category.内存卡和模块_category.内存卡和模块品牌厂家，型号_价格_规格

类别是'category.专用模块' (1062)

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	Contact plating	表面安装	Number of pins	终端数量			Connector pinout layout	Contacts pitch	Date Of Intro	Electrical mounting	Gross weight		Kind of connector															Row pitch	Spatial orientation		Type of connector	Operating temperature	JESD-609代码	无铅代码	ECCN 代码	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	功能数量	端子间距	Reach合规守则	Current rating	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	资历状况	电源电压-最大值(Vsup)	温度等级	电源电压-最小值(Vsup)	端口的数量	操作模式	电源电流-最大值	组织结构	输出特性	座位高度-最大	内存宽度	待机电流-最大值	记忆密度	并行/串行	内存IC类型	Rated voltage	输出启用	个人资料	混合内存类型
KMDP6001DA-B425	Samsung Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	gold-plated	YES	9	254	1x9	2.54mm	THT	0.77 g	female	SAMSUNG SEMICONDUCTOR INC		FBGA-254	68719476736 words	64000000000	PLASTIC/EPOXY	RECTANGULAR	socket		straight	Obsolete	pin strips	-40...163°C					DRAM IS ORGANISED AS 32G X 1		BOTTOM	BALL		1		compliant	1.5A			R-PBGA-B254								64GX8			8		549755813888 bit		存储器电路	60V		beryllium copper	FLASH+DRAM			0.75µm	UL94V-0
MR2A16AVYS35	NXP Semiconductors	数据表	N/A	-	最小起订量: 1 最小包装量: 1	tinned	YES	6	44	2x3	1.27mm	2018-08-17	THT	0.41 g	female	256000	105 °C	-40 °C	PLASTIC/EPOXY	TSOP2	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	3.3 V	socket	Obsolete	NXP SEMICONDUCTORS	TSOP2-44	1.27mm	straight	262144 words	pin strips	-40...163°C			EAR99			8542.32.00.71	DUAL	鸥翼		1	0.8 mm	unknown	1.5A			R-PDSO-G44		3.6 V	INDUSTRIAL	3 V		ASYNCHRONOUS		256KX16		1.2 mm	16		4194304 bit		存储器电路	125V		bronze		18.41 mm	10.16 mm	4µm	UL94V-0
S71PL129JC0BFW9U0	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	64	Obsolete						SPANSION INC		BGA	8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-64	3	8388608 words	8000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	3 V					有			e1		EAR99	锡银铜	PSEUDO STATIC RAM IS ORGANIZED AS 4M X 16	8542.32.00.71	BOTTOM	BALL	260	1	0.8 mm	unknown		40	64	R-PBGA-B64	不合格	3.1 V	OTHER	2.7 V		ASYNCHRONOUS		8MX16		1.2 mm	16		134217728 bit		存储器电路					11.6 mm	8 mm
S71NS256PB0ZJETV3	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	56						SPANSION INC		BGA	TFBGA,	16777216 words	16000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	1.8 V			有			Obsolete					EAR99		PSRAM IS ORGANIZED AS 2M X 16	8542.32.00.71	BOTTOM	BALL	260	1	0.5 mm	unknown		40	56	R-PBGA-B56	不合格	1.95 V	OTHER	1.7 V		SYNCHRONOUS		16MX16		1.2 mm	16		268435456 bit		存储器电路					9.2 mm	8 mm
MC-242453F9-B10-BT3	NEC Electronics Group	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	77				BGA		TFBGA,	2097152 words	2000000	70 °C	-20 °C	PLASTIC/EPOXY	TFBGA	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH			Obsolete	NEC ELECTRONICS CORP									EAR99		THE DEVICE ALSO CONTAINS A 1M X 16 MOBILE SPECIFIED RAM	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	unknown			77	R-PBGA-B77	不合格	3 V	COMMERCIAL	2.6 V		ASYNCHRONOUS		2MX16		1.2 mm	16		33554432 bit		存储器电路					12 mm	7 mm
SST34HF3282-70-4E-L1P	Silicon Storage Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	56						SILICON STORAGE TECHNOLOGY INC		BGA	LFBGA,	2097152 words	2000000	85 °C	-20 °C	PLASTIC/EPOXY	LFBGA	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	3 V			无			Obsolete					EAR99		ALSO CONTAINS 512K X 16 SRAM	8542.32.00.71	BOTTOM	BALL	未说明	1	0.8 mm	unknown		未说明	56	R-PBGA-B56	不合格	3.3 V	OTHER	2.7 V		ASYNCHRONOUS		2MX16		1.4 mm	16		33554432 bit		存储器电路					10 mm	8 mm
M4-4104S-Z2	Moujen Switch	数据表	N/A	-	最小起订量: 1 最小包装量: 1
S71GL064AB0BFW0Z0	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	56	Obsolete						SPANSION INC		BGA	TFBGA,	3	4194304 words	4000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	3 V					有			e1		EAR99	锡银铜	PSRAM IS ORGANIZED AS 512K X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant			56	R-PBGA-B56	不合格	3.1 V	商业扩展	2.7 V		ASYNCHRONOUS		4MX16		1.2 mm	16		67108864 bit		存储器电路					9 mm	7 mm
XC17S30XLPDG8I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	8	Obsolete						XILINX INC		DIP	DIP,	3.3 V	IN-LINE	RECTANGULAR	DIP	PLASTIC/EPOXY	-40 °C	85 °C	249168	249168 words	1					有			e3	有	EAR99	Matte Tin (Sn)		8542.32.00.71	DUAL	THROUGH-HOLE	250	1	2.54 mm	compliant		30	8	R-PDIP-T8	不合格	3.6 V	INDUSTRIAL	3 V		SYNCHRONOUS		249168X1		4.5974 mm	1		249168 bit		存储器电路					9.3599 mm	7.62 mm
M4-4114S-Z3	Moujen Switch	数据表	N/A	-	最小起订量: 1 最小包装量: 1
NAND99W3M1BZBC5E	Micron Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	137				MICRON TECHNOLOGY INC		FBGA, BGA137,10X15,32	85 °C	-30 °C	PLASTIC/EPOXY	FBGA	BGA137,10X15,32	RECTANGULAR	GRID ARRAY, FINE PITCH	3 V			有	Obsolete									EAR99			8542.32.00.71	BOTTOM	BALL			0.8 mm	compliant				R-PBGA-B137	不合格		OTHER												存储器电路				FLASH+SDRAM
SST34WA1601-70-5E-MVJE	Microchip Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	44						MICROCHIP TECHNOLOGY INC		BGA	6 X 8 MM, 0.92 MM HEIGHT, 0.30 MM BALL, ROHS COMPLIANT, MO-225, VFBGA-44	1048576 words	1000000	85 °C	-20 °C	PLASTIC/EPOXY	VFBGA	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	1.8 V			有			活跃				有	EAR99		ZERO DENSITY PSRAM	8542.32.00.71	BOTTOM	BALL	260	1	0.5 mm	compliant		40	44	R-PBGA-B44	不合格	1.95 V	OTHER	1.7 V		SYNCHRONOUS		1MX16		1 mm	16		16777216 bit		存储器电路					8 mm	6 mm
S71PL127JB0BAWQB0	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	64					BGA		TFBGA,	8388608 words	8000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	3 V			Obsolete	SPANSION INC								EAR99		PSRAM IS ORGANIZED AS 2M X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	unknown			64	R-PBGA-B64	不合格	3.6 V	OTHER	2.7 V		ASYNCHRONOUS		8MX16		1.2 mm	16		134217728 bit		存储器电路					11.6 mm	8 mm
NAND98R3M2AZBB5E	Numonyx Memory Solutions	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	107					NUMONYX		BGA	FBGA, BGA107,10X14,32	85 °C	-30 °C	PLASTIC/EPOXY	FBGA	BGA107,10X14,32	RECTANGULAR	网格排列	1.8 V			有	Obsolete							有	EAR99			8542.32.00.71	BOTTOM	BALL	未说明		0.8 mm	unknown		未说明	107	R-PBGA-B107	不合格		OTHER												存储器电路				FLASH+SDRAM
PF38F5070M0Y0V0	Numonyx Memory Solutions	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	165			NUMONYX		FBGA, BGA165,12X15,25	96 ns	PLASTIC/EPOXY	FBGA	BGA165,12X15,25	RECTANGULAR	GRID ARRAY, FINE PITCH	1.8 V			有	Transferred										EAR99			8542.32.00.71	BOTTOM	BALL			0.635 mm	unknown				R-PBGA-B165	不合格											0.00016 A			存储器电路				FLASH+PSRAM
TH50VSF3580AASB	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1
TH50VSF3580AASB	Toshiba America Electronic Components	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	69	TOSHIBA CORP						BGA		LFBGA, BGA69,10X12,32	90 ns	2097152 words	2000000	85 °C	-30 °C	PLASTIC/EPOXY	LFBGA	BGA69,10X12,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	3 V					Transferred			e0		EAR99	锡铅	USER CONFIGURABLE AS 4M X 8 FLASH AND CONTAINS SRAM CONFIGURED AS 512K X 16 OR 1M X 8	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	unknown			69	R-PBGA-B69	不合格	3.3 V	OTHER	2.67 V		ASYNCHRONOUS	0.05 mA	2MX16		1.4 mm	16		33554432 bit		存储器电路				FLASH+SRAM	12 mm	9 mm
TC528126AJ-12	Toshiba America Electronic Components	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	40						TOSHIBA CORP		SOJ, SOJ40,.44	120 ns	131072 words	128000	70 °C	PLASTIC/EPOXY	SOJ	SOJ40,.44	RECTANGULAR	小概要	5 V			无			Transferred			e0		EAR99	Tin/Lead (Sn/Pb)		8542.32.00.71	DUAL	J BEND			1.27 mm	unknown				R-PDSO-J40	不合格		COMMERCIAL				0.045 mA	128KX8			8	0.01 A	1048576 bit		视频DRAM
NAND98W3M1AZBC5E	Numonyx Memory Solutions	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	137					NUMONYX		BGA	FBGA, BGA137,10X15,32	85 °C	-30 °C	PLASTIC/EPOXY	FBGA	BGA137,10X15,32	RECTANGULAR	网格排列	3 V			有	Obsolete							有	EAR99			8542.32.00.71	BOTTOM	BALL	未说明		0.8 mm	unknown		未说明	137	R-PBGA-B137	不合格		OTHER												存储器电路				FLASH+SDRAM
PF28F1602C3TD70	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	66	有	Obsolete						INTEL CORP		BGA	LFBGA, BGA66,8X12,32	70 ns	1048576 words	1000000	85 °C	-25 °C	PLASTIC/EPOXY	LFBGA	BGA66,8X12,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	3 V									EAR99		SRAM IS ORGANIZED AS 256K X 16	8542.32.00.71	BOTTOM	BALL	未说明	1	0.8 mm	compliant		未说明	66	R-PBGA-B66	不合格	3.3 V	商业扩展	2.7 V		ASYNCHRONOUS	0.05 mA	1MX16		1.4 mm	16	0.000005 A	16777216 bit		存储器电路				FLASH+SRAM	10 mm	8 mm
TMS44C251-12SD	Texas Instruments	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	28						120 ns		262144 words	256000	70 °C	PLASTIC/EPOXY	ZIP	ZIP28,.1	RECTANGULAR	IN-LINE	5 V	Obsolete	无			TEXAS INSTRUMENTS INC			ZIP, ZIP28,.1					EAR99			8542.32.00.71	ZIG-ZAG	THROUGH-HOLE	未说明		1.27 mm	not_compliant		未说明		R-PZIP-T28	不合格		COMMERCIAL				0.095 mA	256KX4			4	0.005 A	1048576 bit		存储器电路
TC51832AFL-70	Toshiba America Electronic Components	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	28					RECTANGULAR		SOP	PLASTIC/EPOXY	70 °C	32000	32768 words	70 ns	SOIC	TOSHIBA CORP	Obsolete	无			5 V	小概要						e0			锡铅			DUAL	鸥翼	240	1	1.27 mm	unknown		未说明	28	R-PDSO-G28	不合格	5.5 V	COMMERCIAL	4.5 V		ASYNCHRONOUS		32KX8		2.7 mm	8		262144 bit	PARALLEL	PSEUDO STATIC RAM					18.5 mm	8.8 mm
M5M27C128K-2	Mitsubishi Electric	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	28					MITSUBISHI ELECTRIC CORP		DIP,	200 ns	16384 words	16000	70 °C	PLASTIC/EPOXY	DIP	RECTANGULAR	IN-LINE	5 V			无	Obsolete						e0	无	EAR99	锡铅		8542.32.00.71	DUAL	THROUGH-HOLE		1		unknown				R-PDIP-T28		5.25 V	COMMERCIAL	4.75 V		ASYNCHRONOUS		16KX8			8		131072 bit	PARALLEL
TC518128AFWL-80	Toshiba America Electronic Components	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	32					TOSHIBA CORP		SOIC	80 ns	131072 words	128000	70 °C	PLASTIC/EPOXY	SOP	RECTANGULAR	小概要	5 V			无	Obsolete						e0			锡铅	CE/AUTO/SELF REFRESH		DUAL	鸥翼	240	1	1.27 mm	unknown		未说明	32	R-PDSO-G32	不合格	5.5 V	COMMERCIAL	4.5 V	1	ASYNCHRONOUS		128KX8	3-STATE	2.8 mm	8		1048576 bit	PARALLEL	PSEUDO STATIC RAM		YES			20.6 mm	10.7 mm
PF38F1030W0YBQF	Numonyx Memory Solutions	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	88			NUMONYX		FBGA, BGA88,8X12,32	85 °C	-25 °C	PLASTIC/EPOXY	FBGA	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, FINE PITCH			有	Transferred										EAR99			8542.32.00.71	BOTTOM	BALL			0.8 mm	unknown				R-PBGA-B88	不合格		OTHER				0.055 mA					0.000005 A			存储器电路				FLASH+PSRAM