类别是'category.电信接口IC' (8324)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源 | 温度等级 | 电源电流-最大值 | 座位高度-最大 | 筛选水平 | 通信IC类型 | 负电源电压 | 运输载体类型 | 长度 | 宽度 | |||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | SC5272-M4 | Hangzhou Silan Microelectronics CO LTD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 18 | DIP, DIP18,.3 | 70 °C | -20 °C | PLASTIC/EPOXY | DIP | DIP18,.3 | RECTANGULAR | IN-LINE | 5 V | 有 | 接触制造商 | HANGZHOU SILAN MICROELECTRONICS CO LTD | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | R-PDIP-T18 | 不合格 | COMMERCIAL | 电信电路 | |||||||||||||||||||||
![]() | TP1321 | Teledyne Defense Electronics | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | TXC-05804AIOG-D | Transwitch Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | TCM1532BP | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | BCM5675 | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 600 | BGA | UNSPECIFIED | 网格排列 | 无 | Transferred | BROADCOM CORP | BGA | BGA, | PLASTIC/EPOXY | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | 600 | X-PBGA-B600 | 不合格 | 电信电路 | ||||||||||||||||||||||||
![]() | S2070B | Applied Micro Circuits Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | 70 °C | PLASTIC/EPOXY | QFP | QFP64,.66SQ,32 | SQUARE | FLATPACK | 3.3 V | Obsolete | APPLIED MICRO CIRCUITS CORP | QFP | QFP, QFP64,.66SQ,32 | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.8 mm | unknown | 64 | S-PQFP-G64 | 不合格 | COMMERCIAL | 235 mA | 2.35 mm | 以太网收发器 | 14 mm | 14 mm | ||||||||||||||||
![]() | ZL50402GDG | Conexant Systems Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | 1.8 V | GRID ARRAY, LOW PROFILE | SQUARE | LBGA | PLASTIC/EPOXY | -40 °C | 85 °C | Obsolete | 康讯系统 | BGA | LBGA, | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1 | 1 mm | compliant | 未说明 | 208 | S-PBGA-B208 | 不合格 | INDUSTRIAL | 1.4 mm | LAN 交换电路 | 17 mm | 17 mm | |||||||||||||||
![]() | ZL50402GDG | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | 1.8 V | LBGA, | BGA | ZARLINK SEMICONDUCTOR INC | Transferred | 无 | 85 °C | -40 °C | PLASTIC/EPOXY | e0 | 无 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 1 | 1 mm | compliant | 208 | S-PBGA-B208 | 不合格 | INDUSTRIAL | 1.4 mm | LAN 交换电路 | 17 mm | 17 mm | |||||||||||||
![]() | TM266FCA1 | Pulse Electronics Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | 活跃 | PULSE ELECTRONICS CORP | QFP | SSOP, SOP28,.76 | 1 | 125 °C | -55 °C | UNSPECIFIED | SSOP | SOP28,.76 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | 5 V | 无 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 0.65 mm | compliant | 28 | R-XDSO-G28 | 不合格 | MILITARY | 3.81 mm | 电信电路 | ||||||||||||||||
![]() | HM9110C | Hualon Microelectronics Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 接触制造商 | HUALON MICROELECTRONICS CORP | , | unknown | ||||||||||||||||||||||||||||||||||||||||
![]() | LXT360LE | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | Transferred | INTEL CORP | QFP | LQFP, QFP44,.47SQ,32 | T-1(DS1) | 85 °C | -40 °C | PLASTIC/EPOXY | LQFP | QFP44,.47SQ,32 | SQUARE | FLATPACK, LOW PROFILE | 5 V | 无 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.8 mm | unknown | 44 | S-PQFP-G44 | 不合格 | INDUSTRIAL | 1.6 mm | pcm收发器 | CEPT PCM-30/E-1 | 10 mm | 10 mm | |||||||||||
![]() | BCM3416 | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | PLASTIC/EPOXY | QFP | UNSPECIFIED | FLATPACK | 3.3 V | 无 | Obsolete | BROADCOM CORP | QFP | QFP, | 8542.39.00.01 | QUAD | 鸥翼 | 1 | compliant | 48 | X-PQFP-G48 | 不合格 | 电信电路 | |||||||||||||||||||||||
![]() | RS8235 | Mindspeed Technologies Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 208 | FQFP, | 85 °C | PLASTIC/EPOXY | FQFP | SQUARE | FLATPACK, FINE PITCH | 3.3 V | 无 | Obsolete | MINDSPEED TECHNOLOGIES INC | QFP | 无 | 8542.39.00.01 | QUAD | 鸥翼 | 未说明 | 1 | 0.5 mm | compliant | 未说明 | 208 | S-PQFP-G208 | 不合格 | OTHER | 4.1 mm | ATM/SONET/SDH SEGMENTATION AND REASSEMBLY DEVICE | 28 mm | 28 mm | ||||||||||||||
![]() | PT7A8952J | Pericom Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | PERICOM SEMICONDUCTOR CORP | QLCC | QCCJ, | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | RECTANGULAR | CHIP CARRIER | 5 V | 无 | Obsolete | e0 | 无 | EAR99 | 锡铅 | 8542.39.00.01 | QUAD | J BEND | 1 | 1.27 mm | compliant | 28 | R-PQCC-J28 | 不合格 | INDUSTRIAL | 3.86 mm | isdn控制器 | 11.53 mm | 11.53 mm | |||||||||||
![]() | BCM8011 | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 324 | SQUARE | 网格排列 | 1.8 V | 活跃 | BROADCOM LTD | BGA | BGA, | PLASTIC/EPOXY | BGA | 8542.39.00.01 | BOTTOM | BALL | 1 | compliant | 324 | S-PBGA-B324 | 不合格 | 以太网收发器 | ||||||||||||||||||||||||
![]() | AWT5008Q7 | Coherent Thermal Solutions | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 10 | PLASTIC/EPOXY | HVSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 3.4 V | 有 | Transferred | II-VI INC | 3 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, SMT-10 | 3 | 8542.39.00.01 | DUAL | 无铅 | 1 | 0.6 mm | unknown | S-PDSO-N10 | 1 mm | 电信电路 | 3 mm | 3 mm | |||||||||||||||||||||
![]() | LAN9311-NZW-TR | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 128 | HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, XVTQFP-128 | 3 | 70 °C | PLASTIC/EPOXY | TFQFP | TQFP128,.63SQ,16 | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | 3.3 V | 有 | 活跃 | MICROCHIP TECHNOLOGY INC | e3 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.4 mm | compliant | S-PQFP-G128 | 不合格 | COMMERCIAL | 295 mA | 1.2 mm | TS 16949 | ETHERNET SWITCH | 14 mm | 14 mm | ||||||||||||
![]() | PMB6270 | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete | INFINEON TECHNOLOGIES AG | , | unknown | ||||||||||||||||||||||||||||||||||||||||
![]() | TXC-04011-BIPQ | Transwitch Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 120 | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | SQUARE | FLATPACK | 5 V | Obsolete | TRANSWITCH CORP | QFP | QFP, | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.8 mm | unknown | 120 | S-PQFP-G120 | 不合格 | INDUSTRIAL | 175 mA | 4.1 mm | 电信电路 | 28 mm | 28 mm | ||||||||||||||||
![]() | OQ2541HPB-S | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | -40 °C | PLASTIC/EPOXY | LFQFP | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | NXP SEMICONDUCTORS | QFP | LFQFP, | 85 °C | 8542.39.00.01 | QUAD | 鸥翼 | 1 | 0.5 mm | unknown | 48 | S-PQFP-G48 | 不合格 | INDUSTRIAL | 1.6 mm | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | -3.3 V | 7 mm | 7 mm | |||||||||||||||||
![]() | SE5008L | Skyworks Solutions Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | SKYWORKS SOLUTIONS INC | QFN | HVQCCN, | 1 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3.3 V | 有 | Obsolete | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | unknown | 16 | S-XQCC-N16 | INDUSTRIAL | 0.9 mm | 电信电路 | 3 mm | 3 mm | ||||||||||||||||
![]() | MRFIC0001 | Freescale Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | 85 °C | -30 °C | PLASTIC/EPOXY | TSSOP | TSSOP20,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 无 | Obsolete | MOTOROLA SEMICONDUCTOR PRODUCTS | TSSOP, TSSOP20,.25 | e0 | Tin/Lead (Sn/Pb) | DUAL | 鸥翼 | 0.635 mm | unknown | R-PDSO-G20 | 不合格 | 3/5 V | OTHER | 12 mA | ||||||||||||||||||||
![]() | TISP61CAP3P | Power Innovations International, Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 8 | RECTANGULAR | DIP | PLASTIC/EPOXY | DIP, | POWER INNOVATIONS LTD | Transferred | IN-LINE | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T8 | 不合格 | 5.08 mm | 浪涌保护电路 | 7.62 mm | ||||||||||||||||||||||||
![]() | TISP61CAP3P | Bourns Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 8 | DIP | RECTANGULAR | IN-LINE | DIP, | DIP | BOURNS INC | Obsolete | 无 | PLASTIC/EPOXY | 8542.39.00.01 | DUAL | THROUGH-HOLE | 未说明 | 1 | not_compliant | 未说明 | 8 | R-PDIP-T8 | 不合格 | 浪涌保护电路 | ||||||||||||||||||||||
![]() | TSOT0410G14 | Avago Technologies | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 600 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 2.5 V | 活跃 | AVAGO TECHNOLOGIES INC | BGA, | 85 °C | -40 °C | e0 | 锡铅 | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 | 1.27 mm | unknown | 30 | S-PBGA-B600 | 不合格 | INDUSTRIAL | 3.05 mm | ATM/SONET/SDH SUPPORT CIRCUIT | 45 mm | 45 mm |
SC5272-M4
Hangzhou Silan Microelectronics CO LTD
分类:Interface - Telecom
TP1321
Teledyne Defense Electronics
分类:Interface - Telecom
TXC-05804AIOG-D
Transwitch Corporation
分类:Interface - Telecom
TCM1532BP
Texas Instruments
分类:Interface - Telecom
BCM5675
Broadcom Limited
分类:Interface - Telecom
S2070B
Applied Micro Circuits Corporation
分类:Interface - Telecom
ZL50402GDG
Conexant Systems Inc
分类:Interface - Telecom
ZL50402GDG
Microsemi Corporation
分类:Interface - Telecom
TM266FCA1
Pulse Electronics Corporation
分类:Interface - Telecom
HM9110C
Hualon Microelectronics Corp
分类:Interface - Telecom
LXT360LE
Intel Corporation
分类:Interface - Telecom
BCM3416
Broadcom Limited
分类:Interface - Telecom
RS8235
Mindspeed Technologies Inc
分类:Interface - Telecom
PT7A8952J
Pericom Semiconductor Corporation
分类:Interface - Telecom
BCM8011
Broadcom Limited
分类:Interface - Telecom
AWT5008Q7
Coherent Thermal Solutions
分类:Interface - Telecom
LAN9311-NZW-TR
Microchip Technology Inc
分类:Interface - Telecom
PMB6270
Infineon Technologies AG
分类:Interface - Telecom
TXC-04011-BIPQ
Transwitch Corporation
分类:Interface - Telecom
OQ2541HPB-S
NXP Semiconductors
分类:Interface - Telecom
SE5008L
Skyworks Solutions Inc
分类:Interface - Telecom
MRFIC0001
Freescale Semiconductor
分类:Interface - Telecom
TISP61CAP3P
Power Innovations International, Inc.
分类:Interface - Telecom
TISP61CAP3P
Bourns Inc
分类:Interface - Telecom
TSOT0410G14
Avago Technologies
分类:Interface - Telecom
