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CB2012T1R0M备选型号: MLP2012V1R0MT0S1

CB2012T1R0M

Taiyo Yuden

Inductor Power Chip Wirewound 1uH 20% 7.96MHz Ferrite 0.9A 0.195Ohm DCR 0805 T/R

13 Weeks
表面贴装
0805 (2012 Metric)
WRAPAROUND
矩形包装
100MHz
-40°C~105°C
Tape & Reel (TR)
CB
2002
0.079Lx0.049W 2.00mmx1.25mm
±20%
yes
活跃
1 (Unlimited)
2
SMD/SMT
EAR99
Wirewound
8504.50.80.00
900mA
Unshielded
1
伤口芯片
2012
0805
1μH
7.96MHz
功率电感
双端
无卤素
500mA
20%
195mOhm Max
900mA
900μm
0.057 1.45mm
Unknown
ROHS3 Compliant
无铅
-
MLP2012V1R0MT0S1

TDK Corporation

Inductor Power Shielded Multi-Layer 1uH 20% 2MHz Ferrite 0.9A 0.26Ohm DCR 0805 T/R

10 Weeks
表面贴装
0805 (2012 Metric)
-
-
Ferrite
-40°C~125°C
Cut Tape (CT)
MLP
2014
0.079Lx0.049W 2.00mmx1.25mm
±20%
-
PRODUCTION (Last Updated: 2 months ago)
1 (Unlimited)
-
-
EAR99
Multilayer
8504.50.80.00
900mA
Shielded
-
-
2012
0805
1μH
2MHz
-
-
-
-
-
260mOhm Max
-
-
0.039 1.00mm
-
ROHS3 Compliant
-
0.9A
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图片	产品型号	品牌	分类	封装	描述	对比
	MLZ2012A1R0WTD25	TDK Corporation	固定电感器	0805 (2012 Metric)	FIXED IND 1UH 900MA 130 MOHM SMD	对比
	MLP2012V1R0MT0S1	TDK Corporation	固定电感器	0805 (2012 Metric)	Inductor Power Shielded Multi-Layer 1uH 20% 2MHz Ferrite 0.9A 0.26Ohm DCR 0805 T/R	对比