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658-45ABT4E备选型号: BDN13-3CB/A01

658-45ABT4E

Wakefield-Vette

HEATSINK CPU 28MM SQ BLK W/TAPE

12 Weeks
Adhesive
Aluminum
Square, Pin Fins
BGA
黑色阳极氧化
658
2008
活跃
1 (Unlimited)
顶部安装
Black
FIN
Thermal Tape, Adhesive (Included)
0.450 11.43mm
6.00°C/W @ 200 LFM
6 °C/W
PIN FIN ARRAY
3.0W @ 50°C
OMNIDIRECT
11.4mm
1.100 27.94mm
1.100 27.94mm
ROHS3 Compliant
无铅
-
-
BDN13-3CB/A01

CTS Thermal Management Products

HEATSINK CPU W/ADHESIVE 1.31"SQ

14 Weeks
-
Aluminum
Square, Pin Fins
Assorted (BGA, LGA, CPU, ASIC...)
黑色阳极氧化
BDN
2007
活跃
1 (Unlimited)
顶部安装
-
EXTRUDED
Thermal Tape, Adhesive (Included)
0.355 9.02mm
6.00°C/W @ 400 LFM
-
PIN FIN ARRAY
-
OMNIDIRECT
-
1.310 33.27mm
1.310 33.27mm
符合RoHS标准
-
16.10°C/W
IC
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