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655-53AB备选型号: BDN18-3CB/A01

655-53AB

Wakefield-Vette

HEATSINK CPU 40.6MM SQ H=.525"

12 Weeks
Adhesive
BGA
Aluminum
Square, Pin Fins
Assorted (BGA, LGA, CPU, ASIC...)
黑色阳极氧化
655
2008
yes
活跃
1 (Unlimited)
顶部安装
Black
Thermal Tape, Adhesive (Not Included)
0.522 13.27mm
2.00°C/W @ 400 LFM
2 °C/W
PIN FIN ARRAY
4.0W @ 40°C
OMNIDIRECT
13.3mm
1.600 40.64mm
1.600 40.64mm
ROHS3 Compliant
无铅
-
-
-
BDN18-3CB/A01

CTS Thermal Management Products

HEATSINK CPU W/ADHESIVE 1.81"SQ

14 Weeks
-
-
Aluminum
Square, Pin Fins
Assorted (BGA, LGA, CPU, ASIC...)
黑色阳极氧化
BDN
2007
-
活跃
1 (Unlimited)
顶部安装
-
Thermal Tape, Adhesive (Included)
0.355 9.02mm
3.50°C/W @ 400 LFM
-
PIN FIN ARRAY
-
OMNIDIRECT
-
1.810 45.97mm
1.810 45.97mm
符合RoHS标准
-
EXTRUDED
10.80°C/W
IC
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