IC FPGA 500K GATES 512KB 256-BGA
256-LBGA
YES
256
MCU - 25, FPGA - 66
-40°C~100°C TJ
Tray
SmartFusion®
2013
e1
活跃
3 (168 Hours)
256
Tin/Silver/Copper (Sn/Ag/Cu)
8542.39.00.01
BOTTOM
BALL
250
1.5V
1mm
100MHz
30
A2F500M3G
66
不合格
1.575V
1.51.82.53.3V
1.425V
EBI/EMI, Ethernet, I2C, SPI, UART, USART
64KB
ARM® Cortex®-M3
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, SPI, UART/USART
MCU, FPGA
现场可编程门阵列
ARM
500000
24
ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
512KB
17mm
1.7mm
17mm
符合RoHS标准
无铅
-
-
-
-
-
-
IC FPGA 200K GATES 256KB 256-BGA
256-LBGA
-
256
MCU - 25, FPGA - 66
0°C~85°C TJ
Tray
SmartFusion®
2012
-
活跃
3 (168 Hours)
256
TIN LEAD/TIN LEAD SILVER
-
BOTTOM
BALL
225
1.5V
1mm
80MHz
30
A2F200
66
不合格
-
-
-
EBI/EMI, Ethernet, I2C, SPI, UART, USART
64KB
ARM® Cortex®-M3
DMA, POR, WDT
EBI/EMI, Ethernet, I2C, SPI, UART/USART
MCU, FPGA
现场可编程门阵列
ARM
200000
8
ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
256KB
17mm
1.7mm
17mm
Non-RoHS Compliant
-
12 Weeks
表面贴装
1.5V
1.575V
1.425V
2mA