M7AFS600-2FG484备选型号: XC7Z020-1CLG484C

IN PRODUCTION (Last Updated: 3 weeks ago)

17 Weeks

表面贴装

表面贴装

484-BGA

484

400.011771mg

172

0°C~70°C TA

Tray

Fusion®

2000

e0

活跃

3 (168 Hours)

484

Tin/Lead (Sn/Pb)

1.425V~1.575V

BOTTOM

BALL

225

1.5V

1mm

30

M7AFS600

1.5V

13.5kB

现场可编程门阵列

110592

600000

1.47059GHz

2

13824

1.73mm

23mm

23mm

无

Non-RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

10 Weeks

-

-

484-LFBGA, CSPBGA

2

-

130

0°C~85°C TJ

Tray

Zynq®-7000

2009

e1

活跃

3 (168 Hours)

484

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

-

BOTTOM

BALL

260

1V

0.8mm

30

XC7Z020

-

256KB

-

-

-

-

-1

-

-

19mm

-

无

ROHS3 Compliant

Copper, Silver, Tin

YES

3A991.D

667MHz

S-PBGA-B484

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

3.3V

1.2V

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32b

ARM

YES

Artix™-7 FPGA, 85K Logic Cells

1.6mm