Micron Technology Inc NAND99W3M1BZBC5E

表面安装

YES

终端数量

137

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MICRON TECHNOLOGY INC

Package Description

FBGA, BGA137,10X15,32

Operating Temperature-Max

85 °C

Operating Temperature-Min

-30 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA137,10X15,32

Package Shape

RECTANGULAR

Package Style

GRID ARRAY, FINE PITCH

Supply Voltage-Nom (Vsup)

3 V

ECCN 代码

EAR99

HTS代码

8542.32.00.71

端子位置

BOTTOM

终端形式

BALL

端子间距

0.8 mm

Reach合规守则

compliant

JESD-30代码

R-PBGA-B137

资历状况

不合格

温度等级

OTHER

内存IC类型

存储器电路

混合内存类型

FLASH+SDRAM