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70V3399S133BCI8备选型号: 70V3589S133BF8

70V3399S133BCI8

Integrated Device Technology (IDT)

SRAM Chip Sync Dual 3.3V 2.25M-Bit 128K x 18 15ns/4.2ns 256-Pin CABGA T/R

16 Weeks
表面贴装
256
RAM, SRAM
480mA
Tape & Reel
2009
e0
no
活跃
3 (168 Hours)
256
Tin/Lead (Sn63Pb37)
85°C
-40°C
PIPELINED OR FLOW-THROUGH ARCHITECTURE
3.3V
BOTTOM
BALL
225
1
1mm
133MHz
INDUSTRIAL
Parallel
2
15 ns
3-STATE
34b
2.3 Mb
0.04A
COMMON
Synchronous
18b
3.45V
3.15V
17mm
1.7mm
17mm
1.4mm
无
符合RoHS标准
含铅
-
70V3589S133BF8

Integrated Device Technology (IDT)

SRAM Chip Sync Dual 3.3V 2.25M-Bit 64K x 36 15ns/4.2ns 208-Pin CABGA T/R

7 Weeks
表面贴装
208
RAM, SRAM
400mA
Tape & Reel
2009
e0
no
活跃
3 (168 Hours)
208
Tin/Lead (Sn63Pb37)
70°C
0°C
FLOW-THROUGH OR PIPELINED ARCHITECTURE
3.3V
BOTTOM
BALL
-
1
0.8mm
133MHz
COMMERCIAL
Parallel
2
15 ns
3-STATE
32b
2.3 Mb
0.03A
COMMON
Synchronous
36b
3.45V
3.15V
15mm
1.7mm
15mm
1.4mm
无
符合RoHS标准
含铅
64KX36
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图片	产品型号	品牌	分类	封装	描述	对比
	70V3589S133BFI8	Integrated Device Technology (IDT)	存储器		SRAM Chip Sync Dual 3.3V 2.25M-Bit 64K x 36 15ns/4.2ns 208-Pin CABGA T/R	对比
	70V3589S133BF8	Integrated Device Technology (IDT)	存储器		SRAM Chip Sync Dual 3.3V 2.25M-Bit 64K x 36 15ns/4.2ns 208-Pin CABGA T/R	对比