类别是'category.专用模块' (1062)

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品牌

数据表

库存

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Rohs

表面安装

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Date Of Intro

包装

系列

JESD-609代码

无铅代码

零件状态

ECCN 代码

类型

端子表面处理

附加功能

HTS代码

端子位置

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峰值回流焊温度(摄氏度)

功能数量

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

资历状况

电源电压-最大值(Vsup)

温度等级

电源电压-最小值(Vsup)

操作模式

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耐力

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待机电压-最小值

混合内存类型

长度

宽度

FM24VN02-GTR
FM24VN02-GTR
Ramtron International Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

8

SOIC

SOP, SOP8,.25

3.4 MHz

32768 words

32000

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP8,.25

RECTANGULAR

小概要

3.3 V

Obsolete

RAMTRON INTERNATIONAL CORP

EAR99

8542.32.00.71

DUAL

鸥翼

1

1.27 mm

unknown

8

R-PDSO-G8

不合格

3.6 V

2 V

SYNCHRONOUS

0.0001 mA

32KX8

1.75 mm

8

0.00015 A

262144 bit

SERIAL

FRAM

I2C

100000000000000 Write/Erase Cycles

10

HARDWARE

2 V

4.9 mm

3.9 mm

S72NS256PD0AJBLG3
S72NS256PD0AJBLG3
Spansion 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

133

SPANSION INC

BGA

8 X 8 MM, 0.50 MM PITCH, LEAD FREE, FBGA-133

3

16777216 words

16000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.8 V

Obsolete

e2

EAR99

TIN SILVER COPPER NICKEL

DRAM IS ORGANISED AS 16M X 16; SYNCHRONOUS BURST MODE ALSO POSSIBLE

8542.32.00.71

BOTTOM

BALL

260

1

0.5 mm

unknown

40

133

S-PBGA-B133

不合格

1.95 V

OTHER

1.7 V

ASYNCHRONOUS

16MX16

1.1 mm

16

268435456 bit

存储器电路

8 mm

8 mm

PF38F5060M0Y0B0
PF38F5060M0Y0B0
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

105

INTEL CORP

BGA

TFBGA, BGA105,9X12,32

3

33554432 words

32000000

85 °C

-30 °C

PLASTIC/EPOXY

TFBGA

BGA105,9X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

1.8 V

Transferred

e1

EAR99

锡银铜

PSEUDO SRAM IS ORGANIZED AS 8M X 16

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

compliant

105

R-PBGA-B105

不合格

2 V

OTHER

1.7 V

SYNCHRONOUS

32MX16

1.2 mm

16

0.00012 A

536870912 bit

存储器电路

FLASH+PSRAM

11 mm

9 mm

TH50VSF2580AASB
TH50VSF2580AASB
Toshiba America Electronic Components 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

69

TOSHIBA CORP

BGA

LFBGA, BGA69,10X12,32

90 ns

2097152 words

2000000

85 °C

-40 °C

PLASTIC/EPOXY

LFBGA

BGA69,10X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

3 V

Transferred

e0

EAR99

锡铅

USER CONFIGURABLE AS 4M X 8 FLASH AND CONTAINS SRAM CONFIGURED AS 256 X 16 OR 512K X 8

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

unknown

69

R-PBGA-B69

不合格

3.6 V

INDUSTRIAL

2.7 V

ASYNCHRONOUS

0.05 mA

2MX16

1.4 mm

16

33554432 bit

存储器电路

FLASH+SRAM

12 mm

9 mm

RD28F3208C3T70
RD28F3208C3T70
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

66

INTEL CORP

BGA

LFBGA, BGA68,8X12,32

70 ns

2097152 words

2000000

85 °C

-25 °C

PLASTIC/EPOXY

LFBGA

BGA68,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

3 V

Obsolete

EAR99

SRAM IS ORGANIZED AS 512K X 16

8542.32.00.71

BOTTOM

BALL

240

1

0.8 mm

compliant

30

66

R-PBGA-B66

不合格

3.3 V

商业扩展

2.7 V

ASYNCHRONOUS

0.055 mA

2MX16

1.4 mm

16

0.000006 A

33554432 bit

存储器电路

FLASH+SRAM

10 mm

8 mm

S71GL128NB0BFW9Z0
S71GL128NB0BFW9Z0
Spansion 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

64

SPANSION INC

BGA

8 X 11.60 MM, 1.20 MM HIEGHT, LEAD FREE, FBGA-64

3

8388608 words

8000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

3 V

Obsolete

e1

3A991.B.1.A

锡银铜

PSRAM IS ORGANIZED AS 2M X 16

8542.32.00.71

BOTTOM

BALL

260

1

0.8 mm

unknown

40

64

R-PBGA-B64

不合格

3.1 V

OTHER

2.7 V

ASYNCHRONOUS

8MX16

1.2 mm

16

134217728 bit

存储器电路

11.6 mm

8 mm

LRS1806K
LRS1806K
Sharp Microelectronics of the Americas 数据表

N/A

-

最小起订量: 1

最小包装量: 1

R8A66120FFA
R8A66120FFA
Renesas Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

48

LFQFP, QFP48,.35SQ,20

6 ns

2097152 words

2000000

70 °C

PLASTIC/EPOXY

LFQFP

QFP48,.35SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

3.3 V

Obsolete

RENESAS ELECTRONICS CORP

QFP

EAR99

8542.32.00.71

QUAD

鸥翼

1

0.5 mm

unknown

48

S-PQFP-G48

不合格

3.6 V

COMMERCIAL

3 V

SYNCHRONOUS

0.15 mA

2MX4

1.7 mm

4

8388608 bit

存储器电路

7 mm

7 mm

SSDSCKJR150G7XA
SSDSCKJR150G7XA
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2018-07-27

活跃

INTEL CORP

PACKAGE

161061273600 words

150000000000

70 °C

UNSPECIFIED

RECTANGULAR

EAR99

8542.32.00.71

1

compliant

COMMERCIAL

ASYNCHRONOUS

150GX8

8

1288490188800 bit

存储器电路

M4-4112-Z3
M4-4112-Z3
Moujen Switch 数据表

N/A

-

最小起订量: 1

最小包装量: 1

M4-4112RS-Z2
M4-4112RS-Z2
Moujen Switch 数据表

N/A

-

最小起订量: 1

最小包装量: 1

S71VS256RD0AHKBL0
S71VS256RD0AHKBL0
Cypress Semiconductor 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

56

FBGA

BGA56,10X14,20

RECTANGULAR

GRID ARRAY, FINE PITCH

1.8 V

Transferred

CYPRESS SEMICONDUCTOR CORP

85 °C

-25 °C

PLASTIC/EPOXY

EAR99

8542.32.00.71

BOTTOM

BALL

0.5 mm

compliant

R-PBGA-B56

不合格

OTHER

存储器电路

FLASH+PSRAM

SST32HF3281-70-4E-LSE
SST32HF3281-70-4E-LSE
Greenliant Systems Ltd 数据表

N/A

-

最小起订量: 1

最小包装量: 1

GREENLIANT SYSTEMS LTD

,

Obsolete

EAR99

8542.32.00.71

compliant

S71GL256NB0BAWAZ3
S71GL256NB0BAWAZ3
Spansion 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

84

BGA

TFBGA,

16777216 words

16000000

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

3 V

Obsolete

SPANSION INC

e0

EAR99

锡铅

PSRAM IS ORGANIZED AS 2M X 16

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

compliant

84

R-PBGA-B84

不合格

3.1 V

OTHER

2.7 V

ASYNCHRONOUS

16MX16

1.2 mm

16

268435456 bit

存储器电路

11.6 mm

8 mm

M4-4112S-Z3
M4-4112S-Z3
Moujen Switch 数据表

N/A

-

最小起订量: 1

最小包装量: 1

XC17S150XLPDG8I
XC17S150XLPDG8I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

8

XILINX INC

DIP

DIP,

1

1040128 words

1040128

85 °C

-40 °C

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

3.3 V

Obsolete

e3

EAR99

Matte Tin (Sn)

8542.32.00.71

DUAL

THROUGH-HOLE

250

1

2.54 mm

compliant

30

8

R-PDIP-T8

不合格

3.6 V

INDUSTRIAL

3 V

SYNCHRONOUS

1040128X1

4.5974 mm

1

1040128 bit

存储器电路

9.3599 mm

7.62 mm

AL4V2M8221-A-20-PY28
AL4V2M8221-A-20-PY28
Averlogic Technologies 数据表

N/A

-

最小起订量: 1

最小包装量: 1

接触制造商

AVERLOGIC TECHNOLOGIES CORP

,

EAR99

8542.32.00.71

unknown

UPD42S16800G5-60-7JD
UPD42S16800G5-60-7JD
Renesas Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

RENESAS ELECTRONICS CORP

TSOP

60 ns

70 °C

5 V

Obsolete

EAR99

8542.32.00.71

compliant

28

5.5 V

4.5 V

快速页面 DRAM

MC-242453F9-B10-BT3
MC-242453F9-B10-BT3
Renesas Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

77

PLASTIC/EPOXY

FBGA

BGA77,8X14,32

RECTANGULAR

GRID ARRAY, FINE PITCH

Obsolete

RENESAS ELECTRONICS CORP

FBGA, BGA77,8X14,32

100 ns

70 °C

-20 °C

EAR99

8542.32.00.71

BOTTOM

BALL

0.8 mm

unknown

R-PBGA-B77

不合格

COMMERCIAL

0.045 mA

0.00001 A

存储器电路

FLASH+SRAM

SST34HF324G-70-4E-L3KE
SST34HF324G-70-4E-L3KE
Silicon Storage Technology 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

48

2097152 words

2000000

85 °C

-20 °C

PLASTIC/EPOXY

LFBGA

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

3 V

Obsolete

SILICON STORAGE TECHNOLOGY INC

BGA

LFBGA,

EAR99

SRAM IS ORGANISED AS 256K X 16

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

unknown

48

R-PBGA-B48

不合格

3.3 V

OTHER

2.7 V

ASYNCHRONOUS

2MX16

1.4 mm

16

33554432 bit

存储器电路

8 mm

6 mm

SST34HF324G-70-4E-L3KE
SST34HF324G-70-4E-L3KE
Greenliant Systems Ltd 数据表

N/A

-

最小起订量: 1

最小包装量: 1

GREENLIANT SYSTEMS LTD

,

Obsolete

EAR99

8542.32.00.71

compliant

PTN3500
PTN3500
Philips Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

S71NS256PB0ZJETV2
S71NS256PB0ZJETV2
Spansion 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Transferred

SPANSION INC

,

EAR99

8542.32.00.71

260

unknown

40

S71PL129JC0BFW9U0
S71PL129JC0BFW9U0
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

64

85 °C

-25 °C

PLASTIC/EPOXY

FBGA

BGA64,10X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

活跃

ADVANCED MICRO DEVICES INC

FBGA, BGA64,10X12,32

70 ns

EAR99

8542.32.00.71

BOTTOM

BALL

0.8 mm

compliant

R-PBGA-B64

不合格

OTHER

0.07 mA

0.000005 A

存储器电路

FLASH+PSRAM

DXM1200-X2
DXM1200-X2
Banner Engineering Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Box

DXM1200

活跃

无线控制器