ARM Microcontrollers - MCU BGA100, GREEN, IND TEMP, MRL A
16 Weeks
YES
100-TFBGA
表面贴装
100
63
Tray
SAM3X
-40°C~85°C TA
2011
e2
yes
活跃
3 (168 Hours)
100
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
BOTTOM
BALL
1.8V
0.8mm
84MHz
ATSAM3X
不合格
3.6V
1.95V
CAN, Ethernet, I2C, IrDA, LIN, MMC, SPI, UART, USART, USB
256kB
Internal
1.62V~3.6V
MICROCONTROLLER, RISC
ARM® Cortex®-M3
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
FLASH
32-Bit
256KB 256K x 8
CANbus, Ethernet, I2C, IrDA, LINbus, Memory Card, SPI, SSC, UART/USART, USB
32
YES
YES
32b
YES
3
24
ARM
4
16
2
1.1mm
9mm
ROHS3 Compliant
无铅
-
-
-
-
-
-
ARM Microcontrollers - MCU BGAGREENIND TEMPMRL A
18 Weeks
-
100-TFBGA
表面贴装
100
A/D 15x10/12b; D/A 2x12b
Cut Tape (CT)
SAM3S
-40°C~85°C TA
1997
e1
yes
活跃
3 (168 Hours)
100
Tin/Silver/Copper (Sn/Ag/Cu)
BOTTOM
BALL
1.8V
0.8mm
64MHz
ATSAM3S4
-
3.3V
1.95V
EBI/EMI, I2C, I2S, SPI, UART, USART, USB
256kB
Internal
1.62V~3.6V
MICROCONTROLLER, RISC
ARM® Cortex®-M3
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
FLASH
32-Bit
256KB 256K x 8
EBI/EMI, I2C, Memory Card, SPI, SSC, UART/USART, USB
32
YES
YES
32b
YES
6
24
ARM
-
-
-
1.1mm
9mm
ROHS3 Compliant
-
Copper, Silver, Tin
表面贴装
260
30
YES
8