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CY7C1360S-166BZXI备选型号: 71V35761SA166BQGI

CY7C1360S-166BZXI

Cypress Semiconductor Corp

IC SRAM 9M PARALLEL 165FBGA

6 Weeks
表面贴装
165-LBGA
165
165-FBGA (13x15)
Volatile
-40°C~85°C TA
Tray
2016
活跃
3 (168 Hours)
85°C
-40°C
3.135V~3.6V
166MHz
CY7C1360
Parallel
9Mb 256K x 36
166MHz
3.5ns
SRAM
Parallel
ROHS3 Compliant
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71V35761SA166BQGI

Integrated Device Technology (IDT)

SRAM Chip Sync Single 3.3V 4.5M-Bit 128K x 36 3.5ns 165-Pin FBGA

11 Weeks
-
FBGA
165
-
166MHz
-
-
2009
活跃
3 (168 Hours)
85°C
-40°C
-
166MHz
-
Parallel
512kB
-
3.5 ns
-
-
符合RoHS标准
表面贴装
e1
yes
165
Tin/Silver/Copper (Sn/Ag/Cu)
流水线结构
BOTTOM
BALL
260
1
3.3V
30
165
3.3V
INDUSTRIAL
3.465V
3.135V
1
330mA
3-STATE
17b
4.5 Mb
0.035A
COMMON
Synchronous
36b
15mm
13mm
1.2mm
无
无铅
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集成电路（IC）相关产品

图片	产品型号	品牌	分类	封装	描述	对比
	CY7C1360C-166BZC	Cypress Semiconductor Corp	存储器	165-LBGA	IC SRAM 9M PARALLEL 165FBGA	对比
	71V35761SA166BQGI	Integrated Device Technology (IDT)	存储器	FBGA	SRAM Chip Sync Single 3.3V 4.5M-Bit 128K x 36 3.5ns 165-Pin FBGA	对比
	71V35761SA166BQG	Integrated Device Technology (IDT)	存储器	FBGA	SRAM Chip Sync Single 3.3V 4.5M-Bit 128K x 36 3.5ns 165-Pin FBGA	对比