类别是'category.电信接口IC' (8324)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 操作模式 | 电源电流-最大值 | 数据率 | 座位高度-最大 | 筛选水平 | 通信IC类型 | 收发器数量 | 过滤器 | 压缩法 | 饱和电流 | 负电源电压 | 标准 | 增益公差-最大 | 线性编码 | ISDN接入速率 | 参考点 | 输出高电压-最小 | 输出低电压-最大值 | 长度 | 宽度 | |||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | NCH-RSL15-512-101WC40-ABG | onsemi | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BCM89103YC0BFBG | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 88Q2112-A0-NYD2A000 | Marvell Technology Group Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | NCF2950FTT/L0E1300 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TJA1029TK | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 12 V | 有 | 活跃 | NXP SEMICONDUCTORS | HVSON, | PLASTIC/EPOXY | HVSON | EAR99 | 8542.39.00.01 | DUAL | 无铅 | 未说明 | 1 | 0.65 mm | compliant | 未说明 | S-PDSO-N8 | 1 mm | AEC-Q100 | 电路接口 | 1 | 3 mm | 3 mm | |||||||||||||||||||||||||||||
![]() | MAS7838N | Micro Analog Systems Oy | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 5 V | Obsolete | MICRO ANALOG SYSTEMS OY | DIP, DIP16,.3 | 70 °C | PLASTIC/EPOXY | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T16 | 不合格 | COMMERCIAL | 6 mA | |||||||||||||||||||||||||||||||||||
![]() | SKY66111-11-R | Skyworks Solutions Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | UNSPECIFIED | HVQCCN | RECTANGULAR | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3 V | 活跃 | SKYWORKS SOLUTIONS INC | MCM-20 | 85 °C | -40 °C | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.25 mm | unknown | R-XQCC-N20 | INDUSTRIAL | 0.9 mm | 电信电路 | 3.3 mm | 3 mm | ||||||||||||||||||||||||||||||||
![]() | UJA1169ATK | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | HVSON | SOLCC20,.14,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 13 V | 有 | 活跃 | NXP SEMICONDUCTORS | HVSON-20 | PLASTIC/EPOXY | DUAL | 无铅 | 1 | 0.5 mm | compliant | R-PDSO-N20 | 67 mA | 15000 Mbps | 1 mm | AEC-Q100 | CAN FD TRANSCEIVER | 1 | 5.5 mm | 3.5 mm | ||||||||||||||||||||||||||||||
![]() | TCM29C16ADWR | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | 70 °C | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | 小概要 | 5 V | 无 | Obsolete | TEXAS INSTRUMENTS INC | SOP, SOP16,.4 | 无 | FULL DUPLEX | 8542.39.00.01 | DUAL | 鸥翼 | 未说明 | 1 | 1.27 mm | not_compliant | 未说明 | R-PDSO-G16 | 不合格 | COMMERCIAL | SYNCHRONOUS/ASYNCHRONOUS | 9 mA | 2.65 mm | PCM 编解码器 | YES | MU-LAW | -5 V | 0.08 dB | 不提供 | 10.3 mm | 7.5 mm | |||||||||||||||||||
![]() | STEL-2000A 45/CR | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 70 °C | PLASTIC/EPOXY | QFP | QFP100,.7X.9 | RECTANGULAR | FLATPACK | 5 V | 无 | 活跃 | INTEL CORP | QFP, QFP100,.7X.9 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 0.635 mm | compliant | R-PQFP-G100 | 不合格 | COMMERCIAL | 380 mA | ||||||||||||||||||||||||||||||||
![]() | RCV336DPFL/SP | Conexant Systems Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 70 °C | PLASTIC/EPOXY | QFP | QFP100,.7X.9 | RECTANGULAR | FLATPACK | 5 V | 无 | Transferred | 康讯系统 | QFP, QFP100,.7X.9 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 0.635 mm | compliant | R-PQFP-G100 | 不合格 | COMMERCIAL | 136 mA | MODEM | |||||||||||||||||||||||||||||||
![]() | RFFM6403SR | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | HLGA, LCC28,.24SQ,28 | 85 °C | -40 °C | UNSPECIFIED | HLGA | LCC28,.24SQ,28 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 3.6 V | 有 | Transferred | RF MICRO DEVICES INC | 5A991.G | 8517.62.00.50 | BOTTOM | BUTT | 未说明 | 1 | 0.7 mm | compliant | 未说明 | S-XBGA-B28 | 不合格 | INDUSTRIAL | 1.05 mm | 电信电路 | 6 mm | 6 mm | ||||||||||||||||||||||||||
![]() | S20-A140X | TDK Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 2 | UNSPECIFIED | RECTANGULAR | 特殊形状 | 有 | 活跃 | TDK CORP | , | 90 °C | -40 °C | DUAL | UNSPECIFIED | 未说明 | 1 | unknown | 未说明 | R-XDSS-X2 | INDUSTRIAL | GAS DISCHARGE TUBE SUPPRESSOR | ||||||||||||||||||||||||||||||||||||
![]() | TEA1068T | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | 75 °C | -25 °C | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | 小概要 | Obsolete | NXP SEMICONDUCTORS | SOIC | SOP, SOP20,.4 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | compliant | 20 | R-PDSO-G20 | 不合格 | 商业扩展 | 0.0013 mA | 2.65 mm | 电话语音电路 | 12.8 mm | 7.5 mm | ||||||||||||||||||||||||||||
![]() | TEA1068T | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | 70 °C | -25 °C | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | 小概要 | 无 | Transferred | 飞利浦半导体 | SOP, SOP20,.4 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | 鸥翼 | 1.27 mm | unknown | R-PDSO-G20 | 不合格 | OTHER | 1.3 mA | ||||||||||||||||||||||||||||||||
![]() | RF1201 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 6 | QFN | HVQCCN, | 85 °C | -30 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 2.65 V | 有 | Transferred | RF MICRO DEVICES INC | 5A991.G | 8541.29.00.75 | QUAD | 无铅 | 1 | 0.65 mm | unknown | 6 | S-XQCC-N6 | 不合格 | OTHER | 0.9 mm | 射频和基带电路 | 2 mm | 2 mm | |||||||||||||||||||||||||||
![]() | SI4743-C10-AM | Silicon Laboratories Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 24 | 85 °C | 4 X 4 MM, 0.825 MM HEIGHT, ROHS COMPLIANT, MO-220VGGD-8, QFN-24 | SILICON LABORATORIES INC | Transferred | 3.3 V | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SQUARE | HVQCCN | UNSPECIFIED | -40 °C | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | unknown | S-XQCC-N24 | INDUSTRIAL | 0.9 mm | AEC-Q100 | 电信电路 | 4 mm | 4 mm | |||||||||||||||||||||||||||||||
![]() | ICS1893BK | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | DFN | 8 X 8 MM, PLASTIC, M0-220VLLD-5, MLF2-56 | MLF | 3 | 70 °C | PLASTIC/EPOXY | HVQCCN | LCC56,.31SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3.3 V | 无 | e0 | 无 | Tin/Lead (Sn85Pb15) | 8542.39.00.01 | QUAD | 无铅 | 240 | 1 | 0.5 mm | not_compliant | 30 | 56 | S-PQCC-N56 | 不合格 | COMMERCIAL | 0.16 mA | 100000 Mbps | 1 mm | 电路接口 | 1 | 8 mm | 8 mm | ||||||||||||||||||
![]() | SARA-U280-00S-01 | u-blox AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 96 | PACKAGE-96 | 4 | 55 °C | -20 °C | UNSPECIFIED | BCC | RECTANGULAR | CHIP CARRIER | 3.8 V | 有 | Obsolete | U-BLOX AG | ALSO HAVE EXTENDED OPERATING INPUT VOLTAGE FROM 3.10V TO 4.5V | 8542.39.00.01 | BOTTOM | BUTT | 1 | unknown | R-XBCC-B96 | COMMERCIAL | 3.25 mm | 电信电路 | 26 mm | 16 mm | ||||||||||||||||||||||||||||||
![]() | INT5200 | Qualcomm | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 接触制造商 | QUALCOMM INC | , | 8542.39.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TXC-05870AIBG | Transwitch Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 256 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 2.5 V | Obsolete | TRANSWITCH CORP | BGA | BGA, | 8542.39.00.01 | BOTTOM | BALL | 1 | 1.27 mm | unknown | 256 | S-PBGA-B256 | 不合格 | INDUSTRIAL | 电信电路 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||
![]() | TISP61060P | Bourns Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 8 | DIP, | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 无 | Obsolete | BOURNS INC | DIP | 8542.39.00.01 | DUAL | THROUGH-HOLE | 未说明 | 1 | 2.54 mm | compliant | 未说明 | 8 | R-PDIP-T8 | 不合格 | INDUSTRIAL | 5.08 mm | 浪涌保护电路 | 9.5 mm | 7.62 mm | |||||||||||||||||||||||||||
![]() | UPD72103LP | NEC Electronics Group | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MT8931BE | Zarlink Semiconductor Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 28 | DIP, DIP28,.6 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | ZARLINK SEMICONDUCTOR INC | e0 | 锡铅 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 260 | 1 | 2.54 mm | unknown | R-PDIP-T28 | 不合格 | INDUSTRIAL | 192 Mbps | 6.35 mm | 数码单反 | ANSI T1.605 | BASIC | S/T | 2.4 V | 0.4 V | 37.4 mm | 10.16 mm | ||||||||||||||||||||
![]() | PMB2200T | Siemens | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 |
NCH-RSL15-512-101WC40-ABG
onsemi
分类:Interface - Telecom
BCM89103YC0BFBG
Broadcom Limited
分类:Interface - Telecom
88Q2112-A0-NYD2A000
Marvell Technology Group Ltd
分类:Interface - Telecom
NCF2950FTT/L0E1300
NXP Semiconductors
分类:Interface - Telecom
TJA1029TK
NXP Semiconductors
分类:Interface - Telecom
MAS7838N
Micro Analog Systems Oy
分类:Interface - Telecom
SKY66111-11-R
Skyworks Solutions Inc
分类:Interface - Telecom
UJA1169ATK
NXP Semiconductors
分类:Interface - Telecom
TCM29C16ADWR
Texas Instruments
分类:Interface - Telecom
STEL-2000A 45/CR
Intel Corporation
分类:Interface - Telecom
RCV336DPFL/SP
Conexant Systems Inc
分类:Interface - Telecom
RFFM6403SR
RF Micro Devices Inc
分类:Interface - Telecom
S20-A140X
TDK Corporation
分类:Interface - Telecom
TEA1068T
NXP Semiconductors
分类:Interface - Telecom
TEA1068T
Philips Semiconductors
分类:Interface - Telecom
RF1201
RF Micro Devices Inc
分类:Interface - Telecom
SI4743-C10-AM
Silicon Laboratories Inc
分类:Interface - Telecom
ICS1893BK
Integrated Device Technology Inc
分类:Interface - Telecom
SARA-U280-00S-01
u-blox AG
分类:Interface - Telecom
INT5200
Qualcomm
分类:Interface - Telecom
TXC-05870AIBG
Transwitch Corporation
分类:Interface - Telecom
TISP61060P
Bourns Inc
分类:Interface - Telecom
UPD72103LP
NEC Electronics Group
分类:Interface - Telecom
MT8931BE
Zarlink Semiconductor Inc
分类:Interface - Telecom
PMB2200T
Siemens
分类:Interface - Telecom
