AMD Xilinx XC73108-20WB225C

表面安装

YES

终端数量

225

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

XILINX INC

Part Package Code

BGA

Package Description

WBGA, BGA225,15X15

Clock Frequency-Max

35.7 MHz

Moisture Sensitivity Levels

1

Number of I/O Lines

78

Operating Temperature-Max

70 °C

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Package Code

WBGA

Package Equivalence Code

BGA225,15X15

Package Shape

SQUARE

Package Style

GRID ARRAY, WINDOW

Supply Voltage-Max

5.25 V

Supply Voltage-Min

4.75 V

Supply Voltage-Nom

5 V

附加功能

108 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V; 3 EXTERNAL CLOCKS; 198 FLIP-FLOPS

HTS代码

8542.39.00.01

端子位置

BOTTOM

终端形式

BALL

端子间距

1.5 mm

Reach合规守则

unknown

引脚数量

225

JESD-30代码

S-CBGA-B225

资历状况

不合格

温度等级

COMMERCIAL

传播延迟

45 ns

组织结构

12 DEDICATED INPUTS, 78 I/O

可编程逻辑类型

UV PLD

输出功能

MACROCELL

宏细胞数

108

JTAG BST

NO

专用输入数量

12

系统内可编程

NO