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AD261BND-3备选型号: MCP23S17-E/SP

AD261BND-3

Analog Devices Inc.

DGTL ISO 3.5KV GEN PURP 22DIP

OBSOLETE (Last Updated: 1 month ago)
Lead, Tin
通孔
通孔
22-DIP Module
22
5
-25°C~85°C
Tube
IsoLogic™
no
Obsolete
1 (Unlimited)
16
EAR99
通用型
4V~5.75V
QUAD
5V
AD261
22
R-PQIP-T16
3500Vrms
5V
5
4mA
1
25 ns
单向
25ns, 25ns
10kV/μs
3/2
无
25 ns
11.18mm
Non-RoHS Compliant
含铅
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
MCP23S17-E/SP

Microchip Technology

MICROCHIP - MCP23S17-E/SP - I/O Expander, 16bit, 10 MHz, Serial, SPI, 1.8 V, 5.5 V, DIP

-
-
Surface Mount, Through Hole
通孔
28-DIP (0.300, 7.62mm)
28
16
-40°C~125°C
Tube
-
yes
活跃
1 (Unlimited)
28
EAR99
-
1.8V~5.5V
DUAL
5V
MCP23S17
28
-
-
-
1
-
2
-
-
-
-
-
-
-
5.08mm
ROHS3 Compliant
无铅
12 Weeks
2007
e3
Matte Tin (Sn)
NOT APPLICABLE
2.54mm
NOT APPLICABLE
不合格
Push-Pull
5V
SPI
1mA
16
10MHz
4.5V
有
25mA
POR
7.62mm
无SVHC
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图片	产品型号	品牌	分类	封装	描述	对比
	AD260AND-2	Analog Devices Inc.	数字隔离器	22-DIP Module	DGTL ISO 1.75KV GEN PURP 22DIP	对比
	AD260AND-3	Analog Devices Inc.	数字隔离器	22-DIP Module	DGTL ISO 1.75KV GEN PURP 22DIP	对比
	MCP23S17-E/SP	Microchip Technology	接口 - I/O 扩展器	28-DIP (0.300, 7.62mm)	MICROCHIP - MCP23S17-E/SP - I/O Expander, 16bit, 10 MHz, Serial, SPI, 1.8 V, 5.5 V, DIP	对比