类别是'category.电信接口IC' (8324)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 触点镀层 | 底架 | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 电阻 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 应用 | 功率(瓦特) | HTS代码 | 最大功率耗散 | 电压 - 供电 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 功能 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 通道数量 | 界面 | 电路数量 | 最大电源电压 | 最小电源电压 | 工作电源电流 | 电源电流 | 最大电源电流 | 电流源 | 数据率 | 通信IC类型 | 收发器数量 | 电池供电 | 混合动力车 | 电池供电 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | 辐射硬化 | RoHS状态 | 无铅 | ||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | BCM56540B0KFSBG | Broadcom Limited | 数据表 | 20 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 活跃 | 1 (Unlimited) | 180 Gbps | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CPC75282KATR | IXYS Integrated Circuits Division | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 44-TQFP | 44-TQFP (10x10) | -40°C~110°C | Tape & Reel (TR) | 2014 | Obsolete | 1 (Unlimited) | 100Ohm | 110°C | -40°C | 4.75V~5.25V | 线路卡接入开关 | 5V | 1 | 5.25V | 4.75V | 4mA | 1.6mA | 无 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CPC7593ZC | IXYS Integrated Circuits Division | 数据表 | 9 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 20-SOIC (0.295, 7.50mm Width) | 20 | 20-SOIC | 800.987426mg | -40°C~110°C | Tube | 2009 | Obsolete | 1 (Unlimited) | 110Ohm | 110°C | -40°C | 10.5mW | 10.5mW | 4.5V~5.5V | 线路卡接入开关 | 5V | 1 | 5.5V | 4.5V | 2mA | 1μA | 2mA | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | CS61884-IRZR | Cirrus Logic Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 144-LQFP | 144-LQFP (15x15) | -40°C~85°C | Tape & Reel (TR) | 1999 | Obsolete | 3 (168 Hours) | 85°C | -40°C | 1.73W | 1.73W | 3.14V~3.47V | CS61884 | Line Interface Unit (LIU) | E1, J1, T1 | 8 | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LE9531CETC | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete | 3 (168 Hours) | 3.3V | Subscriber Line Interface Concept (SLIC) | Parallel | 1 | 40mA | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HC55140IMZ | Intersil (Renesas Electronics America) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | PLCC | 28 | 1.5W | 2001 | e3 | 活跃 | 3 (168 Hours) | 28 | Matte Tin (Sn) - annealed | 85°C | -40°C | QUAD | J BEND | 1 | 5V | 28 | 5V | 5V | INDUSTRIAL | 1 | 5.25V | 4.75V | 2.25mA | 2.7mA | SLIC | CONSTANT CURRENT/RESISTIVE | 2-4 CONVERSION | -24 AND -48 V | 4.57mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||
![]() | BCM56680B1KFSBLG | Broadcom Limited | 数据表 | 1965 In Stock | - | 最小起订量: 1 最小包装量: 1 | 22 Weeks | 活跃 | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CPC7592BATR | IXYS Integrated Circuits Division | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 16-SOIC (0.295, 7.50mm Width) | 16 | 16-SOIC | 665.986997mg | -40°C~110°C | Tape & Reel (TR) | 2014 | 活跃 | 1 (Unlimited) | 100Ohm | 110°C | -40°C | 10mW | 10mW | 4.5V~5.5V | 线路卡接入开关 | 5V | 1 | 5.5V | 4.5V | 1μA | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 82V2042EPFG | Integrated Device Technology (IDT) | 数据表 | 1 In Stock | - | 最小起订量: 1 最小包装量: 1 | 14 Weeks | 表面贴装 | TQFP | 80 | 1.23W | 2005 | e3 | yes | 活跃 | 3 (168 Hours) | 80 | EAR99 | Matte Tin (Sn) - annealed | 85°C | -40°C | QUAD | 鸥翼 | 260 | 1 | 3.3V | 0.65mm | 30 | 80 | 不合格 | INDUSTRIAL | 3.47V | 3.13V | pcm收发器 | 2 | 1.6mm | 14mm | 14mm | 1.4mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||||||||||||
![]() | 82V2048DAG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 13 Weeks | 表面贴装 | TQFP | 144 | 2.048MHz | 1.6W | 2010 | e3 | yes | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) - annealed | 85°C | -40°C | QUAD | 鸥翼 | 260 | 1 | 3.3V | 0.5mm | 30 | 144 | 3.3V | 3.33.3/5V | INDUSTRIAL | Parallel, Serial | 3.47V | 3.13V | 55mA | 55mA | 65mA | 2.048 Mbps | pcm收发器 | 8 | 1.6mm | 20mm | 20mm | 无 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||
![]() | DS3141N | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 144-BGA, CSPBGA | 144 | -40°C~85°C | Tray | 2003 | e0 | no | Obsolete | 1 (Unlimited) | 144 | EAR99 | Tin/Lead (Sn/Pb) | 3.135V~3.465V | BOTTOM | BALL | 240 | 3.3V | 20 | DS3141 | Framer, Line Interface Unit (LIU) | 3.3V | LIU | 1 | 500mA | 90mA | 2.048 Mbps | 无 | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||
![]() | DS31256B | Maxim Integrated | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 表面贴装 | 256-BGA | 256 | 0°C~70°C | Tray | 2006 | e0 | no | Obsolete | 1 (Unlimited) | 256 | EAR99 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | 3V~3.6V | BOTTOM | BALL | 1 | 3.3V | 1.27mm | DS31256 | 256 | 3.3V | Serial | 500mA | 132 Mbps | 电信电路 | 2.54mm | 27mm | 27mm | 无 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
![]() | HC55121IM | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 85°C | -40°C | e0 | no | Obsolete | 3 (168 Hours) | 28 | 锡铅 | QUAD | J BEND | 225 | 1 | 5V | 30 | S-PQCC-J28 | COMMERCIAL | INDUSTRIAL | SLIC | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | VSC8258YMR-01 | Microchip Technology | 数据表 | 65711 In Stock | - | 最小起订量: 1 最小包装量: 1 | 5 Weeks | 表面贴装 | 256-BBGA, FCBGA | 256-FCBGA (17x17) | Tray | 活跃 | 4 (72 Hours) | 970mV 1.2V | Ethernet | SPI | 4 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | VSC8531XMW-05 | Microchip Technology | 数据表 | 3920 In Stock | - | 最小起订量: 1 最小包装量: 1 | 4 Weeks | 表面贴装 | 48-VFQFN Exposed Pad | 48-QFN (6x6) | -40°C~125°C | 活跃 | 3 (168 Hours) | Ethernet | RMII | 1 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 78P2352-IGT/F | Maxim Integrated | 数据表 | 89 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Tin | 表面贴装 | 表面贴装 | 128-LQFP Exposed Pad | -40°C~85°C | Bulk | 2006 | no | 不用于新设计 | 3 (168 Hours) | 128 | 5A991 | SONET;SDH | 3.15V~3.45V | QUAD | 鸥翼 | 未说明 | 3.3V | 0.4mm | 未说明 | 78P2352 | Line Interface Unit (LIU) | 不合格 | 3.3V | CMOS | 2 | 325mA | ATM/SONET/SDH TRANSCEIVER | 1.6mm | 14mm | 14mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
![]() | VSC8574XKS-05 | Microchip Technology | 数据表 | 2350 In Stock | - | 最小起订量: 1 最小包装量: 1 | 8 Weeks | 表面贴装 | 256-BGA | 256-PBGA (17x17) | 活跃 | 4 (72 Hours) | 1V 2.5V | Ethernet | GMII, SerDes, TBI | 4 | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | VSC8254YMR-01 | Microchip Technology | 数据表 | 158 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | 表面贴装 | 256-BBGA, FCBGA | 256-FCBGA (17x17) | Tray | 活跃 | 4 (72 Hours) | 970mV 1.2V | Ethernet | SPI | 2 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HC55185ECR | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 32-VQFN Exposed Pad | YES | 0°C~75°C | Tray | RSLIC18 | no | Obsolete | 1 (Unlimited) | 32 | QUAD | 无铅 | 240 | 5V | 0.65mm | 未说明 | S-PQCC-N32 | Subscriber Line Interface Concept (SLIC) | 不合格 | 1 | 7mm | 7mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | VSC8540XMV-05 | Microchip Technology | 数据表 | 76 In Stock | - | 最小起订量: 1 最小包装量: 1 | 7 Weeks | 表面贴装 | 68-VFQFN Exposed Pad | 68-QFN (8x8) | 活跃 | 3 (168 Hours) | Ethernet | RMII | 1 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DS2143N | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | 40-DIP (0.600, 15.24mm) | NO | 0°C~70°C | Tube | e0 | no | Obsolete | 1 (Unlimited) | 40 | 锡铅 | 4.5V~5.5V | DUAL | 240 | 1 | 5V | 2.54mm | unknown | 20 | 40 | R-PDIP-T40 | COMMERCIAL | Parallel/Serial | 10mA | FRAMER | 5.08mm | 52.075mm | 15.24mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||
![]() | CYP15G0401TB-BGI | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 256-LBGA Exposed Pad | YES | -40°C~85°C | Tray | HOTlink II™ | e0 | no | Obsolete | 3 (168 Hours) | 256 | 锡铅 | 3.135V~3.465V | BOTTOM | BALL | 未说明 | 3.3V | 1.27mm | unknown | 未说明 | S-PBGA-B256 | Driver | COMMERCIAL | LVTTL | 4 | 590mA | 电信电路 | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||
![]() | DS21448A1 | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 144-BGA | YES | 0°C~70°C | Tray | e0 | no | Obsolete | 3 (168 Hours) | 144 | 锡铅 | 3.135V~3.465V | BOTTOM | BALL | 225 | 3.3V | 1.27mm | 未说明 | Line Interface Unit (LIU) | COMMERCIAL | 4 | 320mA | pcm收发器 | 2.22mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||
![]() | MC34017A-3P | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | 8-DIP (0.300, 7.62mm) | NO | -20°C~60°C | Tube | e0 | no | Obsolete | 3 (168 Hours) | 8 | 锡铅 | 1W | 5V | DUAL | 未说明 | 2.54mm | 未说明 | R-PDIP-T8 | 铃声 | COMMERCIAL | 1 | 20mA | 电话铃声 | 4.45mm | 9.78mm | 7.62mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||
![]() | DS2151QB | Rochester Electronics, LLC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 44-LCC (J-Lead) | YES | 0°C~70°C | Tube | e0 | no | Obsolete | 3 (168 Hours) | 44 | 锡铅 | 4.75V~5.25V | QUAD | J BEND | 240 | 5V | 20 | S-PQCC-J44 | Single-Chip Transceiver | COMMERCIAL | T1 | 1 | 65mA | FRAMER | 4.572mm | Non-RoHS Compliant |
BCM56540B0KFSBG
Broadcom Limited
分类:Interface - Telecom
CPC75282KATR
IXYS Integrated Circuits Division
分类:Interface - Telecom
CPC7593ZC
IXYS Integrated Circuits Division
分类:Interface - Telecom
CS61884-IRZR
Cirrus Logic Inc.
分类:Interface - Telecom
LE9531CETC
Microchip Technology
分类:Interface - Telecom
HC55140IMZ
Intersil (Renesas Electronics America)
分类:Interface - Telecom
BCM56680B1KFSBLG
Broadcom Limited
分类:Interface - Telecom
CPC7592BATR
IXYS Integrated Circuits Division
分类:Interface - Telecom
82V2042EPFG
Integrated Device Technology (IDT)
分类:Interface - Telecom
82V2048DAG
Integrated Device Technology (IDT)
分类:Interface - Telecom
DS3141N
Maxim Integrated
分类:Interface - Telecom
DS31256B
Maxim Integrated
分类:Interface - Telecom
HC55121IM
Rochester Electronics, LLC
分类:Interface - Telecom
VSC8258YMR-01
Microchip Technology
分类:Interface - Telecom
VSC8531XMW-05
Microchip Technology
分类:Interface - Telecom
78P2352-IGT/F
Maxim Integrated
分类:Interface - Telecom
VSC8574XKS-05
Microchip Technology
分类:Interface - Telecom
VSC8254YMR-01
Microchip Technology
分类:Interface - Telecom
HC55185ECR
Rochester Electronics, LLC
分类:Interface - Telecom
VSC8540XMV-05
Microchip Technology
分类:Interface - Telecom
DS2143N
Rochester Electronics, LLC
分类:Interface - Telecom
CYP15G0401TB-BGI
Rochester Electronics, LLC
分类:Interface - Telecom
DS21448A1
Rochester Electronics, LLC
分类:Interface - Telecom
MC34017A-3P
Rochester Electronics, LLC
分类:Interface - Telecom
DS2151QB
Rochester Electronics, LLC
分类:Interface - Telecom
