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70V7519S133BCI备选型号: 70V7339S166BCGI

70V7519S133BCI

Integrated Device Technology (IDT)

SRAM Chip Sync Dual 3.3V 9M-Bit 256K x 36 15ns/4.2ns 256-Pin CABGA

7 Weeks
表面贴装
256
RAM, SDR, SRAM
675mA
2009
e0
no
活跃
3 (168 Hours)
256
Tin/Lead (Sn63Pb37)
85°C
-40°C
FLOW-THROUGH OR PIPELINED ARCHITECTURE
3.3V
BOTTOM
BALL
225
1
1mm
133MHz
INDUSTRIAL
Parallel
1.1MB
2
25 ns
3-STATE
18b
9 Mb
0.04A
COMMON
Synchronous
36b
3.45V
3.15V
17mm
1.5mm
17mm
1.4mm
无
符合RoHS标准
含铅
-
-
-
70V7339S166BCGI

Integrated Device Technology (IDT)

SRAM Chip Sync Dual 3.3V 9M-Bit 512K x 18 12ns/3.6ns 256-Pin CABGA

7 Weeks
表面贴装
256
RAM, SDR, SRAM
830mA
2010
e1
yes
活跃
3 (168 Hours)
256
Tin/Silver/Copper (Sn/Ag/Cu)
85°C
-40°C
PIPELINED ARCHITECTURE OR FLOW-THROUGH
3.3V
BOTTOM
BALL
260
1
1mm
166MHz
INDUSTRIAL
Parallel
1.1MB
2
20 ns
3-STATE
19b
9 Mb
0.04A
COMMON
Synchronous
18b
3.45V
3.15V
17mm
-
17mm
1.4mm
无
符合RoHS标准
无铅
Bulk
30
SERIAL
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集成电路（IC）相关产品

图片	产品型号	品牌	分类	封装	描述	对比
	70V7339S166BCGI	Integrated Device Technology (IDT)	存储器		SRAM Chip Sync Dual 3.3V 9M-Bit 512K x 18 12ns/3.6ns 256-Pin CABGA	对比