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C0402C333M4RACTU备选型号: CGA2B2X7R1C333M050BD

C0402C333M4RACTU

KEMET

CAP CER 0.033UF 16V X7R 0402

22 Weeks
表面贴装
0402 (1005 Metric)
WRAPAROUND
2
Ceramic
652.039032μg
16V
-55°C~125°C
Tape & Reel (TR)
SMD Comm X7R
2012
0.039Lx0.020W 1.00mmx0.50mm
±20%
e3
yes
活跃
1 (Unlimited)
2
SMD/SMT
EAR99
X7R
Matte Tin (Sn) - with Nickel (Ni) barrier
Bypass, Decoupling
0.033μF
500μm
1005
0402
X7R
有
550μm
1mm
0.5mm
0.022 0.55mm
558.8μm
ROHS3 Compliant
-
-
-
CGA2B2X7R1C333M050BD

TDK Corporation

CAP CER 0.033UF 16V X7R 0402

-
表面贴装
0402 (1005 Metric)
WRAPAROUND
-
CERAMIC
652.039032μg
16V
-55°C~125°C
Cut Tape (CT)
CGA
2012
0.039Lx0.020W 1.00mmx0.50mm
±20%
-
yes
PRODUCTION (NOT RECOMMENDED FOR NEW DESIGN) (Last Updated: 1 month ago)
1 (Unlimited)
2
-
EAR99
X7R
Silver/Palladium/Copper (Ag/Pd/Cu)
汽车
0.033μF
-
1005
0402
X7R
有
500μm
-
-
0.024 0.60mm
508μm
ROHS3 Compliant
陶瓷电容器
可环氧树脂安装
AEC-Q200
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电容相关产品

图片	产品型号	品牌	分类	封装	描述	对比
	CGA2B2X7R1C333M050BD	TDK Corporation	陶瓷电容器	0402 (1005 Metric)	CAP CER 0.033UF 16V X7R 0402	对比
	GRM155R71C333KA01D	Murata Electronics	陶瓷电容器	0402 (1005 Metric)	CAP CER 0.033UF 16V X7R 0402	对比
	CGA2B2X7R1C333M050BA	TDK Corporation	陶瓷电容器	0402 (1005 Metric)	Cap Ceramic 0.033uF 16V X7R 20% SMD 0402 125°C Punched Paper T/R	对比