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C2012CH2A182K085AA备选型号: C0805C182K1RACTU

C2012CH2A182K085AA

TDK Corporation

CAP CER 1800PF 100V CH 0805

PRODUCTION (NOT RECOMMENDED FOR NEW DESIGN) (Last Updated: 1 month ago)
52 Weeks
表面贴装
Surface Mount, MLCC
0805 (2012 Metric)
WRAPAROUND
-25°C~85°C
Tape & Reel (TR)
C
2012
0.079Lx0.049W 2.00mmx1.25mm
±10%
e3
yes
不用于新设计
1 (Unlimited)
2
SMD/SMT
EAR99
CH
Ceramic
通用型
8532.24.00.20
1800pF
100V
2012
0805
CH
有
850μm
2mm
1.25mm
0.039 1.00mm
990.6μm
ROHS3 Compliant
-
-
-
-
-
-
C0805C182K1RACTU

KEMET

Cap Ceramic 0.0018uF 100V X7R 10% SMD 0805 125°C Paper T/R

-
8 Weeks
表面贴装
Surface Mount, MLCC
0805 (2012 Metric)
WRAPAROUND
-55°C~125°C
Tape & Reel (TR)
SMD Comm X7R
2012
0.079Lx0.049W 2.00mmx1.25mm
±10%
e3
yes
活跃
1 (Unlimited)
2
SMD/SMT
EAR99
X7R
-
Bypass, Decoupling
8532.24.00.20
1800pF
100V
2012
0805
X7R
有
880μm
2mm
-
0.035 0.88mm
889μm
ROHS3 Compliant
Ceramic
5.499807mg
Matte Tin (Sn) - with Nickel (Ni) barrier
TR, Punched Paper, 7 Inch
1.25mm
无SVHC
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图片	产品型号	品牌	分类	封装	描述	对比
	C2012NP02A182J085AA	TDK Corporation	陶瓷电容器	0805 (2012 Metric)	CAP CER 1800PF 100V NP0 0805	对比
	C0805C182K1RACTU	KEMET	陶瓷电容器	0805 (2012 Metric)	Cap Ceramic 0.0018uF 100V X7R 10% SMD 0805 125°C Paper T/R	对比
	C2012C0G2A182K085AA	TDK Corporation	陶瓷电容器	0805 (2012 Metric)	CAP CER 1800PF 100V C0G 0805	对比