kb/s

-

网络模块

Smartmesh IP™, 6LoWPAN

8dBm

802.15.4

Integrated, Chip

-95dBm

SPI, UART

4.5mA

5.4mA ~ 9.7mA

-

Wireless Sensor Networks

网络模块

1000 In Stock

• 1: ¥510.579584
• 10: ¥481.678850
• 100: ¥454.414013
• 500: ¥428.692462
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表面贴装

8-SOIC (0.154, 3.90mm Width)

YES

8-SOIC

66

Analog Devices Inc.

This product may require additional documentation to export from the United States.

+ 85 C

3.76 V

0.626450 oz

- 40 C

22

2.1 V

SPI, UART

Analog Devices Inc.

模拟器件

ARM Cortex M3

Details

Tray

LTP5901

活跃

XMA, MODULE66(UNSPEC)

微电子组件

PLASTIC/EPOXY

MODULE66(UNSPEC)

-40 °C

3.6 V

85 °C

有

LTP5901IPC-IPRB1C1#PBF

XMA

RECTANGULAR

活跃

ANALOG DEVICES INC

2.2

-40°C ~ 85°C

Tape & Reel (TR)

--

活跃

5A002

8525.60.10.50

Ethernet & Communication Modules

HYBRID

2.1V ~ 3.76V

QUAD

无铅

未说明

1

1 mm

compliant

2.4 GHz to 2.484 GHz

未说明

EL5205

R-PXMA-N66

--

INDUSTRIAL

2

512kB Flash, 72kB SRAM

-

9.5mA

3000 V/µs

250 kb/s

电压反馈

8µA

4 V ~ 13.2 V, ±2 V ~ 6.6 V

3.54 mm

-

网络模块

Smartmesh IP™, 6LoWPAN

3mV

700MHz

电信电路

8dBm

802.15.4

Integrated, Chip

-95dBm

SPI, UART

4.5mA

5.4mA ~ 9.7mA

-

Wireless Sensor Networks

网络模块

42 mm

24 mm

53 In Stock

-

N/A

-

LCC

Multi-mode Smart LTE Module with Wi-Fi & Bluetooth

表面贴装

Commercial grade

-40 to 75 °C

Commercial

21 In Stock

• 1: ¥98.540142
• 10: ¥92.962395
• 100: ¥87.700378
• 500: ¥82.736205
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表面贴装

572-BGA, FCBGA

572-FBGA, FC (25x25)

260

有

348

Silicon Laboratories

Silicon Labs

Z-WAVE

-40°C ~ 100°C (TJ)

Tray

Arria II GX

活跃

Wireless & RF Integrated Circuits

Si

0.87 V ~ 0.93 V

EP2AGX95

89178

RF System on a Chip - SoC

6839296

3747

RF System on a Chip - SoC

N/A

-

表面贴装

31-SMD Module

Silicon Labs

WT12-A

Obsolete

-40°C ~ 85°C

WT12

2.7V ~ 3.6V

2.4GHz

Bulk

1MB Flash

3Mbps

BlueCore4

Bluetooth v2.1 + EDR, Class 2

3dBm

Bluetooth

Integrated, Chip

-86dBm

PIO, SPI, UART, USB

70mA

70mA

DQPSK, GFSK

N/A

-

NRND (Last Updated: 2 years ago)

表面贴装

35-SMD Module

微芯片技术

Hollow

Dynapar

有

Bulk

RN41

最后一次购买

HS35R0100A37D

CE

-40 to 85 Degrees C

RN41

6 ft Cable

3V ~ 3.6V

2.4GHz

5~26 VDC

Differential

Hollowshaft

-

3Mbps

-

Bluetooth v2.1 +EDR, Class 1

11.9dBm

Bluetooth

不包括天线

-86dBm

SPI, UART

35mA

65mA

-

5~26 VDC

有

IP67

N/A

-

表面贴装

Module

Telit Cinterion

Tape & Reel (TR)

活跃

-40°C ~ 85°C

Cinterion®

3.3V ~ 4.5V

-

-

85.6kbps

-

GPRS, GSM

-

Cellular

不包括天线

-

GPIO, I²C, I²S, PWM

-

-

-

47 In Stock

• 1: ¥43.147892
• 10: ¥40.705558
• 100: ¥38.401469
• 500: ¥36.227800
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表面贴装

38-SMD Module

Espressif Systems

Non-Compliant

Tape & Reel (TR)

ESP32

不用于新设计

-40°C ~ 85°C (TA)

ESP32

1 %

2

300 ppm/°C

40 mΩ

275 °C

-65 °C

Wirewound

7 W

3V ~ 3.6V

2.4GHz

4MB Flash

150Mbps

ESP32-D0WD

802.11b/g/n, Bluetooth v4.2 + EDR, Class 1, 2 and 3

18.5dBm

Bluetooth, WiFi

PCB Trace

-98dBm

ADC, GPIO, I²C, I²S, JTAG, SDIO, SPI, UART

-

-

CCK, DSSS, OFDM

35.3314 mm

9.525 mm

N/A

-

表面贴装

Module

-40°C ~ 85°C

Tape & Reel (TR)

--

活跃

2.7 V ~ 3.6 V

2.4GHz ~ 2.5GHz

448kB ROM, 520kB SRAM

150Mbps

ESP32-D0WDQ6

802.11b/g/n, Bluetooth v4.2 + EDR, Class 1, 2 and 3

20.5dBm

Bluetooth, WiFi

--

-98dBm

I²C, I²S, PWM, SDIO, UART

--

--

CCK, DSSS, OFDM

N/A

-

YES

28

UNSPECIFIED

-25 °C

3 V

75 °C

EYSGJNZXX

RECTANGULAR

TAIYO YUDEN

活跃

TAIYO YUDEN CO LTD

5.69

Non-Compliant

LGA-28

8542.39.00.01

UNSPECIFIED

无铅

1

0.4 mm

unknown

R-XXMA-N28

微电子组件

商业扩展

1.5 mm

电信电路

11.3 mm

5.1 mm

N/A

-

表面贴装

106-BLGA Module

Telit Cinterion

Non-Compliant

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

ENS22

Obsolete

-40°C ~ 85°C

Cinterion ENS22

2.8V ~ 4.2V

700MHz, 800MHz, 850MHz, 900MHz, 1.8GHz

-

250kbps

Hi2115

LTE CAT.NB

23dBm

Cellular

不包括天线

-

UART, USB

-

-

-

100 In Stock

• 1: ¥75.526401
• 10: ¥71.251318
• 100: ¥67.218231
• 500: ¥63.413425
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-

表面贴装

31-SMD Module

Silicon Labs

9.9 mA

Silicon Laboratories

Silicon Labs

Details

Bluetooth Low Energy (BLE), Class 2

Strip

BGM210

活跃

15 mm x 12.9 mm x 2.2 mm

U.FL

有

+ 125 C

3.8 V

- 40 C

100

1.71 V

PCB 安装

173 mA

I2C, SPI, UART

-40°C ~ 125°C (TA)

切割胶带

蓝壁虎

USB适配器

Wireless & RF Modules

1.71V ~ 3.8V

Shielded

2.44 GHz

- 94.1 dBm

1.71 V to 3.8 V

1 MB

20 dBm

2Mbps

EFR32BG21

蓝牙模块

Bluetooth 5.1

2.4 GHz to 2.4835 GHz

20dBm

Bluetooth

Integrated, Chip

-104.5dBm

ADC, GPIO, I²C, I²S, IrDA, PWM, SPI, UART

9.1mA ~ 9.9mA

59.7mA ~ 173mA

GFSK

蓝牙模块

Bluetooth Modules - 802.15.1

2.2 mm

15 mm

12.9 mm

N/A

-

表面贴装

94-LGA Module

Telit

29x12,4x25mm

AgSnO2

1 200 Ohm

有

Tray

Obsolete

-

40

Power

3.3V

-

-

-

160kbps

单刀双掷

-

GNSS, LTE

24VDC

500 mW

23dBm

Cellular, Navigation

不包括天线

-

I²C, SPI, UART, USB

-

-

-

N/A

-

802.11 a/ac/b/g/n, Bluetooth

19 mm x 30 mm x 2.4 mm

有

u.FL

WiFi

有

+ 85 C

3.3 V

0.326108 oz

- 20 C

1

3.3 V

UART

SX-SDMAC-2832S+SP

Silex Technology

Bulk

Wireless & RF Modules

2.402 GHz to 2.48 GHz, 5.18 GHz to 5.825 GHz

Silex Technology

3.3 V

433 Mb/s

多协议模块

CSMA/CA, DSSS, OFDM

多协议模块

18 In Stock

• 1: ¥30.237492
• 10: ¥28.525931
• 100: ¥26.911255
• 500: ¥25.387982
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表面贴装

38-SMD Module

Espressif Systems

25

450

Brown

无

750

Class 5 = flexible

Tape & Reel (TR)

ESP32

活跃

Polyvinyl chloride (PVC)

Tinned

10.2

-40°C ~ 85°C (TA)

ESP32

3V ~ 3.6V

2.4GHz

无

4MB Flash

150Mbps

ESP32-D0WD-V3, ESP32-D0WDR2-V3

802.11b/g/n, Bluetooth v4.2 + EDR, Class 1, 2 and 3

19.5dBm

Bluetooth, WiFi

PCB Trace

-97dBm

ADC, GPIO, I²C, I²S, JTAG, PWM, SDIO, SPI, UART

112mA ~ 118mA

165mA ~ 239mA

8DPSK, DQPSK

18 In Stock

• 1: ¥33.059656
• 10: ¥31.188355
• 100: ¥29.422976
• 500: ¥27.757526
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-

表面贴装

38-SMD Module

Espressif Systems

ESP32

活跃

-40°C ~ 85°C (TA)

ESP32

3V ~ 3.6V

2.4GHz

Tape & Reel (TR)

16MB Flash, 8MB SRAM

150Mbps

ESP32-D0WD-V3, ESP32-D0WDR2-V3

802.11b/g/n, Bluetooth v4.2 + EDR, Class 1, 2 and 3

19.5dBm

Bluetooth, WiFi

PCB Trace

-97dBm

ADC, GPIO, I²C, I²S, JTAG, PWM, SDIO, SPI, UART

-

-

-

18 In Stock

• 1: ¥28.221759
• 10: ¥26.624301
• 100: ¥25.117266
• 500: ¥23.695535
查看所有的价格

-

表面贴装

38-SMD Module

Steel

Espressif Systems

With permanent frame

Tape & Reel (TR)

ESP32

活跃

IP20

-40°C ~ 85°C

ESP32

2.7V ~ 3.6V

630

2.412GHz ~ 2.484GHz

Other

8MB Flash, 536kB SRAM

150Mbps

ESP32-D0WDQ6

802.11b/g/n, Bluetooth v4.2 + EDR, Class 1, 2 and 3

20dBm

Bluetooth, WiFi

Integrated, Trace

-98dBm

ADC, GPIO, I²C, I²S, PWM, SDIO, SPI, UART

-

-

-

2026

610