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C0603C222M3RACTU备选型号: CGA3E2X7R1H222M080AD

C0603C222M3RACTU

KEMET

Multilayer Ceramic Capacitors MLCC - SMD/SMT 25volts 2200pF X7R 20%

8 Weeks
0603 (1608 Metric)
Surface Mount, MLCC
WRAPAROUND
Ceramic
25V
2013
SMD Comm X7R
TR, Punched Paper, 7 Inch
-55°C~125°C
0.063Lx0.031W 1.60mmx0.80mm
±20%
e3
yes
活跃
1 (Unlimited)
2
SMD/SMT
EAR99
X7R
Matte Tin (Sn) - with Nickel (Ni) barrier
Bypass, Decoupling
8532.24.00.20
2200pF
700μm
800μm
1608
0603
X7R
有
10 %
0.8mm
1.6mm
870μm
0.034 0.87mm
863.6μm
ROHS3 Compliant
-
-
-
-
CGA3E2X7R1H222M080AD

TDK Corporation

IC MCU 32BIT 32KB FLASH 64TQFP

12 Weeks
0603 (1608 Metric)
Surface Mount, MLCC, Epoxy
WRAPAROUND
CERAMIC
50V
2012
CGA
Cut Tape (CT)
-55°C~125°C
0.063Lx0.031W 1.60mmx0.80mm
±20%
-
yes
活跃
1 (Unlimited)
2
-
EAR99
X7R
Silver/Palladium/Copper (Ag/Pd/Cu)
汽车
-
2200pF
-
-
1608
0603
X7R
有
-
-
-
800μm
0.031 0.80mm
787.4μm
ROHS3 Compliant
2.012816mg
陶瓷电容器
可环氧树脂安装
AEC-Q200
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电容相关产品

图片	产品型号	品牌	分类	封装	描述	对比
	C1608X7R2A222M080AA	TDK Corporation	陶瓷电容器	0603 (1608 Metric)	CAP CER 2200PF 100V X7R 0603	对比
	CGA3E2X7R1H222M080AD	TDK Corporation	陶瓷电容器	0603 (1608 Metric)	IC MCU 32BIT 32KB FLASH 64TQFP	对比
	CGA3E2X7R2A222M080AA	TDK Corporation	陶瓷电容器	0603 (1608 Metric)	Cap Ceramic 0.0022uF 100V X7R 20% SMD 0603 125°C Punched Paper T/R	对比