IC MCU 32BIT ROMLESS 256LFBGA
20 Weeks
Copper, Silver, Tin
表面贴装
表面贴装
256-LFBGA
256
A/D 4x10b
-40°C~85°C TA
Tray
SuperH® SH7750
2010
活跃
3 (168 Hours)
1.4V~1.6V
200MHz
D17760
CAN, EBI/EMI, I2C, MMC, SCI, SPI, Serial, USB
Internal
48K x 8
SH-4
DMA, LCD, POR, WDT
ROMless
32-Bit
Audio Codec, CANbus, EBI/EMI, FIFO, I2C, MFI, Memory Card, SCI, Serial Sound, SIM, SPI, USB
200 μs
32b
7
无
ROHS3 Compliant
无铅
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
NXP MCF5274CVM166 IC, 32BIT MCU, COLDFIRE V2, BGA-256
10 Weeks
-
-
表面贴装
256-LBGA
-
69
-40°C~85°C TA
Tray
MCF527x
1997
不用于新设计
3 (168 Hours)
1.4V~1.6V
-
MCF5274
-
External
64K x 8
Coldfire V2
DMA, WDT
ROMless
32-Bit
EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
-
-
-
-
ROHS3 Compliant
-
YES
e1
256
5A992
锡银铜
ALSO REQUIRES 3.3V SUPPLY
8542.31.00.01
BOTTOM
BALL
260
1mm
40
S-PBGA-B256
不合格
166MHz
MICROPROCESSOR, RISC
83MHz
32
24
YES
YES
32
固定点
YES
1.6V
1.4V
17mm
1.6mm
17mm