类别是'category.内存模块' (5401)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 包装/外壳 | 表面安装 | 终端数量 | 包装 | JESD-609代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 内存大小 | 操作模式 | 电源电流-最大值 | 访问时间 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入周期时间 - 最大值 | 写入保护 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 通用闪存接口 | 长度 | 宽度 | |||||||||||||||||||||||||||||
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![]() | THGAFBG9T23BAB8 | KIOXIA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 活跃 | KIOXIA HOLDINGS CORP | PACKAGE | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY27C256-200JI | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | Obsolete | CYPRESS SEMICONDUCTOR CORP | QFJ | QCCJ, | 200 ns | 32768 words | 32000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | RECTANGULAR | CHIP CARRIER | 5 V | EAR99 | 8542.32.00.71 | QUAD | J BEND | 1 | unknown | 32 | R-PQCC-J32 | 不合格 | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 32KX8 | 3-STATE | 8 | 262144 bit | PARALLEL | OTP ROM | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S25FL032P0XMFA001 | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | CYPRESS SEMICONDUCTOR CORP | SOP-16 | 104 MHz | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 3 V | Transferred | EAR99 | NOR型号 | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 1.27 mm | compliant | R-PDSO-G16 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 4MX8 | 3-STATE | 2.65 mm | 8 | 33554432 bit | AEC-Q100 | SERIAL | FLASH | 3 V | 10.3 mm | 7.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | MX25UM51345GXDI00/TRAY | Macronix International Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S29GL064M90TFIR1 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete | ADVANCED MICRO DEVICES INC | EAR99 | 8542.32.00.51 | unknown | FLASH | 3 V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S29GL064M90TFIR1 | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3.3 V | 有 | Transferred | CYPRESS SEMICONDUCTOR CORP | TSOP-56 | 90 ns | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | e3 | EAR99 | NOR型号 | 哑光锡 | IT ALSO OPERATES AT 2.7 TO 3.6 V SUPPLY FULL VOLTAGE RANGE | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.5 mm | compliant | 40 | R-PDSO-G56 | 不合格 | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 4MX16 | 1.2 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 128 | 64K | 4/8 words | YES | YES | 18.4 mm | 14 mm | ||||||||||||||||||||||||||||
![]() | S29GL064M90TFIR1 | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3.3 V | 有 | Obsolete | INFINEON TECHNOLOGIES AG | TSOP-56 | 90 ns | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | e3 | NOR型号 | 哑光锡 | IT ALSO OPERATES AT 2.7 TO 3.6 V SUPPLY FULL VOLTAGE RANGE | DUAL | 鸥翼 | 260 | 1 | 0.5 mm | compliant | 40 | R-PDSO-G56 | 不合格 | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 4MX16 | 1.2 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 128 | 64K | 4/8 words | YES | BOTTOM/TOP | YES | 18.4 mm | 14 mm | |||||||||||||||||||||||||||||
![]() | TH58BVG3S0HBAI6 | KIOXIA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 67 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 3.3 V | 有 | 活跃 | KIOXIA HOLDINGS CORP | VFBGA, | 25 ns | 1073741824 words | 1000000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | BGA67,8X10,32 | RECTANGULAR | EAR99 | NAND类型 | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | unknown | R-PBGA-B67 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 1GX8 | 3-STATE | 1 mm | 8 | 0.0001 A | 8589934592 bit | SERIAL | FLASH | 3.3 V | 0.000025 ms | HARDWARE | 8 mm | 6.5 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | 25CS640T-E/Q4B | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | UDFN-8 | 1.8 V | 5.5 V | SMD/SMT | 200 Year | - 40 C | + 125 C | 3 mA | 5000 | 符合RoHS标准 | SPI | 20 MHz | Reel | 64 kbit | 80 ns | 8 k x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MSM27C802CZ-NGS-K | OKI Electric Industry Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | OKI ELECTRIC INDUSTRY CO LTD | SOIC | SOP, | 80 ns | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 5 V | Obsolete | EAR99 | 8542.32.00.71 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | 44 | R-PDSO-G44 | 不合格 | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 1MX8 | 3.1 mm | 8 | 8388608 bit | PARALLEL | OTP ROM | 16 | 28.15 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | M27C4001-12N1 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | 512000 | 524288 words | 有 | Obsolete | STMICROELECTRONICS | TSOP | 8 X 20 MM, LEAD FREE, PLASTIC, TSOP-32 | 100 ns | 5 V | SMALL OUTLINE, THIN PROFILE | RECTANGULAR | TSSOP32,.8,20 | TSOP1 | PLASTIC/EPOXY | 70 °C | e3 | EAR99 | TIN | 8542.32.00.71 | DUAL | 鸥翼 | 1 | 0.5 mm | compliant | 32 | R-PDSO-G32 | 不合格 | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.03 mA | 512KX8 | 3-STATE | 1.2 mm | 8 | 0.0001 A | 4194304 bit | PARALLEL | COMMON | OTP ROM | 18.4 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||
![]() | S29GL256N10FFIV20 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | GRID ARRAY, LOW PROFILE | RECTANGULAR | BGA64,8X8,40 | LBGA | PLASTIC/EPOXY | -40 °C | 有 | Obsolete | SPANSION INC | BGA | 13 X 11 MM, 1MM PITCH, LEAD FREE, FBGA-64 | 100 ns | 3 | 16777216 words | 16000000 | 85 °C | 3 V | e1 | EAR99 | NOR型号 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 40 | 64 | R-PBGA-B64 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.07 mA | 16MX16 | 3-STATE | 1.4 mm | 16 | 0.000005 A | 268435456 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 256 | 128K | 8/16 words | YES | YES | 13 mm | 11 mm | ||||||||||||||||||||||||||
![]() | S29GL256N10FFIV20 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | SQUARE | BGA64,8X8,40 | BGA | PLASTIC/EPOXY | -40 °C | 85 °C | 16000000 | 16777216 words | 100 ns | ADVANCED MICRO DEVICES INC | Transferred | 有 | 网格排列 | EAR99 | NOR型号 | 8542.32.00.51 | BOTTOM | BALL | 1 | 1 mm | unknown | S-PBGA-B64 | 不合格 | INDUSTRIAL | ASYNCHRONOUS | 0.07 mA | 16MX16 | 3-STATE | 16 | 0.000005 A | 268435456 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 256 | 128K | 8/16 words | YES | YES | |||||||||||||||||||||||||||||||||||||||||
![]() | TN87C64 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | CHIP CARRIER | 5 V | 无 | Obsolete | INTEL CORP | QCCJ, LDCC32,.5X.6 | 250 ns | 8192 words | 8000 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | QUAD | J BEND | 1 | 1.27 mm | unknown | R-PQCC-J32 | 不合格 | INDUSTRIAL | ASYNCHRONOUS | 0.02 mA | 8KX8 | 3-STATE | 8 | 65536 bit | PARALLEL | COMMON | OTP ROM | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | 82S185A/BVA | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 18 | 无 | Transferred | 飞利浦半导体 | DIP, DIP18,.3 | 55 ns | 2048 words | 2000 | 125 °C | -55 °C | CERAMIC | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T18 | 不合格 | MILITARY | 0.16 mA | 2KX4 | 4 | 8192 bit | 38535Q/M;38534H;883B | OTP ROM | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 82S185A/BVA | Teledyne e2v | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete | TELEDYNE E2V (UK) LTD | , | EAR99 | 8542.32.00.71 | compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TMM2464AF | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | 无 | 活跃 | TOSHIBA CORP | SOP, SOP28,.5 | 200 ns | 8192 words | 8000 | 70 °C | PLASTIC/EPOXY | SOP | SOP28,.5 | RECTANGULAR | 小概要 | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | 鸥翼 | 1.27 mm | unknown | R-PDSO-G28 | 不合格 | COMMERCIAL | 8KX8 | 3-STATE | 8 | 65536 bit | COMMON | 12.5 V | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | NX25P40VNI | Conexant Systems Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MX25L4005ZMC-15G | Macronix International Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 3.3 V | 有 | Obsolete | MACRONIX INTERNATIONAL CO LTD | QFN | HVSON, SOLCC8,.25 | 70 MHz | 3 | 524288 words | 512000 | 70 °C | UNSPECIFIED | HVSON | e3 | EAR99 | NOR型号 | 哑光锡 | 8542.32.00.51 | DUAL | 无铅 | 1 | 1.27 mm | unknown | 8 | R-XDSO-N8 | 不合格 | 3.6 V | COMMERCIAL | 2.7 V | SYNCHRONOUS | 0.015 mA | 512KX8 | 3-STATE | 1 mm | 8 | 0.00001 A | 4194304 bit | SERIAL | FLASH | 2.7 V | SPI | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 6 mm | 5 mm | |||||||||||||||||||||||||||||||||||
![]() | N25Q064A13EF640 | Micron Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 8000000 | PLASTIC/EPOXY | SON | RECTANGULAR | 小概要 | 3 V | Obsolete | MICRON TECHNOLOGY INC | VFDFPN-8 | 108 MHz | 8388608 words | EAR99 | NOR型号 | 8542.32.00.51 | DUAL | 无铅 | 1 | unknown | R-PDSO-N8 | 3.6 V | 2.7 V | SYNCHRONOUS | 8MX8 | 3-STATE | 8 | 67108864 bit | SERIAL | FLASH | 2.7 V | QSPI | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AM29LV320ML101REI | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3.3 V | 无 | Obsolete | SPANSION INC | TSOP1 | MO-142EC, TSOP-56 | 100 ns | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | e0 | EAR99 | NOR型号 | 锡铅 | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.5 mm | not_compliant | 56 | R-PDSO-G56 | 不合格 | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.08 mA | 2MX16 | 1.2 mm | 16 | 0.000005 A | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 64 | 64K | 4/8 words | YES | BOTTOM/TOP | YES | 18.4 mm | 14 mm | |||||||||||||||||||||||||||
![]() | AM29LV320ML101REI | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 3.3 V | 无 | Transferred | ADVANCED MICRO DEVICES INC | TSOP1 | MO-142EC, TSOP-56 | 100 ns | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | e0 | EAR99 | NOR型号 | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 0.5 mm | unknown | 56 | R-PDSO-G56 | 不合格 | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.08 mA | 2MX16 | 1.2 mm | 16 | 0.000005 A | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 64 | 64K | 4/8 words | YES | BOTTOM/TOP | YES | 18.4 mm | 14 mm | |||||||||||||||||||||||||||||
![]() | S29GL128N11FFIS43 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | KLMAG1JETD-B041009 | Samsung Electronics Co. Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MX25L6473EM2R-12G | Macronix International Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | RECTANGULAR | 小概要 | 3 V | 活跃 | MACRONIX INTERNATIONAL CO LTD | SOP, | 8388608 words | 8000000 | PLASTIC/EPOXY | SOP | EAR99 | ALSO ORGANISED AS 64M X1 | 8542.32.00.51 | DUAL | 鸥翼 | 未说明 | 1 | 1.27 mm | unknown | 未说明 | R-PDSO-G8 | 3.6 V | 2.7 V | SYNCHRONOUS | 8MX8 | 2.16 mm | 8 | 67108864 bit | SERIAL | FLASH | 3 V | 2 | 5.28 mm | 5.23 mm |
THGAFBG9T23BAB8
KIOXIA
分类:Memory - Modules
CY27C256-200JI
Cypress Semiconductor
分类:Memory - Modules
S25FL032P0XMFA001
Cypress Semiconductor
分类:Memory - Modules
MX25UM51345GXDI00/TRAY
Macronix International Co Ltd
分类:Memory - Modules
S29GL064M90TFIR1
AMD
分类:Memory - Modules
S29GL064M90TFIR1
Cypress Semiconductor
分类:Memory - Modules
S29GL064M90TFIR1
Infineon Technologies AG
分类:Memory - Modules
TH58BVG3S0HBAI6
KIOXIA
分类:Memory - Modules
25CS640T-E/Q4B
Microchip Technology
分类:Memory - Modules
MSM27C802CZ-NGS-K
OKI Electric Industry Co Ltd
分类:Memory - Modules
M27C4001-12N1
STMicroelectronics
分类:Memory - Modules
S29GL256N10FFIV20
Spansion
分类:Memory - Modules
S29GL256N10FFIV20
AMD
分类:Memory - Modules
TN87C64
Intel Corporation
分类:Memory - Modules
82S185A/BVA
Philips Semiconductors
分类:Memory - Modules
82S185A/BVA
Teledyne e2v
分类:Memory - Modules
TMM2464AF
Toshiba America Electronic Components
分类:Memory - Modules
NX25P40VNI
Conexant Systems Inc
分类:Memory - Modules
MX25L4005ZMC-15G
Macronix International Co Ltd
分类:Memory - Modules
N25Q064A13EF640
Micron Technology Inc
分类:Memory - Modules
AM29LV320ML101REI
Spansion
分类:Memory - Modules
AM29LV320ML101REI
AMD
分类:Memory - Modules
S29GL128N11FFIS43
Spansion
分类:Memory - Modules
KLMAG1JETD-B041009
Samsung Electronics Co. Ltd
分类:Memory - Modules
MX25L6473EM2R-12G
Macronix International Co Ltd
分类:Memory - Modules
