类别是'category.PLDs(可编程逻辑器件)' (2797)

  • 所有品牌

对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

表面安装

终端数量

JESD-609代码

无铅代码

ECCN 代码

端子表面处理

附加功能

HTS代码

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

输出的数量

资历状况

温度等级

传播延迟

建筑学

输入数量

组织结构

座位高度-最大

可编程逻辑类型

筛选水平

输出功能

宏细胞数

JTAG BST

专用输入数量

系统内可编程

产品条款数量

长度

宽度

PAL16R8A-2CJ
PAL16R8A-2CJ
Texas Instruments 数据表

N/A

-

最小起订量: 1

最小包装量: 1

CY7C332-20DMB
CY7C332-20DMB
Cypress Semiconductor 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

28

Obsolete

CYPRESS SEMICONDUCTOR CORP

DIP

0.300 INCH, CERDIP-28

37 MHz

12

125 °C

-55 °C

CERAMIC, GLASS-SEALED

DIP

DIP28,.3

RECTANGULAR

IN-LINE

5.5 V

4.5 V

5 V

e0

3A001.A.2.C

锡铅

12 I/O MACROCELLS; 2 EXTERNAL CLOCKS; VARIABLE PRODUCT TERMS; SHARED INPUT/CLOCK

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

not_compliant

28

R-GDIP-T28

12

不合格

MILITARY

25 ns

PAL-TYPE

25

10 DEDICATED INPUTS, 12 I/O

5.08 mm

OT PLD

38535Q/M;38534H;883B

MACROCELL

10

192

37.0205 mm

7.62 mm

XCR3128XL-6CSG144I
XCR3128XL-6CSG144I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

144

Obsolete

ADVANCED MICRO DEVICES INC

CHIP SCALE, BGA-144

167 MHz

3

104

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA144,13X13,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

3.6 V

2.7 V

3.3 V

e1

锡银铜

BOTTOM

BALL

260

0.8 mm

compliant

30

S-PBGA-B144

不合格

INDUSTRIAL

6 ns

104 I/O

1.2 mm

EE PLD

MACROCELL

12 mm

12 mm

XCR3128XL-6CSG144I
XCR3128XL-6CSG144I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

144

Transferred

XILINX INC

BGA

CHIP SCALE, BGA-144

167 MHz

3

104

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA144,13X13,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

3.6 V

2.7 V

3.3 V

e1

锡银铜

8542.39.00.01

BOTTOM

BALL

260

0.8 mm

compliant

30

144

S-PBGA-B144

不合格

INDUSTRIAL

6 ns

104 I/O

1.2 mm

EE PLD

MACROCELL

12 mm

12 mm

MACH211SP-10JI
MACH211SP-10JI
Lattice Semiconductor Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

Obsolete

LATTICE SEMICONDUCTOR CORP

LCC

QCCJ, LDCC44,.7SQ

80 MHz

3

64

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

5.5 V

4.5 V

5 V

e0

锡铅

YES

8542.39.00.01

QUAD

J BEND

225

1.27 mm

unknown

30

44

S-PQCC-J44

不合格

INDUSTRIAL

10 ns

2 DEDICATED INPUTS, 64 I/O

4.57 mm

EE PLD

MACROCELL

64

NO

2

YES

16.5862 mm

16.5862 mm

EPS464LC44-20
EPS464LC44-20
Altera Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

XH95180-7PQG160C
XH95180-7PQG160C
AMD 数据表

722 In Stock

-

最小起订量: 1

最小包装量: 1

YES

160

PLASTIC/EPOXY

QFP

QFP160,1.2SQ

SQUARE

FLATPACK

5 V

Obsolete

ADVANCED MICRO DEVICES INC

PLASTIC, QFP-160

3

133

e3

哑光锡

QUAD

鸥翼

245

0.65 mm

compliant

30

S-PQFP-G160

不合格

0 DEDICATED INPUTS, 133 I/O

3.94 mm

MASK PLD

MACROCELL

28 mm

28 mm

PZ5032-6BC
PZ5032-6BC
Philips Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

TQFP44,.47SQ,32

SQUARE

FLATPACK

5 V

Transferred

飞利浦半导体

QFP, TQFP44,.47SQ,32

70 °C

PLASTIC/EPOXY

QFP

e0

Tin/Lead (Sn/Pb)

NO

8542.39.00.01

QUAD

鸥翼

0.8 mm

unknown

S-PQFP-G44

不合格

COMMERCIAL

8 ns

EE PLD

32

NO

NO

PAL16P8ACJ
PAL16P8ACJ
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

20

DIP20,.3

RECTANGULAR

IN-LINE

5 V

Obsolete

ADVANCED MICRO DEVICES INC

DIP, DIP20,.3

70 °C

CERAMIC

DIP

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-XDIP-T20

8

不合格

COMMERCIAL

25 ns

PAL-TYPE

16

OT PLD

COMBINATORIAL

64

XC73108-20WB225C
XC73108-20WB225C
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

225

Obsolete

XILINX INC

BGA

WBGA, BGA225,15X15

35.7 MHz

1

78

70 °C

CERAMIC, METAL-SEALED COFIRED

WBGA

BGA225,15X15

SQUARE

GRID ARRAY, WINDOW

5.25 V

4.75 V

5 V

108 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 198 FLIP-FLOPS

8542.39.00.01

BOTTOM

BALL

1.5 mm

unknown

225

S-CBGA-B225

不合格

COMMERCIAL

45 ns

12 DEDICATED INPUTS, 78 I/O

UV PLD

MACROCELL

108

NO

12

NO

XCR3384XL-7.5CS280C
XCR3384XL-7.5CS280C
AMD Xilinx 数据表

727 In Stock

-

最小起订量: 1

最小包装量: 1

YES

280

XILINX INC

BGA

CHIP SCALE, BGA-280

3

216

70 °C

PLASTIC/EPOXY

TFBGA

BGA280,19X19,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

3.6 V

3 V

3.3 V

Transferred

e0

3A991.D

锡铅

8542.39.00.01

BOTTOM

BALL

0.8 mm

compliant

280

S-PBGA-B280

不合格

COMMERCIAL

7.5 ns

216 I/O

1.2 mm

EE PLD

MACROCELL

16 mm

16 mm

PZ5064C10BC
PZ5064C10BC
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

80 MHz

3

32

70 °C

PLASTIC/EPOXY

QFP

TQFP44,.47SQ,32

SQUARE

FLATPACK

5.5 V

4.5 V

5 V

活跃

ADVANCED MICRO DEVICES INC

e0

锡铅

YES

QUAD

鸥翼

240

0.8 mm

not_compliant

30

S-PQFP-G44

32

不合格

COMMERCIAL

12.5 ns

PAL/PLA-TYPE

36

2 DEDICATED INPUTS, 32 I/O

EE PLD

64

YES

2

YES

10 mm

10 mm

PZ5064C10BC
PZ5064C10BC
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

77 MHz

32

70 °C

PLASTIC/EPOXY

TQFP

SQUARE

FLATPACK, THIN PROFILE

5.25 V

4.75 V

5 V

Obsolete

NXP SEMICONDUCTORS

QFP

TQFP,

64 MACROCELLS

8542.39.00.01

QUAD

鸥翼

0.8 mm

unknown

44

S-PQFP-G44

不合格

COMMERCIAL

12.5 ns

2 DEDICATED INPUTS, 32 I/O

1.2 mm

EE PLD

MACROCELL

2

10 mm

10 mm

PZ5064C10BC
PZ5064C10BC
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

Transferred

3

32

5 V

4.5 V

5.5 V

FLATPACK

SQUARE

TQFP44,.47SQ,32

QFP

PLASTIC/EPOXY

70 °C

XILINX INC

80 MHz

e0

锡铅

YES

8542.39.00.01

QUAD

鸥翼

240

0.8 mm

not_compliant

30

S-PQFP-G44

32

不合格

COMMERCIAL

12.5 ns

PAL/PLA-TYPE

36

2 DEDICATED INPUTS, 32 I/O

EE PLD

64

YES

2

YES

10 mm

10 mm

PLS105-40PC
PLS105-40PC
AMD 数据表

143 In Stock

-

最小起订量: 1

最小包装量: 1

NO

28

DIP

DIP, DIP28,.6

25 MHz

75 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

5.25 V

4.75 V

5 V

Obsolete

ADVANCED MICRO DEVICES INC

e0

锡铅

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

28

R-PDIP-T28

8

不合格

商业扩展

15 ns

PLS-TYPE

16

16 DEDICATED INPUTS, 0 I/O

OT PLD

REGISTERED

16

48

XCR3128A-15VQ100I
XCR3128A-15VQ100I
AMD Xilinx 数据表

709 In Stock

-

最小起订量: 1

最小包装量: 1

YES

100

Obsolete

XILINX INC

QFP

PLASTIC, VQFP-100

77 MHz

3

80

85 °C

-40 °C

PLASTIC/EPOXY

TFQFP

TQFP100,.63SQ

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

3.6 V

2.7 V

3.3 V

e0

锡铅

YES

8542.39.00.01

QUAD

鸥翼

240

0.5 mm

not_compliant

30

100

S-PQFP-G100

不合格

INDUSTRIAL

15 ns

2 DEDICATED INPUTS, 80 I/O

1.2 mm

EE PLD

MACROCELL

128

YES

2

YES

14 mm

14 mm

AMPAL16L8JC
AMPAL16L8JC
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

20

QLCC

QCCJ, LDCC20,.4SQ

6

75 °C

PLASTIC/EPOXY

QCCJ

LDCC20,.4SQ

SQUARE

CHIP CARRIER

5.25 V

4.75 V

5 V

Obsolete

ADVANCED MICRO DEVICES INC

e0

锡铅

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

20

S-PQCC-J20

8

不合格

商业扩展

35 ns

PAL-TYPE

16

10 DEDICATED INPUTS, 6 I/O

4.57 mm

OT PLD

COMBINATORIAL

10

64

8.9662 mm

8.9662 mm

PAL16R8BJC
PAL16R8BJC
National Semiconductor Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

20

40 MHz

75 °C

CERAMIC, GLASS-SEALED

DIP

DIP20,.3

RECTANGULAR

IN-LINE

5.25 V

4.75 V

5 V

Obsolete

NATIONAL SEMICONDUCTOR CORP

DIP, DIP20,.3

e0

锡铅

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

R-GDIP-T20

8

不合格

商业扩展

15 ns

PAL-TYPE

8

8 DEDICATED INPUTS, 0 I/O

5.08 mm

OT PLD

REGISTERED

8

64

24.51 mm

7.62 mm

PZ3064I15A44
PZ3064I15A44
Philips Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

3.3 V

Transferred

飞利浦半导体

QCCJ, LDCC44,.7SQ

85 °C

-40 °C

e0

Tin/Lead (Sn/Pb)

NO

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J44

不合格

INDUSTRIAL

17.5 ns

EE PLD

64

NO

NO

PZ3064I15A44
PZ3064I15A44
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

3.3 V

Obsolete

XILINX INC

3

85 °C

-40 °C

e0

锡铅

NO

8542.39.00.01

QUAD

J BEND

225

1.27 mm

not_compliant

30

S-PQCC-J44

不合格

INDUSTRIAL

17.5 ns

EE PLD

64

NO

NO

PZ3128-S15A84
PZ3128-S15A84
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

84

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

3.3 V

Obsolete

XILINX INC

3

70 °C

PLASTIC/EPOXY

QCCJ

e0

锡铅

YES

8542.39.00.01

QUAD

J BEND

225

1.27 mm

unknown

30

S-PQCC-J84

不合格

COMMERCIAL

17.5 ns

EE PLD

128

YES

YES

XC9536F-10VQG44I
XC9536F-10VQG44I
AMD Xilinx 数据表

436 In Stock

-

最小起订量: 1

最小包装量: 1

YES

44

Obsolete

XILINX INC

QFP

TQFP,

67 MHz

3

34

85 °C

-40 °C

PLASTIC/EPOXY

TQFP

SQUARE

FLATPACK, THIN PROFILE

5.5 V

4.5 V

5 V

e3

Matte Tin (Sn)

8542.39.00.01

QUAD

鸥翼

未说明

0.8 mm

compliant

未说明

44

S-PQFP-G44

不合格

INDUSTRIAL

10 ns

0 DEDICATED INPUTS, 34 I/O

1.2 mm

闪存 PLD

MACROCELL

10 mm

10 mm

PZ5064N10A44
PZ5064N10A44
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

XILINX INC

80 MHz

3

32

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

LDCC44,.7SQ

SQUARE

CHIP CARRIER

5.5 V

4.5 V

5 V

Transferred

e0

锡铅

YES

8542.39.00.01

QUAD

J BEND

225

1.27 mm

not_compliant

30

S-PQCC-J44

32

不合格

INDUSTRIAL

12.5 ns

PAL/PLA-TYPE

36

2 DEDICATED INPUTS, 32 I/O

EE PLD

64

YES

2

YES

16.585 mm

16.585 mm

PZ5064CS7BC
PZ5064CS7BC
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

TQFP

SQUARE

FLATPACK, THIN PROFILE

5.25 V

4.75 V

5 V

Obsolete

NXP SEMICONDUCTORS

105 MHz

32

70 °C

PLASTIC/EPOXY

64 MACROCELLS

8542.39.00.01

QUAD

鸥翼

0.8 mm

unknown

S-PQFP-G44

不合格

COMMERCIAL

9 ns

2 DEDICATED INPUTS, 32 I/O

1.2 mm

EE PLD

MACROCELL

2

10 mm

10 mm

PLUS20L8-7A
PLUS20L8-7A
Philips Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

28

Transferred

70 °C

PLASTIC/EPOXY

QCCJ

LDCC28,.5SQ

SQUARE

CHIP CARRIER

5 V

飞利浦半导体

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J28

8

不合格

COMMERCIAL

7.5 ns

PAL-TYPE

20

OT PLD

COMBINATORIAL

64