类别是'category.电信接口IC' (8324)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | 端子表面处理 | 应用 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 电源电流-最大值 | 数据率 | 座位高度-最大 | 通信IC类型 | 输出低电流-最大值 | 过滤器 | 压缩法 | 负电源电压 | 标准 | 增益公差-最大 | 线性编码 | ISDN接入速率 | 参考点 | 输出高电压-最小 | 输出低电压-最大值 | 突破比率 | 长度 | 宽度 | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | AW-CU300 V3 | AzureWave Technologies | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PEF2035N | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PEF2035N | Siemens | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | WM8595GEFL/RS | Cirrus Logic | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TP53190N | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 20 | NATIONAL SEMICONDUCTOR CORP | DIP, DIP20,.3 | 70 °C | -30 °C | PLASTIC/EPOXY | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | 3 V | 无 | Obsolete | e0 | 锡铅 | SELECTABLE MAKE/BREAK RATIO 1:1.5;1:1.6;1:2 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T20 | 不合格 | OTHER | 0.3 mA | 5.08 mm | 电话拨号电路 | 1:1 | 26.075 mm | 7.62 mm | |||||||||||||||||||||
![]() | TP53190N | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 20 | NATIONAL SEMICONDUCTOR CORP | DIP, DIP20,.3 | 70 °C | -30 °C | PLASTIC/EPOXY | 3 V | IN-LINE | RECTANGULAR | DIP20,.3 | DIP | 无 | Obsolete | e0 | 锡铅 | SELECTABLE MAKE/BREAK RATIO 1:1.5;1:1.6;1:2 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T20 | 不合格 | OTHER | 0.3 mA | 5.08 mm | 电话拨号电路 | 1:1 | 26.075 mm | 7.62 mm | |||||||||||||||||||||
![]() | RF2423 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | Obsolete | RF MICRO DEVICES INC | SOIC | SOP, SOP16,.25 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP16,.25 | RECTANGULAR | 小概要 | 5 V | 无 | e0 | 锡铅 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | 16 | R-PDSO-G16 | 不合格 | INDUSTRIAL | 1.905 mm | 射频和基带电路 | 9.9 mm | 3.9 mm | ||||||||||||||||||||||
![]() | PSB2197TV1.1 | Siemens | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | Transferred | 西门子 A G | 70 °C | PLASTIC/EPOXY | RECTANGULAR | 小概要 | 5 V | 8542.39.00.01 | DUAL | 鸥翼 | 1 | unknown | R-PDSO-G28 | 不合格 | COMMERCIAL | 15 mA | isdn控制器 | ||||||||||||||||||||||||||||||||||
![]() | M51-A900X | TDK Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 2 | ROUND | 特殊形状 | 活跃 | TDK CORP | PACKAGE-2 | 90 °C | -40 °C | UNSPECIFIED | DUAL | WIRE | 1 | unknown | O-XDSS-W2 | INDUSTRIAL | GAS DISCHARGE TUBE SUPPRESSOR | ||||||||||||||||||||||||||||||||||||
![]() | TH7122 | Melexis Microelectronic Integrated Systems | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | LQFP, | 85 °C | -40 °C | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | 3 V | Obsolete | MELEXIS N V | QFP | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.8 mm | compliant | 32 | S-PQFP-G32 | 不合格 | INDUSTRIAL | 1.6 mm | 电信电路 | 7 mm | 7 mm | ||||||||||||||||||||||||||
![]() | MM74HC943J | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 20 | NATIONAL SEMICONDUCTOR CORP | DIP, DIP20,.3 | 85 °C | -40 °C | CERAMIC, GLASS-SEALED | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | e0 | 锡铅 | FULL DUPLEX | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-GDIP-T20 | 不合格 | INDUSTRIAL | 5.08 mm | MODEM | 24.51 mm | 7.62 mm | |||||||||||||||||||||||
![]() | PX1011B-EL1 | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | T5744-TKS | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | MICROCHIP TECHNOLOGY INC | SSO-20 | 105 °C | -40 °C | PLASTIC/EPOXY | LSSOP | SSOP20,.25 | RECTANGULAR | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | 5 V | 无 | Obsolete | e0 | 锡铅 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 0.65 mm | unknown | R-PDSO-G20 | 不合格 | INDUSTRIAL | 0.0087 mA | 1.45 mm | 电信电路 | 6.625 mm | 4.4 mm | |||||||||||||||||||||||
![]() | M21215-13P | Mindspeed Technologies Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TM266HCA | Pulse Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | PULSE ELECTRONICS CORP | SOP, SOP16,.4 | 125 °C | -55 °C | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | 小概要 | 5 V | 无 | 活跃 | 8542.39.00.01 | DUAL | 鸥翼 | 1.27 mm | compliant | R-PDSO-G16 | 不合格 | MILITARY | ATM/SONET/SDH TRANSCEIVER | ||||||||||||||||||||||||||||||
![]() | TM266HCB2 | Pulse Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | PULSE ELECTRONICS CORP | SOP, SOP16,.4 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | 小概要 | 3.3 V | 无 | 活跃 | 8542.39.00.01 | DUAL | 鸥翼 | 1.27 mm | compliant | R-PDSO-G16 | 不合格 | INDUSTRIAL | ATM/SONET/SDH TRANSCEIVER | ||||||||||||||||||||||||||||||
![]() | PEB2084 | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | PLASTIC/EPOXY | QFP | QFP44,.5SQ,32 | SQUARE | FLATPACK | 5 V | 无 | Obsolete | INFINEON TECHNOLOGIES AG | 70 °C | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 0.8 mm | not_compliant | S-PQFP-G44 | 不合格 | COMMERCIAL | 192 Mbps | 0.007 A | ANSI T1.605 | BASIC | S/T | 2.4 V | 0.45 V | ||||||||||||||||||||||||
![]() | MSM6999RS | LAPIS Semiconductor Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 5 V | Obsolete | LAPIS SEMICONDUCTOR CO LTD | DIP, DIP16,.3 | 70 °C | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T16 | 不合格 | COMMERCIAL | 14 mA | PCM 编解码器 | YES | MU-LAW | -5 V | 0.8 dB | 不提供 | |||||||||||||||||||||||||
![]() | PEB4264 | Lantiq | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | SOIC | SOP, | 70 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 5 V | 无 | Transferred | LANTIQ | e0 | 无 | 锡铅 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | 20 | R-PDSO-G20 | 不合格 | COMMERCIAL | 3.7 mm | SLIC | 15.9 mm | 11 mm | |||||||||||||||||||||||
![]() | PEB4264 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | PLASTIC/EPOXY | 70 °C | SOP, | INTEL CORP | 接触制造商 | 无 | 5 V | 小概要 | RECTANGULAR | SOP | e0 | 锡铅 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | compliant | R-PDSO-G20 | 不合格 | COMMERCIAL | 3.7 mm | SLIC | 15.9 mm | 11 mm | ||||||||||||||||||||||||||
![]() | RFFM6403 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | Transferred | RF MICRO DEVICES INC | HLGA, LCC28,.24SQ,28 | 3 | 85 °C | -40 °C | UNSPECIFIED | HLGA | LCC28,.24SQ,28 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | 3.6 V | 有 | 8542.39.00.01 | BOTTOM | BUTT | 1 | 0.7 mm | unknown | S-XBGA-B28 | 不合格 | INDUSTRIAL | 1.5 mA | 1.05 mm | 电信电路 | 6 mm | 6 mm | ||||||||||||||||||||||||
![]() | PMB2240 | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | 85 °C | -30 °C | PLASTIC/EPOXY | TFQFP | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | INFINEON TECHNOLOGIES AG | QFP | TFQFP, | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.5 mm | unknown | 48 | S-PQFP-G48 | 不合格 | OTHER | 1.1 mm | 射频和基带电路 | 7 mm | 7 mm | |||||||||||||||||||||||||||
![]() | PMB2240 | Siemens | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | -30 °C | PLASTIC/EPOXY | SQUARE | FLATPACK | Transferred | 西门子 A G | QFP | , | 85 °C | 8542.39.00.01 | QUAD | 鸥翼 | 1 | unknown | 48 | S-PQFP-G48 | 不合格 | OTHER | 射频和基带电路 | ||||||||||||||||||||||||||||||||
![]() | SY88823VKG | Micrel Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 10 | Transferred | MICREL INC | LEAD FREE, MSOP-10 | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | HTSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | 3.3 V | 有 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | SDH; SONET | DUAL | 鸥翼 | 260 | 1 | 0.5 mm | compliant | 40 | S-PDSO-G10 | 不合格 | INDUSTRIAL | 0.065 mA | 1.1 mm | ATM/SONET/SDH SUPPORT CIRCUIT | 3 mm | 3 mm | ||||||||||||||||||||
![]() | SY88823VKG | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 10 | MICROCHIP TECHNOLOGY INC | LEAD FREE, MSOP-10 | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | HTSSOP | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | 3.3 V | 有 | 活跃 | e4 | 镍钯金 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 0.5 mm | compliant | S-PDSO-G10 | 不合格 | INDUSTRIAL | 1.1 mm | ATM/SONET/SDH SUPPORT CIRCUIT | 3 mm | 3 mm |
AW-CU300 V3
AzureWave Technologies
分类:Interface - Telecom
PEF2035N
Infineon Technologies AG
分类:Interface - Telecom
PEF2035N
Siemens
分类:Interface - Telecom
WM8595GEFL/RS
Cirrus Logic
分类:Interface - Telecom
TP53190N
National Semiconductor Corporation
分类:Interface - Telecom
TP53190N
Texas Instruments
分类:Interface - Telecom
RF2423
RF Micro Devices Inc
分类:Interface - Telecom
PSB2197TV1.1
Siemens
分类:Interface - Telecom
M51-A900X
TDK Corporation
分类:Interface - Telecom
TH7122
Melexis Microelectronic Integrated Systems
分类:Interface - Telecom
MM74HC943J
National Semiconductor Corporation
分类:Interface - Telecom
PX1011B-EL1
NXP Semiconductors
分类:Interface - Telecom
T5744-TKS
Microchip Technology Inc
分类:Interface - Telecom
M21215-13P
Mindspeed Technologies Inc
分类:Interface - Telecom
TM266HCA
Pulse Electronics Corporation
分类:Interface - Telecom
TM266HCB2
Pulse Electronics Corporation
分类:Interface - Telecom
PEB2084
Infineon Technologies AG
分类:Interface - Telecom
MSM6999RS
LAPIS Semiconductor Co Ltd
分类:Interface - Telecom
PEB4264
Lantiq
分类:Interface - Telecom
PEB4264
Intel Corporation
分类:Interface - Telecom
RFFM6403
RF Micro Devices Inc
分类:Interface - Telecom
PMB2240
Infineon Technologies AG
分类:Interface - Telecom
PMB2240
Siemens
分类:Interface - Telecom
SY88823VKG
Micrel Inc
分类:Interface - Telecom
SY88823VKG
Microchip Technology Inc
分类:Interface - Telecom
