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IC FPGA 620 I/O 896FBGA
IN PRODUCTION (Last Updated: 2 weeks ago)
12 Weeks
Copper, Silver, Tin
表面贴装
表面贴装
896-BGA
896
400.011771mg
620
-40°C~100°C TJ
Tray
ProASIC3E
2009
e1
活跃
3 (168 Hours)
896
Tin/Silver/Copper (Sn/Ag/Cu)
1.425V~1.575V
BOTTOM
BALL
250
1.5V
40
A3PE3000
1.5V
63kB
现场可编程门阵列
516096
3000000
310MHz
2
75264
1.73mm
31mm
31mm
无
符合RoHS标准
-
-
-
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IC FPGA 620 I/O 896FBGA
IN PRODUCTION (Last Updated: 1 month ago)
12 Weeks
-
表面贴装
表面贴装
896-BGA
896
400.011771mg
620
-40°C~100°C TJ
Tray
ProASIC3E
2013
e1
活跃
3 (168 Hours)
896
Tin/Silver/Copper (Sn/Ag/Cu)
1.425V~1.575V
BOTTOM
BALL
250
1.5V
40
M1A3PE3000
1.5V
63kB
现场可编程门阵列
516096
3000000
231MHz
-
75264
1.73mm
31mm
31mm
无
符合RoHS标准
8542.39.00.01
620
1.5/3.3V
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