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HEATSINK CPU W/ADHESIVE 1.71"SQ
14 Weeks
Aluminum
Square, Pin Fins
Assorted (BGA, LGA, CPU, ASIC...)
黑色阳极氧化
BDN
2004
活跃
1 (Unlimited)
顶部安装
EXTRUDED
Thermal Tape, Adhesive (Included)
0.355 9.02mm
3.80°C/W @ 400 LFM
11.50°C/W
PIN FIN ARRAY
OMNIDIRECT
IC
1.710 43.43mm
1.710 43.43mm
符合RoHS标准
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HEATSINK CPU W/ADHESIVE 1.61"SQ
14 Weeks
Aluminum
Square, Pin Fins
Assorted (BGA, LGA, CPU, ASIC...)
黑色阳极氧化
BDN
2007
活跃
1 (Unlimited)
顶部安装
EXTRUDED
Thermal Tape, Adhesive (Included)
0.355 9.02mm
4.50°C/W @ 400 LFM
13.50°C/W
PIN FIN ARRAY
OMNIDIRECT
IC
1.610 40.89mm
1.610 40.89mm
符合RoHS标准
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HEATSINK CPU W/ADHESIVE 1.71"SQ14 WeeksAluminumSquare, Pin FinsAssorted (BGA, LGA, CPU, ASIC...)黑色阳极氧化BDN2004活跃1 (Unlimited)顶部安装EXTRUDEDThermal Tape, Adhesive (Included)0.355 9.02mm3.80°C/W @ 400 LFM11.50°C/WPIN FIN ARRAYOMNIDIRECTIC1.710 43.43mm1.710 43.43mm符合RoHS标准
HEATSINK CPU W/ADHESIVE 1.61"SQ14 WeeksAluminumSquare, Pin FinsAssorted (BGA, LGA, CPU, ASIC...)黑色阳极氧化BDN2007活跃1 (Unlimited)顶部安装EXTRUDEDThermal Tape, Adhesive (Included)0.355 9.02mm4.50°C/W @ 400 LFM13.50°C/WPIN FIN ARRAYOMNIDIRECTIC1.610 40.89mm1.610 40.89mm符合RoHS标准
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