类别是'category.内存模块' (5401)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 表面安装 | 终端数量 | JESD-609代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 操作模式 | 电源电流-最大值 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 待机电流-最大值 | 记忆密度 | 并行/串行 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 写入保护 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 通用闪存接口 | 长度 | 宽度 | ||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | S29AL032D70TAI003 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 40 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP40,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 无 | Transferred | ADVANCED MICRO DEVICES INC | 70 ns | e0 | EAR99 | NOR型号 | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | 鸥翼 | 0.5 mm | unknown | R-PDSO-G40 | 不合格 | INDUSTRIAL | 0.035 mA | 4MX8 | 8 | 0.000005 A | 33554432 bit | PARALLEL | FLASH | YES | YES | YES | 64 | 64K | YES | YES | ||||||||||||||||||||||||||||
![]() | S29AL032D70TAI003 | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 40 | CYPRESS SEMICONDUCTOR CORP | MO-142CD, TSOP-40 | 70 ns | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3 V | 无 | Obsolete | e0 | EAR99 | NOR型号 | 锡铅 | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.5 mm | compliant | R-PDSO-G40 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 4MX8 | 1.2 mm | 8 | 33554432 bit | PARALLEL | FLASH | 3 V | BOTTOM/TOP | 18.4 mm | 10 mm | ||||||||||||||||||||||||||
![]() | S29GL128M90FFIR12 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | 有 | Obsolete | SPANSION INC | BGA | 13 X 11 MM, LEAD FREE, FORTIFIED, BGA-64 | 90 ns | 3 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | 3.3 V | e1 | EAR99 | NOR型号 | 锡银铜 | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | unknown | 40 | 64 | R-PBGA-B64 | 不合格 | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 8MX16 | 1.4 mm | 16 | 0.000005 A | 134217728 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 256 | 64K | 4/8 words | YES | YES | 13 mm | 11 mm | |||||||||||
![]() | S29GL128M90FFIR12 | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | 90 ns | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA64,8X8,40 | SQUARE | 网格排列 | 3.3 V | 有 | 活跃 | CYPRESS SEMICONDUCTOR CORP | NOR型号 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B64 | 不合格 | 3.3 V | INDUSTRIAL | 0.06 mA | 8MX16 | 0.000005 A | 134217728 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 256 | 64K | 4/8 words | YES | YES | |||||||||||||||||||||||||||||
![]() | S29AL004D90TAI010 | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | CYPRESS SEMICONDUCTOR CORP | TSOP-48 | 90 ns | 3 | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3 V | 无 | Obsolete | e0 | EAR99 | NOR型号 | 锡铅 | ALSO CONFIGURABLE AS 512K X 8; TOP BOOT BLOCK | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.5 mm | compliant | R-PDSO-G48 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 256KX16 | 1.2 mm | 16 | 4194304 bit | PARALLEL | FLASH | 3 V | 8 | TOP | 18.4 mm | 12 mm | ||||||||||||||||||||||||
![]() | SST39SF040-45-4C-NH | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | SILICON STORAGE TECHNOLOGY INC | QFJ | QCCJ, LDCC32,.5X.6 | 45 ns | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | 5 V | 无 | Obsolete | e0 | EAR99 | NOR型号 | 锡铅 | 8542.32.00.51 | QUAD | J BEND | 240 | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | 不合格 | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.02 mA | 512KX8 | 3.556 mm | 8 | 0.0001 A | 4194304 bit | PARALLEL | FLASH | 5 V | YES | YES | YES | 128 | 4K | 13.97 mm | 11.43 mm | ||||||||||||||||||
![]() | SDINBDV4-64GT | SanDisk Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MX28F2100BTC-12C4 | Macronix International Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | 120 ns | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 5 V | Obsolete | MACRONIX INTERNATIONAL CO LTD | TSOP1 | TSOP1, | EAR99 | 10000 ERASE/PROGRAM CYCLES; CAN ALSO BE CONFIGURED AS 128K X 16 | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | 不合格 | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 256KX8 | 1.2 mm | 8 | 2097152 bit | PARALLEL | FLASH | 12 V | 18.4 mm | 12 mm | ||||||||||||||||||||||||||||||
![]() | PM25LV010-25SC | Programmable Microelectronics Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 128000 | 85 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 无 | Transferred | PROGRAMMABLE MICROELECTRONICS CORP | 25 MHz | 131072 words | e0 | EAR99 | NOR型号 | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | 鸥翼 | 1.27 mm | unknown | R-PDSO-G8 | 不合格 | OTHER | 0.03 mA | 128KX8 | 8 | 0.000005 A | 1048576 bit | SERIAL | FLASH | SPI | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||
![]() | PM25LV010-25SC | Integrated Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 128000 | 85 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 无 | 活跃 | INTEGRATED SILICON SOLUTION INC | 25 MHz | 131072 words | EAR99 | NOR型号 | 8542.32.00.51 | DUAL | 鸥翼 | 1.27 mm | unknown | R-PDSO-G8 | 不合格 | OTHER | 0.015 mA | 128KX8 | 8 | 0.000005 A | 1048576 bit | SERIAL | FLASH | SPI | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | |||||||||||||||||||||||||||||||||||
![]() | ES29LV320DB-90TGI | Excel (Suzhou) Semiconductor Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | EXCEL SEMICONDUCTOR INC | TSSOP, TSSOP48,.8,20 | 90 ns | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 有 | Obsolete | EAR99 | NOR型号 | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 0.5 mm | unknown | R-PDSO-G48 | 不合格 | INDUSTRIAL | 0.03 mA | 2MX16 | 16 | 0.00001 A | 33554432 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 8,63 | 8K,64K | YES | BOTTOM | YES | |||||||||||||||||||||||||
![]() | MX30LF4G28AC-TI/TR | Macronix International Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GD25Q64BSIGY | ELM Technology Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 3 V | 接触制造商 | ELM TECHNOLOGY CORP | SOP-8 | 120 MHz | EAR99 | NOR型号 | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | R-PDSO-G8 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 8MX8 | 2.16 mm | 8 | 67108864 bit | SERIAL | FLASH | 2.7 V | 5.28 mm | 5.23 mm | ||||||||||||||||||||||||||||||||
![]() | AM29F200AT-55EC | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | ADVANCED MICRO DEVICES INC | TSOP | TSOP-48 | 55 ns | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 5 V | 无 | Obsolete | e0 | EAR99 | NOR型号 | 锡铅 | TOP BOOT BLOCK | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | 不合格 | 5.25 V | COMMERCIAL | 4.75 V | ASYNCHRONOUS | 0.06 mA | 128KX16 | 3-STATE | 1.2 mm | 16 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 5 V | 100000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,3 | 16K,8K,32K,64K | YES | TOP | 18.4 mm | 12 mm | |||||||||||||
![]() | AM29F200AT-55EC | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | Obsolete | SPANSION INC | TSOP | TSOP-48 | 55 ns | 3 | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | 小概要 | 5 V | 无 | e0 | EAR99 | NOR型号 | 锡铅 | TOP BOOT BLOCK | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 0.5 mm | not_compliant | 48 | R-PDSO-G48 | 不合格 | COMMERCIAL | 0.06 mA | 128KX16 | 16 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 5 V | 100000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,3 | 16K,8K,32K,64K | YES | TOP | |||||||||||||||||||
![]() | AM29F200AT-55EC | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 5 V | 无 | 活跃 | CYPRESS SEMICONDUCTOR CORP | 55 ns | NOR型号 | DUAL | 鸥翼 | 0.5 mm | compliant | R-PDSO-G48 | 不合格 | 5 V | COMMERCIAL | 0.06 mA | 128KX16 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 100000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,3 | 16K,8K,32K,64K | YES | TOP | ||||||||||||||||||||||||||||||
![]() | K9F5616Q0C-DCB0 | Samsung Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 63 | VFBGA, BGA63,10X12,32 | 30 ns | 16777216 words | 16000000 | 70 °C | PLASTIC/EPOXY | VFBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 1.8 V | Obsolete | SAMSUNG SEMICONDUCTOR INC | BGA | EAR99 | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 63 | R-PBGA-B63 | 不合格 | 1.95 V | COMMERCIAL | 1.65 V | ASYNCHRONOUS | 0.015 mA | 16MX16 | 1 mm | 16 | 0.00005 A | 268435456 bit | PARALLEL | FLASH | 1.8 V | NO | NO | YES | 2K | 8K | 256 words | YES | 11 mm | 9 mm | |||||||||||||||||||||
![]() | 5962-9669005HYC | Microsemi Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 32 | 60 ns | 131072 words | 128000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | 微电子组件 | 5 V | Transferred | MICROSEMI CORP | MODULE | , | e4 | 3A001.A.2.C | GOLD | 100K ERASE/PROGRAM CYCLES | 8542.32.00.51 | DUAL | THROUGH-HOLE | 1 | unknown | 32 | R-CDMA-T32 | 不合格 | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 128KX8 | 8 | 1048576 bit | PARALLEL | FLASH MODULE | 5 V | ||||||||||||||||||||||||||||||||
![]() | 5962-9669005HYC | White Microelectronics | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 32 | 128000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | 微电子组件 | 5 V | Obsolete | WHITE MICROELECTRONICS | DIP, CERAMIC-32 | 60 ns | 131072 words | e4 | GOLD | 100K ERASE/PROGRAM CYCLES | DUAL | THROUGH-HOLE | 1 | unknown | R-CDMA-T32 | 不合格 | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 128KX8 | 8 | 1048576 bit | PARALLEL | FLASH MODULE | 5 V | ||||||||||||||||||||||||||||||||||||
![]() | SEDC600M/480G | Kingston Technology Company | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 4 Weeks, 2 Days | NO | XMA | RECTANGULAR | 微电子组件 | 活跃 | KINGSTON TECHNOLOGY COMPANY INC | MODULE | 515396075520 words | 480000000000 | 70 °C | UNSPECIFIED | EAR99 | TLC NAND TYPE | 8542.32.00.51 | UNSPECIFIED | 无铅 | 1 | unknown | R-XXMA-N | ASYNCHRONOUS | 480GX8 | 8 | 4123168604160 bit | SERIAL | FLASH MODULE | |||||||||||||||||||||||||||||||||||||||||||
![]() | DM54S387J | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | NATIONAL SEMICONDUCTOR CORP | DIP, DIP16,.3 | 60 ns | 256 words | 256 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | e0 | EAR99 | 锡铅 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-GDIP-T16 | 不合格 | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.13 mA | 256X4 | OPEN-COLLECTOR | 5.08 mm | 4 | 1024 bit | PARALLEL | OTP ROM | 19.43 mm | 7.62 mm | |||||||||||||||||||||||||||
![]() | DM54S387J | Rochester Electronics LLC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | 256 words | 256 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | RECTANGULAR | IN-LINE | 5 V | 活跃 | ROCHESTER ELECTRONICS LLC | DIP, | 60 ns | e0 | EAR99 | 锡铅 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-GDIP-T16 | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 256X4 | 5.08 mm | 4 | 1024 bit | PARALLEL | OTP ROM | 19.43 mm | 7.62 mm | ||||||||||||||||||||||||||||||||
![]() | M29DW323DT70ZE6T | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | Transferred | STMICROELECTRONICS | BGA | 6 X 8 MM, 0.80 MM PITCH, TFBGA-48 | 70 ns | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 V | 无 | e0 | EAR99 | NOR型号 | 锡铅 | TOP BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | not_compliant | 48 | R-PBGA-B48 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 2MX16 | 1.2 mm | 16 | 0.0001 A | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,63 | 8K,64K | YES | TOP | YES | 8 mm | 6 mm | |||||||||||||
![]() | M29DW323DT70ZE6T | Micron Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | MICRON TECHNOLOGY INC | TFBGA-48 | 70 ns | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 V | 无 | Obsolete | EAR99 | NOR型号 | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | unknown | R-PBGA-B48 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 2MX16 | 1.2 mm | 16 | 0.0001 A | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,63 | 8K,64K | YES | TOP | YES | 8 mm | 6 mm | ||||||||||||||||||
![]() | N82HS321A | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | PLASTIC/EPOXY | QCCN | UNSPECIFIED | CHIP CARRIER | 5 V | Obsolete | NXP SEMICONDUCTORS | QCCN, | 35 ns | 4096 words | 4000 | EAR99 | 8542.32.00.71 | QUAD | 无铅 | 1 | unknown | X-PQCC-N28 | 不合格 | 5.25 V | 4.75 V | ASYNCHRONOUS | 4KX8 | 8 | 32768 bit | PARALLEL | OTP ROM |
S29AL032D70TAI003
AMD
分类:Memory - Modules
S29AL032D70TAI003
Cypress Semiconductor
分类:Memory - Modules
S29GL128M90FFIR12
Spansion
分类:Memory - Modules
S29GL128M90FFIR12
Cypress Semiconductor
分类:Memory - Modules
S29AL004D90TAI010
Cypress Semiconductor
分类:Memory - Modules
SST39SF040-45-4C-NH
Silicon Storage Technology
分类:Memory - Modules
SDINBDV4-64GT
SanDisk Corporation
分类:Memory - Modules
MX28F2100BTC-12C4
Macronix International Co Ltd
分类:Memory - Modules
PM25LV010-25SC
Programmable Microelectronics Corp
分类:Memory - Modules
PM25LV010-25SC
Integrated Silicon Solution Inc
分类:Memory - Modules
ES29LV320DB-90TGI
Excel (Suzhou) Semiconductor Co Ltd
分类:Memory - Modules
MX30LF4G28AC-TI/TR
Macronix International Co Ltd
分类:Memory - Modules
GD25Q64BSIGY
ELM Technology Corp
分类:Memory - Modules
AM29F200AT-55EC
AMD
分类:Memory - Modules
AM29F200AT-55EC
Spansion
分类:Memory - Modules
AM29F200AT-55EC
Cypress Semiconductor
分类:Memory - Modules
K9F5616Q0C-DCB0
Samsung Semiconductor
分类:Memory - Modules
5962-9669005HYC
Microsemi Corporation
分类:Memory - Modules
5962-9669005HYC
White Microelectronics
分类:Memory - Modules
SEDC600M/480G
Kingston Technology Company
分类:Memory - Modules
DM54S387J
National Semiconductor Corporation
分类:Memory - Modules
DM54S387J
Rochester Electronics LLC
分类:Memory - Modules
M29DW323DT70ZE6T
STMicroelectronics
分类:Memory - Modules
M29DW323DT70ZE6T
Micron Technology Inc
分类:Memory - Modules
N82HS321A
NXP Semiconductors
分类:Memory - Modules
