NXP MCF5235CVM150 MPU, 32BIT, COLDFIRE V2, 150MHZ, 256MAPB
10 Weeks
表面贴装
256-LBGA
YES
97
-40°C~85°C TA
Tray
MCF523x
2004
不用于新设计
3 (168 Hours)
256
5A002.A.1
Tin/Silver/Copper - with Nickel barrier
低功耗模式取自低功耗模式
8542.31.00.01
BOTTOM
BALL
260
1.5V
1mm
40
MCF5235
S-PBGA-B256
不合格
1.6V
1.4V
External
150MHz
64K x 8
1.4V~1.6V
MICROPROCESSOR, RISC
Coldfire V2
DMA, WDT
75MHz
ROMless
32-Bit
CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
32
24
YES
YES
32
固定点
YES
17mm
1.6mm
17mm
ROHS3 Compliant
-
NXP MCF5271CVM150 IC, MPU, 32BIT, COLDFIRE V2, 196BGA
14 Weeks
表面贴装
196-LBGA
YES
97
-40°C~85°C TA
Tray
MCF527x
1997
不用于新设计
3 (168 Hours)
196
5A002.A.1
Tin/Silver/Copper (Sn/Ag/Cu)
ALSO REQUIRES 3.3V SUPPLY
8542.31.00.01
BOTTOM
BALL
260
1.5V
1mm
40
MCF5271
S-PBGA-B196
不合格
1.6V
1.4V
External
150MHz
64K x 8
1.4V~3.6V
MICROPROCESSOR, RISC
Coldfire V2
DMA, WDT
75MHz
ROMless
32-Bit
EBI/EMI, Ethernet, I2C, SPI, UART/USART
32
24
YES
YES
32
固定点
YES
15mm
1.6mm
15mm
ROHS3 Compliant
e1
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NXP MCF5235CVM150 MPU, 32BIT, COLDFIRE V2, 150MHZ, 256MAPB10 Weeks表面贴装256-LBGAYES97-40°C~85°C TATrayMCF523x2004不用于新设计3 (168 Hours)2565A002.A.1Tin/Silver/Copper - with Nickel barrier低功耗模式取自低功耗模式8542.31.00.01BOTTOMBALL2601.5V1mm40MCF5235S-PBGA-B256不合格1.6V1.4VExternal150MHz64K x 81.4V~1.6VMICROPROCESSOR, RISCColdfire V2DMA, WDT75MHzROMless32-BitCANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART3224YESYES32固定点YES17mm1.6mm17mmROHS3 Compliant-
NXP MCF5271CVM150 IC, MPU, 32BIT, COLDFIRE V2, 196BGA14 Weeks表面贴装196-LBGAYES97-40°C~85°C TATrayMCF527x1997不用于新设计3 (168 Hours)1965A002.A.1Tin/Silver/Copper (Sn/Ag/Cu)ALSO REQUIRES 3.3V SUPPLY8542.31.00.01BOTTOMBALL2601.5V1mm40MCF5271S-PBGA-B196不合格1.6V1.4VExternal150MHz64K x 81.4V~3.6VMICROPROCESSOR, RISCColdfire V2DMA, WDT75MHzROMless32-BitEBI/EMI, Ethernet, I2C, SPI, UART/USART3224YESYES32固定点YES15mm1.6mm15mmROHS3 Compliante1
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