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ATWINC3400A-MU-Y备选型号: WL1801MODGBMOCT

ATWINC3400A-MU-Y

Microchip Technology

SmartConnect Chipset (WINC3400) - SmartConnect Chipset (WINC3400)

19 Weeks
表面贴装
48-VFQFN Exposed Pad
48-QFN (6x6)
-40°C~85°C
Tray
2015
活跃
3 (168 Hours)
TxRx + MCU
85°C
-40°C
2.7V~3.6V
2.4GHz
ATWINC3400
I2C, SDIO, SPI, UART
256kB ROM 708kB RAM
802.11b/g/n, Bluetooth v4.0
20dBm
Bluetooth, WiFi
-98dBm
72.2Mbps
I2C, SDIO, SPI, UART
83.7mA~91.8mA
276mA~325mA
8PSK, GFSK, QPSK
-98 dBm
18
18
ROHS3 Compliant
无铅
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
WL1801MODGBMOCT

Texas Instruments

RF TXRX MODULE WIFI CHIP ANT

20 Weeks
表面贴装
Module
-
-20°C~70°C
Tape & Reel (TR)
-
活跃
3 (168 Hours)
-
-
-
2.9V~4.8V
2.4GHz
WL1801
SDIO, UART
-
802.11b/g/n, Bluetooth 4.2
18.5dBm
Bluetooth, WiFi
-
-
SDIO, UART
49mA~85mA
238mA~420mA
CCK, DSSS, GFSK, OFDM
-96.3 dBm
-
-
ROHS3 Compliant
含铅
ACTIVE (Last Updated: 1 day ago)
表面贴装
100
WiLink™
e4
yes
100
5A992.C
Nickel/Palladium/Gold (Ni/Pd/Au)
8542.31.00.01
BOTTOM
260
1
3.7V
0.7mm
2.9/4.8V
54Mbps
电信电路
2mm
13.3mm
13.4mm
2mm
无SVHC
无
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