NXP MCF5208CVM166 MCU, 32BIT, COLDFIRE V2, 166MHZ, BGA-196
10 Weeks
表面贴装
196-LBGA
YES
50
-40°C~85°C TA
Tray
MCF520x
2005
活跃
3 (168 Hours)
196
3A991.A.2
Tin/Silver/Copper - with Nickel barrier
8542.31.00.01
BOTTOM
BALL
260
1.5V
1mm
40
MCF5208
S-PBGA-B196
不合格
1.6V
1.51.8/3.3V
1.4V
External
166.67MHz
16K x 8
1.4V~3.6V
MICROPROCESSOR, RISC
Coldfire V2
DMA, WDT
40MHz
ROMless
32-Bit
EBI/EMI, Ethernet, I2C, SPI, UART/USART
32
24
YES
YES
32
固定点
YES
15mm
1.6mm
15mm
ROHS3 Compliant
-
-
NXP MCF5271CVM150 IC, MPU, 32BIT, COLDFIRE V2, 196BGA
14 Weeks
表面贴装
196-LBGA
YES
97
-40°C~85°C TA
Tray
MCF527x
1997
不用于新设计
3 (168 Hours)
196
5A002.A.1
Tin/Silver/Copper (Sn/Ag/Cu)
8542.31.00.01
BOTTOM
BALL
260
1.5V
1mm
40
MCF5271
S-PBGA-B196
不合格
1.6V
-
1.4V
External
150MHz
64K x 8
1.4V~3.6V
MICROPROCESSOR, RISC
Coldfire V2
DMA, WDT
75MHz
ROMless
32-Bit
EBI/EMI, Ethernet, I2C, SPI, UART/USART
32
24
YES
YES
32
固定点
YES
15mm
1.6mm
15mm
ROHS3 Compliant
e1
ALSO REQUIRES 3.3V SUPPLY