N/A

-

N/A

-

YES

1156

100 °C

-40 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

0.9 V

有

活跃

ADVANCED MICRO DEVICES INC

FCBGA-1156

4

e1

锡银铜

BOTTOM

BALL

245

1 mm

compliant

30

S-PBGA-B1156

INDUSTRIAL

PROGRAMMABLE SoC

3.51 mm

35 mm

35 mm

N/A

-

N/A

-

N/A

-

NO

16

70 °C

PLASTIC/EPOXY

DIP

DIP16,.3

RECTANGULAR

IN-LINE

5.25 V

4.25 V

5 V

无

Obsolete

TEXAS INSTRUMENTS INC

DIP, DIP16,.3

EAR99

8542.39.00.01

DUAL

THROUGH-HOLE

未说明

2.54 mm

not_compliant

未说明

R-PDIP-T16

不合格

COMMERCIAL

CLOCK GENERATOR, PROCESSOR SPECIFIC

115 mA

27 MHz

27 MHz

N/A

-

YES

484

ADVANCED MICRO DEVICES INC

BGA-484

4

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

有

活跃

e1

锡银铜

BOTTOM

BALL

250

0.8 mm

compliant

30

S-PBGA-B484

INDUSTRIAL

PROGRAMMABLE SoC

2.61 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

19 mm

19 mm

N/A

-

NO

132

PGA

PGA132,13X13

SQUARE

网格排列

5 V

无

Obsolete

MOTOROLA SEMICONDUCTOR PRODUCTS

PGA, PGA132,13X13

70 °C

CERAMIC

e0

Tin/Lead (Sn/Pb)

8542.31.00.01

PERPENDICULAR

PIN/PEG

2.54 mm

unknown

S-XPGA-P132

不合格

COMMERCIAL

64 mA

N/A

-

N/A

-

N/A

-

YES

1760

110 °C

PLASTIC/EPOXY

BGA

BGA1760,42X42,40

SQUARE

网格排列

0.85 V

有

活跃

ADVANCED MICRO DEVICES INC

FCBGA-1760

4

e1

锡银铜

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1760

OTHER

PROGRAMMABLE SoC

3.71 mm

CAN, I2C, SPI, UART

42.5 mm

42.5 mm

N/A

-

YES

100

TFQFP,

70 °C

PLASTIC/EPOXY

TFQFP

SQUARE

FLATPACK, THIN PROFILE, FINE PITCH

3.465 V

3.165 V

3.3 V

有

Transferred

SILICON STORAGE TECHNOLOGY INC

QFP

e3

Matte Tin (Sn)

ALSO REQUIRES 5V SUPPLY

8542.31.00.01

QUAD

鸥翼

260

0.5 mm

unknown

40

100

S-PQFP-G100

不合格

COMMERCIAL

SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE

1.2 mm

16

ATA; IDE

14 mm

14 mm

N/A

-

NO

28

康讯系统

DIP

PLASTIC, DIP-28

2 MHz

70 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

5.25 V

4.75 V

5 V

无

Obsolete

e0

锡铅

8542.31.00.01

DUAL

THROUGH-HOLE

2.54 mm

compliant

28

R-PDIP-T28

不合格

COMMERCIAL

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

6.1 mm

2

NO

NO

8

0

1

65C00; 6500

0.00234375 MBps

ASYNC, BIT

NRZ

36.83 mm

15.24 mm

N/A

-

YES

208

70 °C

PLASTIC/EPOXY

SQUARE

FLATPACK

5.25 V

4.75 V

5 V

Obsolete

BROOKTREE CORP

QFP

,

33 MHz

8542.31.00.01

QUAD

鸥翼

unknown

208

S-PQFP-G208

不合格

COMMERCIAL

DISPLAY CONTROLLER, CRT GRAPHICS DISPLAY

30

32

PCI; VESA; VL; I2C

N/A

-

YES

68

40

70 °C

CERAMIC, METAL-SEALED COFIRED

QCCJ

SQUARE

CHIP CARRIER, WINDOW

5.5 V

4.5 V

5 V

Obsolete

WAFERSCALE INTEGRATION INC

CERAMIC, LDCC-68

20.41 MHz

QUAD

J BEND

unknown

S-CQCC-J68

不合格

COMMERCIAL

5

PARALLEL IO PORT, GENERAL PURPOSE

4.57 mm

16

24.13 mm

24.13 mm

N/A

-

YES

304

31 X 31 MM, LOW PROFILE, THERMALLY ENHANCED, SBGA-304

70 °C

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

2.625 V

2.375 V

2.5 V

无

Obsolete

INTEGRATED DEVICE TECHNOLOGY INC

BGA

e0

锡铅

8542.31.00.01

BOTTOM

BALL

1.27 mm

not_compliant

304

S-PBGA-B304

不合格

COMMERCIAL

微处理器电路

1.7 mm

31 mm

31 mm

N/A

-

NO

28

CERAMIC, METAL-SEALED COFIRED

DIP

RECTANGULAR

IN-LINE

5.25 V

4.75 V

5 V

无

活跃

HOLT INTEGRATED CIRCUITS INC

DIP

DIP,

e0

无

Tin/Lead (Sn/Pb)

DUAL

THROUGH-HOLE

245

2.54 mm

compliant

30

28

R-CDIP-T28

不合格

SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

5.08 mm

NO

NO

8

0

1

SYNC, BYTE

NRZ

35.56 mm

15.24 mm

N/A

-

YES

484

100 °C

PLASTIC/EPOXY

FBGA

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

有

Transferred

XILINX INC

FBGA, BGA484,22X22,32

8542.31.00.01

BOTTOM

BALL

0.8 mm

unknown

S-PBGA-B484

OTHER

PROGRAMMABLE SoC

2.61 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

19 mm

19 mm

N/A

-

N/A

-

N/A

-

YES

784

XILINX INC

FBGA, BGA78428X28,32

4

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA78428X28,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

有

Transferred

锡银铜

8542.31.00.01

BOTTOM

BALL

250

0.8 mm

unknown

30

S-PBGA-B784

INDUSTRIAL

PROGRAMMABLE SoC

3.32 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

23 mm

23 mm

N/A

-

YES

128

25 MHz

70 °C

PLASTIC/EPOXY

FQFP

RECTANGULAR

FLATPACK, FINE PITCH

1.89 V

1.71 V

1.8 V

活跃

REALTEK SEMICONDUCTOR CORP

QFP

FQFP,

ALSO REQUIRES 3.3 V AND 2 .1 V TYP SUPPLY

8542.31.00.01

QUAD

鸥翼

0.5 mm

unknown

128

R-PQFP-G128

COMMERCIAL

BUS CONTROLLER, PCI

3.4 mm

12.5 MBps

IEEE 802.3; IEEE 802.3A; IEEE

20 mm

14 mm

N/A

-

N/A

-

YES

625

ADVANCED MICRO DEVICES INC

BGA-625

4

100 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

0.876 V

0.825 V

0.85 V

有

活跃

e1

锡银铜

BOTTOM

BALL

250

0.8 mm

compliant

30

S-PBGA-B625

INDUSTRIAL

PROGRAMMABLE SoC

3.43 mm

I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)

21 mm

21 mm

N/A

-

YES

1760

100 °C

-40 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

0.9 V

有

活跃

ADVANCED MICRO DEVICES INC

FCBGA-1760

4

e1

锡银铜

BOTTOM

BALL

245

1 mm

compliant

30

S-PBGA-B1760

INDUSTRIAL

PROGRAMMABLE SoC

3.71 mm

42.5 mm

42.5 mm

N/A

-

YES

1760

2017-02-15

-40 °C

PLASTIC/EPOXY

BGA

SQUARE

网格排列

0.9 V

有

Transferred

XILINX INC

BGA,

4

100 °C

e1

锡银铜

8542.31.00.01

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1760

INDUSTRIAL

PROGRAMMABLE SoC

3.71 mm

42.5 mm

42.5 mm