类别是'category.PLDs(可编程逻辑器件)' (2797)

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对比

图片

产品型号

品牌

数据表

库存

价格(含增值税)

数量

Rohs

表面安装

终端数量

JESD-609代码

ECCN 代码

端子表面处理

附加功能

HTS代码

包装方式

端子位置

终端形式

峰值回流焊温度(摄氏度)

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

输出的数量

资历状况

温度等级

传播延迟

建筑学

输入数量

组织结构

座位高度-最大

可编程逻辑类型

筛选水平

输出功能

宏细胞数

JTAG BST

专用输入数量

系统内可编程

产品条款数量

长度

宽度

PZ3032CS8A44-T
PZ3032CS8A44-T
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

91 MHz

32

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.63 V

2.97 V

3.3 V

Obsolete

XILINX INC

LPCC

QCCJ,

32 MACROCELLS

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

44

S-PQCC-J44

不合格

COMMERCIAL

10 ns

2 DEDICATED INPUTS, 32 I/O

4.57 mm

EE PLD

MACROCELL

2

16.5862 mm

16.5862 mm

XCR3064-12PC68I
XCR3064-12PC68I
AMD Xilinx 数据表

597 In Stock

-

最小起订量: 1

最小包装量: 1

YES

68

67 MHz

1

48

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

LDCC68,1.0SQ

SQUARE

CHIP CARRIER

3.6 V

2.97 V

3.3 V

QCCJ, LDCC68,1.0SQ

LCC

XILINX INC

Obsolete

NO

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

68

S-PQCC-J68

不合格

INDUSTRIAL

12 ns

2 DEDICATED INPUTS, 48 I/O

5.08 mm

EE PLD

MACROCELL

64

NO

2

NO

24.2316 mm

24.2316 mm

PALCE22V10H-25E4/BLA
PALCE22V10H-25E4/BLA
AMD 数据表

426 In Stock

-

最小起订量: 1

最小包装量: 1

NO

24

Obsolete

ADVANCED MICRO DEVICES INC

DIP

DIP, DIP24,.3

26.3 MHz

10

125 °C

-55 °C

CERAMIC, METAL-SEALED COFIRED

DIP

DIP24,.3

RECTANGULAR

IN-LINE

5.5 V

4.5 V

5 V

e0

3A001.A.2.C

Tin/Lead (Sn/Pb)

VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET

8542.39.00.01

DUAL

THROUGH-HOLE

2.54 mm

unknown

24

R-CDIP-T24

10

不合格

MILITARY

25 ns

PAL-TYPE

22

11 DEDICATED INPUTS, 10 I/O

5.08 mm

EE PLD

38535Q/M;38534H;883B

MACROCELL

11

132

31.9405 mm

7.62 mm

PZ3320N8EB
PZ3320N8EB
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

256

PLASTIC

BGA

BGA256,20X20,50

SQUARE

网格排列

3.3 V

Obsolete

XILINX INC

3

85 °C

-40 °C

e0

锡铅

YES

8542.39.00.01

BOTTOM

BALL

225

1.27 mm

not_compliant

30

S-PBGA-B256

不合格

INDUSTRIAL

11 ns

可加载 PLD

320

YES

YES

PZ5064NS10BC-S
PZ5064NS10BC-S
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

Transferred

XILINX INC

TQFP-44

80 MHz

3

32

85 °C

-40 °C

PLASTIC

QFP

TQFP44,.47SQ,32

SQUARE

FLATPACK

5.5 V

4.5 V

5 V

YES

8542.39.00.01

TRAY

QUAD

鸥翼

240

0.8 mm

not_compliant

30

S-PQFP-G44

32

不合格

INDUSTRIAL

12 ns

PAL/PLA-TYPE

36

2 DEDICATED INPUTS, 32 I/O

EE PLD

64

YES

2

YES

10 mm

10 mm

PZ5064NS10BC-S
PZ5064NS10BC-S
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

活跃

ADVANCED MICRO DEVICES INC

TQFP-44

80 MHz

3

32

85 °C

-40 °C

PLASTIC

QFP

TQFP44,.47SQ,32

SQUARE

FLATPACK

5.5 V

4.5 V

5 V

YES

TRAY

QUAD

鸥翼

240

0.8 mm

compliant

30

S-PQFP-G44

32

不合格

INDUSTRIAL

12 ns

PAL/PLA-TYPE

36

2 DEDICATED INPUTS, 32 I/O

EE PLD

64

YES

2

YES

10 mm

10 mm

PZ3064AS10A44
PZ3064AS10A44
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

LDCC44,.7SQ

SQUARE

CHIP CARRIER

3.3 V

Obsolete

XILINX INC

3

70 °C

PLASTIC/EPOXY

QCCJ

e0

锡铅

YES

8542.39.00.01

QUAD

J BEND

225

1.27 mm

not_compliant

30

S-PQCC-J44

不合格

COMMERCIAL

11.5 ns

EE PLD

64

YES

YES

PZ3064AS10A44
PZ3064AS10A44
Philips Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

LDCC44,.7SQ

SQUARE

CHIP CARRIER

3.3 V

Transferred

飞利浦半导体

QCCJ, LDCC44,.7SQ

70 °C

PLASTIC/EPOXY

QCCJ

e0

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J44

不合格

COMMERCIAL

11.5 ns

EE PLD

64

YES

YES

PZ3064-10BC
PZ3064-10BC
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Obsolete

NXP SEMICONDUCTORS

QFP

10 X 10 X 1 MM, PLASTIC, SOT-376-1, TQFP-44

8542.39.00.01

unknown

44

PZ3064-10BC
PZ3064-10BC
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

PLASTIC/EPOXY

QFP

TQFP44,.47SQ,32

SQUARE

FLATPACK

3.3 V

Obsolete

XILINX INC

QFP, TQFP44,.47SQ,32

3

70 °C

NO

8542.39.00.01

QUAD

鸥翼

240

0.8 mm

unknown

30

S-PQFP-G44

不合格

COMMERCIAL

12.5 ns

EE PLD

64

NO

NO

PZ5128IS10BE
PZ5128IS10BE
Philips Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

128

PLASTIC/EPOXY

QFP

QFP128,.63X.87,20

RECTANGULAR

FLATPACK

5 V

Transferred

飞利浦半导体

QFP, QFP128,.63X.87,20

85 °C

-40 °C

e0

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

QUAD

鸥翼

0.5 mm

unknown

R-PQFP-G128

不合格

INDUSTRIAL

12 ns

EE PLD

128

YES

YES

PZ3032-10A44
PZ3032-10A44
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

LDCC44,.7SQ

SQUARE

CHIP CARRIER

3.3 V

Obsolete

XILINX INC

3

70 °C

PLASTIC/EPOXY

QCCJ

e0

锡铅

NO

8542.39.00.01

QUAD

J BEND

225

1.27 mm

not_compliant

30

S-PQCC-J44

不合格

COMMERCIAL

10 ns

EE PLD

32

NO

NO

PZ3032-10A44
PZ3032-10A44
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

57 MHz

32

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

3.63 V

2.97 V

3.3 V

Obsolete

NXP SEMICONDUCTORS

LCC

PLASTIC, SOT-187-2, LCC-44

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

44

S-PQCC-J44

不合格

COMMERCIAL

17 ns

2 DEDICATED INPUTS, 32 I/O

4.57 mm

EE PLD

MACROCELL

2

16.5862 mm

16.5862 mm

PZ3032-10A44
PZ3032-10A44
Philips Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

LDCC44,.7SQ

SQUARE

CHIP CARRIER

3.3 V

Transferred

飞利浦半导体

QCCJ, LDCC44,.7SQ

70 °C

PLASTIC/EPOXY

QCCJ

e0

Tin/Lead (Sn/Pb)

NO

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J44

不合格

COMMERCIAL

10 ns

EE PLD

32

NO

NO

PZ3032NS12BC-S
PZ3032NS12BC-S
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

32

85 °C

-40 °C

PLASTIC/EPOXY

TQFP

SQUARE

FLATPACK, THIN PROFILE

3.63 V

3 V

3.3 V

Transferred

NXP SEMICONDUCTORS

TQFP,

47 MHz

32 MACROCELLS

8542.39.00.01

QUAD

鸥翼

0.8 mm

unknown

S-PQFP-G44

不合格

INDUSTRIAL

15 ns

2 DEDICATED INPUTS, 32 I/O

1.2 mm

EE PLD

MACROCELL

2

10 mm

10 mm

PZ3032NS12BC-S
PZ3032NS12BC-S
Philips Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

QFP

TQFP44,.47SQ,32

SQUARE

FLATPACK

3.3 V

Transferred

飞利浦半导体

QFP, TQFP44,.47SQ,32

85 °C

-40 °C

PLASTIC/EPOXY

e0

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

TRAY

QUAD

鸥翼

0.8 mm

unknown

S-PQFP-G44

不合格

INDUSTRIAL

15 ns

EE PLD

32

YES

YES

XC9572-7PCG84
XC9572-7PCG84
AMD Xilinx 数据表

508 In Stock

-

最小起订量: 1

最小包装量: 1

YES

84

69

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

5 V

Obsolete

XILINX INC

LCC

QCCJ,

3

e3

哑光锡

CONFIGURABLE 3.3V OR 5V I/O OPERATION; INSYSTEM PROGRAMMABLE

8542.39.00.01

QUAD

J BEND

1.27 mm

compliant

84

S-PQCC-J84

不合格

0 DEDICATED INPUTS, 69 I/O

5.08 mm

闪存 PLD

MACROCELL

29.3116 mm

29.3116 mm

PZ5128-S10A84-T
PZ5128-S10A84-T
AMD Xilinx 数据表

83 In Stock

-

最小起订量: 1

最小包装量: 1

YES

84

71 MHz

64

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

5.25 V

4.75 V

5 V

Obsolete

XILINX INC

LCC

QCCJ,

128 MACROCELLS

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

84

S-PQCC-J84

不合格

COMMERCIAL

12 ns

2 DEDICATED INPUTS, 64 I/O

4.57 mm

EE PLD

MACROCELL

2

29.3116 mm

29.3116 mm

PZ5064-10BB
PZ5064-10BB
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

Obsolete

XILINX INC

QFP

14 X 20 X 2.80 MM, PLASTIC, SOT-382-1, QFP-100

67 MHz

3

64

70 °C

PLASTIC/EPOXY

QFP

QFP100,.7X.9

RECTANGULAR

FLATPACK

5.25 V

4.75 V

5 V

e0

锡铅

NO

8542.39.00.01

QUAD

鸥翼

225

0.65 mm

not_compliant

30

100

R-PQFP-G100

不合格

COMMERCIAL

15 ns

2 DEDICATED INPUTS, 64 I/O

3.4 mm

EE PLD

MACROCELL

64

NO

2

NO

19.6 mm

14 mm

PZ5064-10BB
PZ5064-10BB
NXP Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

100

QFP,

67 MHz

64

70 °C

PLASTIC/EPOXY

QFP

QFP100,.7X.9

RECTANGULAR

FLATPACK

5.25 V

4.75 V

5 V

Transferred

NXP SEMICONDUCTORS

QFP

8542.39.00.01

QUAD

鸥翼

0.65 mm

unknown

100

R-PQFP-G100

不合格

COMMERCIAL

15 ns

2 DEDICATED INPUTS, 64 I/O

3.4 mm

EE PLD

MACROCELL

2

19.6 mm

14 mm

PZ3064-10A44
PZ3064-10A44
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

LDCC44,.7SQ

SQUARE

CHIP CARRIER

3.3 V

Obsolete

XILINX INC

3

70 °C

PLASTIC/EPOXY

QCCJ

e0

锡铅

NO

8542.39.00.01

QUAD

J BEND

225

1.27 mm

not_compliant

30

S-PQCC-J44

不合格

COMMERCIAL

12.5 ns

EE PLD

64

NO

NO

PZ3064-10A44
PZ3064-10A44
Philips Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

LDCC44,.7SQ

SQUARE

CHIP CARRIER

3.3 V

Transferred

飞利浦半导体

QCCJ, LDCC44,.7SQ

70 °C

PLASTIC/EPOXY

QCCJ

e0

Tin/Lead (Sn/Pb)

NO

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J44

不合格

COMMERCIAL

12.5 ns

EE PLD

64

NO

NO

PZ5064CS7BC-S
PZ5064CS7BC-S
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

ADVANCED MICRO DEVICES INC

TQFP-44

105 MHz

3

32

70 °C

PLASTIC

QFP

TQFP44,.47SQ,32

SQUARE

FLATPACK

5.5 V

4.5 V

5 V

活跃

YES

TRAY

QUAD

鸥翼

240

0.8 mm

compliant

30

S-PQFP-G44

32

不合格

COMMERCIAL

9 ns

PAL/PLA-TYPE

36

2 DEDICATED INPUTS, 32 I/O

EE PLD

64

YES

2

YES

10 mm

10 mm

PZ5064CS7BC-S
PZ5064CS7BC-S
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

44

3

Transferred

TQFP-44

32

70 °C

PLASTIC

QFP

TQFP44,.47SQ,32

SQUARE

FLATPACK

5.5 V

4.5 V

5 V

XILINX INC

105 MHz

YES

8542.39.00.01

TRAY

QUAD

鸥翼

240

0.8 mm

not_compliant

30

S-PQFP-G44

32

不合格

COMMERCIAL

9 ns

PAL/PLA-TYPE

36

2 DEDICATED INPUTS, 32 I/O

EE PLD

64

YES

2

YES

10 mm

10 mm

PLUS20L8DA
PLUS20L8DA
Philips Semiconductors 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

28

CHIP CARRIER

5 V

Transferred

飞利浦半导体

70 °C

PLASTIC/EPOXY

QCCJ

LDCC28,.5SQ

SQUARE

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

QUAD

J BEND

1.27 mm

unknown

S-PQCC-J28

8

不合格

COMMERCIAL

10 ns

PAL-TYPE

20

OT PLD

COMBINATORIAL

64